SCD-CE595 - Sony Audio Service Manual (repair manual). Page 2

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• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be

damaged by heat.

• Keep the temperature of the soldering iron around 270 °C

during repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.

This appliance is 
classified as a CLASS 1 
LASER product. This 
label is located on the 
rear exterior.

The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.

Carry out the “S curve check” in “CD section adjustment” and check
that the S curve waveform is output three times.

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4-1.

Block Diagram ................................................................

8

4-2.

Printed Wiring Board — RF Section — .........................

9

4-3.

Schematic Diagram — RF Section — ........................... 10

4-4.

Printed Wiring Board — MAIN Section — ................... 11

4-5.

Schematic Diagram — MAIN Section (1/4)  — ............ 12

4-6.

Schematic Diagram — MAIN Section (2/4)  — ............ 13

4-7.

Schematic Diagram — MAIN Section (3/4)  — ............ 14

4-8.

Schematic Diagram — MAIN Section (4/4)  — ............ 15

4-9.

Printed Wiring Board — DISPLAY Section  — ............ 16

4-10. Schematic Diagram — DISPLAY Section — ................ 17
4-11. Printed Wiring Board — MD-94 Board Section  — ...... 18
4-12. Schematic Diagram — MD-94 Board Section — .......... 19

5-1.

Main Section .................................................................... 22

5-2.

Front Panel Section ......................................................... 23

5-3.

Chassis Section ................................................................ 24

5-4.

CD Mechanism Section (1) (CDM79C-DVBU51) ......... 25

5-5.

CD Mechanism Section (2) (CDM79C-DVBU51) ......... 26

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