Read Sony SA-VA100 Service Manual online
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TABLE OF CONTENTS
1. SERVCING NOTE
.............................................................. 3
2. GENERAL
....................................................................
4
3. DISASSEMBLY
3-1.
Amplifier Block .................................................................. 26
3-2.
Mechanism Component Block ........................................... 27
3-3.
CD Mechanism and TC Mechanism Block ........................ 28
4. MECHANICAL ADJUSTMENT
................................... 30
5. ELECTRICAL ADJUSTMENT
..................................... 30
6. DIAGRAMS
6-1.
Circuit Boards Location ..................................................... 38
6-2.
Block Diagrams
• CD Section ....................................................................... 39
• Deck Section .................................................................... 41
• OSD Section ..................................................................... 43
• Surround Amp Section ..................................................... 45
• Display Section ................................................................ 47
• Power Section .................................................................. 48
• CD Section ....................................................................... 39
• Deck Section .................................................................... 41
• OSD Section ..................................................................... 43
• Surround Amp Section ..................................................... 45
• Display Section ................................................................ 47
• Power Section .................................................................. 48
6-3.
Printed Wiring Board — CD Section — ............................ 50
6-4.
Schematic Diagram — CD Section — ............................... 53
6-5.
Schematic Diagram — Deck Section — ............................ 57
6-6.
Printed Wiring Board — Deck Section — ......................... 61
6-7.
Printed Wiring Board — OSD Section — .......................... 64
6-8.
Schematic Diagram — OSD Section — ............................ 67
6-9.
Schematic Diagram — Surround Amp Section — ............. 71
6-10. Printed Wiring Board — Surround Amp Section — .......... 75
6-11. Printed Wiring Board — Display Section — ..................... 79
6-12. Schematic Diagram — Display Section — ........................ 83
6-13. IC Block Diagrams ............................................................. 86
6-14. IC Pin Function
6-11. Printed Wiring Board — Display Section — ..................... 79
6-12. Schematic Diagram — Display Section — ........................ 83
6-13. IC Block Diagrams ............................................................. 86
6-14. IC Pin Function
• IC106 CD System Controller
(µPD78058GC-225-3B9) ................................................ 93
• IC301 Deck System Control (HD6433522P01F) ............ 95
• IC401 Display Control, FL Driver
• IC401 Display Control, FL Driver
(µPD780204GF-020-3BA) .............................................. 97
• IC602 OSD Controller (HD6413004F) ........................... 99
• IC605 OSD (MB90095PF-G-175) ................................ 101
• IC1501 Surround System Control
• IC605 OSD (MB90095PF-G-175) ................................ 101
• IC1501 Surround System Control
(µPD78042FGF-026-3B9) ............................................ 102
7. EXPLODED VIEWS
7-1.
L-ch Speaker System Section ........................................... 104
7-2.
Amplifier Seciton ............................................................. 105
7-3.
R-ch Speaker System Seciton ........................................... 106
7-4.
Mechanism Component Section ....................................... 107
7-5.
TC Mechanism Section 1 (TCM-190RB53C) .................. 108
7-6.
TC Mechanism Section 2 (TCM-190RB53C) .................. 109
7-7.
CD Mechanism Section 1 (CDM-41) ............................... 110
7-8.
CD Mechanism Section 2 (Tray Assembly) (CDM-41) ... 111
7-9.
CD Mechanism Section 3 (R Side Chassis Assembly)
(CDM-41) ......................................................................... 112
(CDM-41) ......................................................................... 112
7-10. CD Mechanism Section 4 (Main Chassis Assembly)
(CDM-41) ......................................................................... 113
7-11. CD Mechanism Section 5 (Drive Unit Assembly)
(CDM-41) ......................................................................... 114
7-12. Rear Speaker System Section (SS-SR151) ...................... 115
8. ELECTRICAL PARTS LIST
........................................ 116
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
other than those specified herein may result in hazardous ra-
diation exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED COMPONENT WARNING !!
COMPONENTS IDENTIFIED BY MARK
!
OR
DOTTED LINE WITH MARK
!
ON THE SCHEMATIC
DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL
TO SAFE OPERATION. REPLACE THESE COMPO-
NENTS WITH SONY PARTS WHOSE PART NUM-
BERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
TO SAFE OPERATION. REPLACE THESE COMPO-
NENTS WITH SONY PARTS WHOSE PART NUM-
BERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
SECTION 1
SERVICING NOTE
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-up
block. Therefore, when checking the laser diode emission, observe
from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-up
block. Therefore, when checking the laser diode emission, observe
from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION CHECK
Carry out the “S curve check” in “CD section adjustment” and check
that the S curve waveform is output four times.
that the S curve waveform is output four times.
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