MHC-V7D - Sony Audio Service Manual (repair manual). Page 4

Notes on chip component replacement
•  Never reuse a disconnected chip component.
•  Notice that the minus side of a tantalum capacitor may be
 

damaged by heat.

Flexible Circuit Board Repairing
•  Keep the temperature of the soldering iron around 270 °C
 during 

repairing.

•  Do not touch the soldering iron on the same conductor of the
 

circuit board (within 3 times).

•  Be careful not to apply force on the conductor when soldering
 or 

unsoldering.

UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the 
leadfree mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with
 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher
 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be

 

applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to

 

about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
 

the heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow)

 

than ordinary solder so use caution not to let solder bridges

 

occur such as on IC pins, etc.

•  Usable with ordinary solder
 

It is best to use only unleaded solder but unleaded solder may

 

also be added to ordinary solder.

CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radiation
exposure.

The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.

NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.

This appliance is classifi ed as a 
CLASS 1 LASER product by 
IEC60825-1:2007. This marking 
is located on the rear exterior.

AEP

4-566-331-0[]

UK

4-567-170-0[]

RU

4-567-171-0[]

E4

4-567-172-0[]

MY

4-567-173-0[]

AUS

4-567-174-0[]

TH

4-567-175-0[]

LA9

4-567-177-0[]

AR

4-567-179-0[]

E93

4-567-181-0[]

• Abbreviation
 AR  : 

Argentina 

model

 AUS  : Australian 

model

 E4 

: African 

model

  E93 

: 240 V AC area in E model

 LA9  : 

Latin-American 

model

 MY  : 

Malaysia 

model

 RU  : 

Russian 

model

 TH 

: 

Thai 

model