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NW-S202/S202F/S203F/S205F
2
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
For Printed Wiring Boards.
Note:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
• f : internal component.
•
• Y : parts extracted from the conductor side.
• f : internal component.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
• MAIN board is multi-layer printed board.
However, the patterns of intermediate-layer have not been
However, the patterns of intermediate-layer have not been
included in diagram.
• Lead Layouts
For Schematic Diagrams.
Note:
• All capacitors are in µF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics and
50 WV or less are not indicated except for electrolytics and
tantalums.
• All resistors are in Ω and 1/4 Ω or less unless otherwise
specified.
• f : internal component.
• C : panel designation.
• C : panel designation.
• A : B+ Line.
• Power voltage is dc 3.7 V and fed with regulated dc power
• Power voltage is dc 3.7 V and fed with regulated dc power
supply from CN601 pin 1 and pin 2 on the MAIN board.
• Voltages are dc with respect to ground under no-signal
conditions.
no mark: PLAYBACK
• Voltages are taken with a VOM (Input impedance 10 MΩ).
• Voltage variations may be noted due to normal production
• Voltages are taken with a VOM (Input impedance 10 MΩ).
• Voltage variations may be noted due to normal production
tolerances.
• Signal path.
F
F
: AUDIO
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
from that of conventional IC.
from that of conventional IC.
* Replacement of IC101 and IC201 on the MAIN board
used in this set requires a special tool.
* Replacement of IC101 and IC201 on the MAIN board
used in this set requires a special tool.
Caution:
Pattern face side: Parts on the pattern face side seen from
(Side B)
(Side B)
the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Side A)
(Side A)
the parts face are indicated.
surface
Lead layout of conventional IC
CSP (chip size package)
2. DIAGRAMS
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