SCD-X501ES - Sony Audio Service Manual (repair manual)

Model Name Using Similar Mechanism

SCD-XA1200ES

CD Mechanism Type

CDM66E-DVBU50B

Base Unit Name

DVBU50B

Optical Traverse Unit Name

DBU-3

2007G04-1
© 2007.07

AEP Model

UK Model

Playing frequency range

2 Hz to 100 kHz

Frequency response

2 Hz to 40 kHz (

−3 dB)

Dynamic range

100 dB or more

Total harmonic distortion rate

0.003 % or less

Wow and flutter

Value of measurable limit 
(

±0.001 % W. PEAK) or 

less

Frequency response

2 Hz to 20 kHz

Dynamic range

96 dB or more

Total harmonic distortion rate

0.0035 % or less

Wow and flutter

Value of measurable limit 
(

±0.001 % W. PEAK) or 

less

* Output only the audio signals of the CD

Laser

Semiconductor laser 
(Super Audio CD: 

λ= 650 

nm) (CD: 

λ= 780 nm)

Emission duration: 
continuous

Power requirements

230 V AC, 50/60 Hz

Power consumption

13 W

Dimensions (w/h/d)

(Approx.) 280 

× 111 × 267

mm incl. projecting parts

Mass

(Approx.) 3.9 kg

Audio connecting cord

Red and White 

× 2 (2)

AC power cord (main lead) (1)

Black 

× 1 (2)

Remote commander

RM-ASU002 (1)

Design and specifications are subject to change 
without notice.

ANALOG 
OUT

Phono 
jacks

2 Vrms (at 
50 kilohms)

Over 10 
kilohms

DIGITAL 
(CD) OUT 
OPTICAL*

Square 
optical 
output 
connector

−18 dBm

(Light 
emitting 
wave length: 
660 nm)

DIGITAL 
(CD) OUT 
COAXIAL*

Coaxial 
output 
connector

0.5 Vp-p

75 ohms

2

...............................................

3

...................................................................

4

3-1.

Top Plate ..........................................................................

6

3-2.

Loading Panel Assy .........................................................

6

3-3.

Mechanism Deck (CDM66E-DVBU50B) ......................

7

3-4.

Front Panel Assy ..............................................................

7

3-5.

Main Board ......................................................................

8

3-6.

Base Unit (DVBU50B) ....................................................

8

3-7.

WALTZ-RF Board, Service Assy (DBU-3) .....................

9

3-8.

Loading Board .................................................................

9

.............................................................. 10

......................... 12

6-1.

Block Diagram – Main Section – .................................... 14

6-2.

Block Diagram – AMP Section – .................................... 15

6-3.

Block Diagram – Display/Power Supply Section – ........ 16

6-4.

Printed Wiring Board – WALTZ-RF Board – .................. 18

6-5.

Schematic Diagram – WALTZ-RF Board – .................... 19

6-6.

Printed Wiring Board – Main Section (1/2) – ................. 20

6-7.

Printed Wiring Boards – Main Section (2/2) – ................ 21

6-8.

Schematic Diagram – Main Section (1/5) – .................... 22

6-9.

Schematic Diagram – Main Section (2/5) – .................... 23

6-10. Schematic Diagram – Main Section (3/5) – .................... 24
6-11. Schematic Diagram – Main Section (4/5) – .................... 25
6-12. Schematic Diagram – Main Section (5/5) – .................... 26
6-13. Printed Wiring Board – Display Board – ........................ 27
6-14. Schematic Diagram – Display Board – ........................... 28
6-15. Printed Wiring Boards – Power Supply Section – ........... 29
6-16. Schematic Diagram – Power Supply Section – ............... 30

7-1.

Main Section .................................................................... 42

7-2.

Front Panel Section ......................................................... 43

7-3.

Main Board Section ......................................................... 44

7-4.

Chassis Section ................................................................ 45

7-5.

Mechanism Deck Section (CDM66E-DVBU50B) ......... 46

7-6.

