NW-S21, NW-S23 - Sony Audio Service Manual (repair manual). Page 10

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NW-S21/S23
10
10
NW-S21/S23
Note for Printed Wiring Boards and Schematic Diagrams
MAIN and DISPLAY boards are multi-layer printed board.
However, the patterns of intermediate-layer have not been in-
cluded in diagram.
Note on Schematic Diagram:
All capacitors are in 
µ
F unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
All resistors are in 
 and 
1
/
4
 
W or less unless otherwise
specified.
f
: internal component.
• C
: panel designation.
• A
: B+ Line.
Power voltage is dc 1.5 V and fed with regulated dc power
supply from battery teminal.
Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : PLAYBACK
Voltages are taken with a VOM (Input impedance 10 M
).
Voltage variations may be noted due to normal produc-
tion tolerances.
Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
Circled numbers refer to waveforms.
Signal path.
F
: PLAYBACK
J
: USB input from PC
c
: USB output to PC
Note on Printed Wiring Board:
• X
: parts extracted from the component side.
• Y
: parts extracted from the conductor side.
f
: internal component.
z
: Through hole.
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
Parts on the pattern face side seen from
(Conductor Side)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Component Side)
the parts face are indicated.
Lead layout of conventional IC
CSP (chip size package)
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
form that of conventional IC.
Lead Layouts
 *
Replacement of IC400 and IC450 used in this set requires a
special tool.
Waveform
– MAIN Board –
 *
Replacement of IC400 and IC450 used in this set requires a
special tool.
surface
1
IC700 
8
 (OSCOUT)
500 mV/DIV, 10 
µ
s/DIV
30.5 
µ
s
1.2 Vp-p
2
X400
200 mV/DIV, 10 ns/DIV
44.3 ns
1 Vp-p
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