NAS-SV20DI, NAS-SV20I (serv.man2) - Sony Audio Service Manual (repair manual). Page 2

  .............................................   2

2-1.  Disassembly  Flow ...........................................................  

6

2-2.  Rear Panel Block ............................................................   6
2-3.  MAIN Board Block ........................................................   7
2-4.  MAIN Board, Module (DAB Tuner) (DAB1) ................   7
2-5.  MOTHER Board Block ..................................................   8
2-6.  MOTHER  Board .............................................................  

8

2-7.  Speaker  Box Assy ...........................................................  

9

2-8.  Loudspeaker (6.5 cm) (SP1/SP2) ....................................   10
2-9.  LCD Board Block ...........................................................   11

TEST  MODE 

 ............................................................   12

4-1.  Block  Diagram ................................................................   23
4-2.  Printed Wiring Board - MAIN Board - ...........................   25
4-3.  Schematic Diagram - MAIN Board (1/2) - .....................   26
4-4.  Schematic Diagram - MAIN Board (2/2) - .....................   27
4-5.  Printed Wiring Boards - PANEL Section - .....................   28
4-6.  Schematic Diagram - PANEL Section - ..........................   29

5-1.  Rear Panel Section ..........................................................   33
5-2.  Main  Section ...................................................................   34
5-3. 

Speaker  Section ...............................................................   35

5-4.  Front Panel Section .........................................................   36

   ..............................   37

Accessories are given in the last of the electrical parts list.

NOTES  ON  CHIP  COMPONENT  REPLACEMENT
• 

Never reuse a disconnected chip component.

• 

Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.

FLEXIBLE  CIRCUIT  BOARD  REPAIRING
• 

Keep the temperature of soldering iron around 270 °C during 
repairing.

• 

Do not touch the soldering iron on the same conductor of the 
circuit board (within 3 times).

• 

Be careful not to apply force on the conductor when soldering 
or unsoldering.

COMPONENTS  IDENTIFIED  BY  MARK  0  OR  DOTTED  LINE  
WITH  MARK  0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 

LES  COMPOSANTS  IDENTIFIÉS  PAR  UNE  MARQUE  0  SUR  
LES  DIAGRAMMES  SCHÉMATIQUES  ET  LA  LISTE  DES  
PIÈCES  SONT  CRITIQUES  POUR  LA  SÉCURITÉ  DE  FONC-
TIONNEMENT.  NE  REMPLACER  CES  COMPOSANTS  QUE  
PAR  DES  PIÈCES  SONY  DONT  LES  NUMÉROS  SONT  DON-
NÉS  DANS  CE  MANUEL  OU  DANS  LES  SUPPLÉMENTS  
PUBLIÉS  PAR  SONY.

NOTE  OF  REPLACING  THE  CN103  CN104,  IC103,  
IC107,  L251  AND  L254  ON  THE  MAIN  BOARD
CN103 CN104, IC103, IC107, L251 and L254 on the MAIN board 
cannot exchange with single. When these parts are damaged, ex-
change the entire mounted board.

NOTE  OF  REPAIRING  THE  TOUCH  KEY  BOARD
The mount parts on the TOUCH KEY board installed in this set 
cannot exchange with single. When the TOUCH KEY board is de-
fective, exchange the entire FRONT PANEL ASSY.

NOTE  OF  REPAIRING  THE  MOTHER  BOARD
The mount parts on the MOTHER board installed in this set cannot 
exchange with single excluding a part of parts. When the mount 
parts that have not been described in electrical parts list are dam-
aged, exchange the entire mounted board.

NOTE  OF  REPLACING  THE  MOTHER  BOARD
When replacing the MOTHER board, MAC address is changed. 
Print the following explanation, cut it, and hand over it to the cus-
tomer with the set, when returning the set that the repair is com-
pleted to the customer.

MAC address of the main unit has been changed by this repair.
When using the MAC address fi ltering function of connection destina-
tion access point equipment, set it again.

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• 

Strong viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

• 

Usable with ordinary solder

 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.