Optical Pick-up Section (DVBU50B) ............................. 47

................................ 48

• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be

damaged by heat.

• Keep the temperature of the soldering iron around 270 ˚C

during repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.

COMPONENTS  IDENTIFIED  BY  MARK  0  OR  DOTTED  LINE
WITH  MARK  0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS  WHOSE
PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  MANUAL  OR
IN  SUPPLEMENTS  PUBLISHED  BY  SONY.

This appliance is 
classified as a CLASS 1 
LASER product. This 
marking is located on 
the rear exterior.

UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.

• Unleaded solder melts at a temperature about 40 ˚C higher

than ordinary solder.

Ordinary soldering irons can be used but the iron tip has to be

applied to the solder joint for a slightly longer time.

Soldering irons using a temperature regulator should be set to

about 350 ˚C.
Caution: The printed pattern (copper foil) may peel away if

the heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscou-s (sticky, less prone to flow)

than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may

also be added to ordinary solder.

3

The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.

CLEANING  OF  OPTICAL  PICK-UP  LENS
In cleaning the lens of optical pick-up, use the air blower.
Never use a cotton swab for cleaning the lens of optical pick-up,
which otherwise causes a trouble.

MODE SETTING FOR SHIPPING
Perform this setting when the EEPROM (IC702) on the MAIN board
is replaced.
Procedure:

1. While pressing the [MENU] button and  

. AMS >

  jog press

the [POWER] button to turn the power on and enter the test
mode and display “DIAG MODE”.

2.  

. AMS >

  jog is turned and “8D” is selected.

3.   

. AMS >

  jog is pressed and “INIT START” is displayed.

4. Then confirm “INITIAL OK” is displayed.
5. Press the [POWER] button to turn the power off.
6. Press the [POWER] button to turn the power on.
7. Press the [MENU] button.
8.  

. AMS >

  jog is turned and “M/2ch SEL” is selected.

9.  

. AMS >

  jog is pressed.

10.  

. AMS >

  jog is turned and “SEL – 2ch” is selected.

11.  

. AMS >

  jog is pressed.

12. Press the [POWER] button to turn the power off.

A

1

 Rotate the cam (66) with a screwdriver 

     in the direction of arrow 

A

.

2

 Pull out the tray in the direction of arrow 

B

.

B

cam (66)

4

This section is extracted from
instruction manual.

Further details are provided on the pages indicated in parentheses.
Instructions in this manual describe the controls on the player. You can also use the controls on the 
remote if they have the same or similar names as those on the player.

A POWER switch (10)

B Disc tray (10)
C x button (10, 16)

D A button (10)

E H button (10, 14, 16)

F X button (10)

G . AMS > dial 

H MENU button (7, 10, 12, 17)

Press to enter the menu.
Press to exit from the menu and return to the 
normal display.

I Display window (12)

J Remote sensor 

A CONTINUE button (16)

Press to resume Continuous Play from Shuffle Play 
or Program Play.

B DISPLAY  ON/OFF button (12)

Press to turn the display information off or on.

C TIME/TEXT button (12)

Each time you press the button, the playing time of 
the track, the remaining time of the disc, or TEXT 
information appears on the display.

D m/M buttons (14)

E LEVEL ADJ button (17)

Press to adjust the output level balance for the 
Multi-channel management function (page 17).

F ENTER button (16, 17)

G A button (10)

H REPEAT button (15)

I SA-CD/CD button (5, 10)

Each time you press the button while playing back 
a hybrid disc, the layer to be played back switches 
between the Super Audio CD layer and the CD 
layer.

J 2CH/MULTI button (5, 10)

Press to select the playback area when a disc with 
the 2 channel area and the multi-channel area 
(page 5) is loaded.

K H button (10, 14, 16)

X button (10)

x button (10, 16)

L AMS ./> buttons 

M CHECK button (16)

Press to check the programed order.

N CLEAR button (16)

Press to delete a programed track number.