SA-FW2010, SA-W2010, SS-F2010 - Sony Audio Service Manual (repair manual). Page 3

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

•  Usable with ordinary solder
 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

ADVANCE  PREPARATION  WHEN  CONFIRMING  OP-
ERATION
When the operation of the subwoofer or front speaker is confi rmed, 
it is necessary to connect both these set.
Confi rm the subwoofer and front speaker are prepared beforehand 
when you repair.

NOTE  OF  REPLACING  THE  IC001  ON  THE  MAIN  
BOARD
IC001 on the MAIN board cannot exchange with single. When this 
part on the MAIN board is damaged, exchange the entire mounted 
board.

NOTE  OF  REPLACING  THE  IC501  AND  IC551  ON  
THE  AMP  BOARD  AND  THE  COMPLETE  AMP  BOARD
When IC501 and IC551 on the AMP board and the complete AMP 
board are replaced, it is necessary to spread the compound (OIL 
COMPOUND G777) (Part No. J-2501-335-A) between the AMP 
board and the heat sink.
If the compound is not spread, there is a possibility that IC is dam-
aged.
Spread the compound referring to the fi gure below.

NOTE  OF  CONFIRMING  THE  OPERATION
When confi rming the operation the AMP board removed from the 
set, please reduce as much as possible and confi rm the volume 
level of subwoofer.
There is a possibility that IC is damaged when a big volume level 
is put out with the heat sink not fi xed to the AMP board.

• JIG
  When disassembling the set, use the following jig (for speaker 

removal).

  Part No. J-2501-238-A  JIG FOR SPEAKER REMOVAL