Read Sony SCD-X501ES Service Manual online
2
SCD-X501ES
TABLE OF CONTENTS
1.
SERVICING NOTES
...............................................
3
2.
GENERAL
...................................................................
4
3.
DISASSEMBLY
3-1.
Top Plate ..........................................................................
6
3-2.
Loading Panel Assy .........................................................
6
3-3.
Mechanism Deck (CDM66E-DVBU50B) ......................
7
3-4.
Front Panel Assy ..............................................................
7
3-5.
Main Board ......................................................................
8
3-6.
Base Unit (DVBU50B) ....................................................
8
3-7.
WALTZ-RF Board, Service Assy (DBU-3) .....................
9
3-8.
Loading Board .................................................................
9
4.
TEST MODE
.............................................................. 10
5.
ELECTRICAL ADJUSTMENTS
......................... 12
6.
DIAGRAMS
6-1.
Block Diagram – Main Section – .................................... 14
6-2.
Block Diagram – AMP Section – .................................... 15
6-3.
Block Diagram – Display/Power Supply Section – ........ 16
6-4.
Printed Wiring Board – WALTZ-RF Board – .................. 18
6-5.
Schematic Diagram – WALTZ-RF Board – .................... 19
6-6.
Printed Wiring Board – Main Section (1/2) – ................. 20
6-7.
Printed Wiring Boards – Main Section (2/2) – ................ 21
6-8.
Schematic Diagram – Main Section (1/5) – .................... 22
6-9.
Schematic Diagram – Main Section (2/5) – .................... 23
6-10. Schematic Diagram – Main Section (3/5) – .................... 24
6-11. Schematic Diagram – Main Section (4/5) – .................... 25
6-12. Schematic Diagram – Main Section (5/5) – .................... 26
6-13. Printed Wiring Board – Display Board – ........................ 27
6-14. Schematic Diagram – Display Board – ........................... 28
6-15. Printed Wiring Boards – Power Supply Section – ........... 29
6-16. Schematic Diagram – Power Supply Section – ............... 30
6-11. Schematic Diagram – Main Section (4/5) – .................... 25
6-12. Schematic Diagram – Main Section (5/5) – .................... 26
6-13. Printed Wiring Board – Display Board – ........................ 27
6-14. Schematic Diagram – Display Board – ........................... 28
6-15. Printed Wiring Boards – Power Supply Section – ........... 29
6-16. Schematic Diagram – Power Supply Section – ............... 30
7.
EXPLODED VIEWS
7-1.
Main Section .................................................................... 42
7-2.
Front Panel Section ......................................................... 43
7-3.
Main Board Section ......................................................... 44
7-4.
Chassis Section ................................................................ 45
7-5.
Mechanism Deck Section (CDM66E-DVBU50B) ......... 46
7-6.
Optical Pick-up Section (DVBU50B) ............................. 47
8.
ELECTRICAL PARTS LIST
................................ 48
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
This appliance is
classified as a CLASS 1
LASER product. This
marking is located on
the rear exterior.
classified as a CLASS 1
LASER product. This
marking is located on
the rear exterior.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 ˚C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 ˚C.
Caution: The printed pattern (copper foil) may peel away if
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
Click on the first or last page to see other SCD-X501ES service manuals if exist.