MHC-V7D - Sony Audio Service Manual (repair manual)

2015F80-1

© 

2015.06

DVD
Section

Model Name Using Similar Mechanism

HCD-GPX555/GPX888

DVD Mechanism Type

CDM90-DVBU204//C

Optical Pick-up Name

CMS-S76RFS7G1 OR CMS-S76RFS7GP

– Continued on next page –

Amplifi er section
The following are measured at
 

AC 120 V – 240 V, 50/60 Hz

Power output (rated)
 

Left/Right Channel: 400 W + 400 W

 

(per channel at 4 ohms, 1 kHz, 1% THD)

RMS output power (reference)
 

Left/Right Channel: 720 W + 720 W

 

(per channel at 4 ohms, 1 kHz)

Speaker section
Speaker system:
 

Tweeter + Mid range speaker + Woofer

Tweeter L/R: 40 mm cone type
Mid L/R: 120 mm cone type
Woofer: 250 mm cone type

Inputs
AUDIO IN 1/PARTY CHAIN IN L/R
 

Voltage 2 V, impedance 47 kilohms

AUDIO IN 2 L/R
 

Voltage 2 V, impedance 47 kilohms

MIC 1, MIC 2
 

Sensitivity 1 mV, impedance 10 kilohms

(USB) 1, 

 (USB) 2 port:

 Type 

A

Outputs
AUDIO OUT/PARTY CHAIN OUT L/R
 

Voltage 2 V, impedance 1 kilohm

VIDEO OUT
 

 Max. output level 1 Vp-p, unbalanced, 
Sync. negative load impedance 75 ohms

USB section
Supported bit rate
 

WMA: 48 kbps – 192 kbps, VBR, CBR

 

AAC: 48 kbps – 320 kbps, VBR, CBR

Sampling frequencies
 

WMA: 44.1 kHz

 

AAC: 44.1 kHz

Supported USB device
 

Mass Storage Class

Maximum current
 1 

A

Disc/USB section
Supported bit rate
 MPEG1 

Layer-3:

 

32 kbps – 320 kbps, VBR

Sampling frequencies
 MPEG1 

Layer-3:

 

32 kHz/44.1 kHz/48 kHz

Xvid
 

Video codec: Xvid

 

Bit rate: 4.854 Mbps (MAX)

 Resolution/Frame 

rate:

 

720 × 480, 30 fps

 

720 × 576, 25 fps

 

Audio codec: MP3

MPEG4
 

File format: MP4 File Format

 Video 

codec:

 

MPEG4 Simple Profi le

 

(AVC is not compatible.)

 

Bit rate: 4 Mbps

 Resolution/Frame 

rate:

 

720 × 576, 30 fps

 Audio 

codec: 

AAC-LC

 

(HE-AAC is not compatible.)

 

DRM: Not compatible

Disc player section
System
 

Compact disc and digital audio and

 video 

system

Laser Diode Properties
 

Emission Duration: Continuous

 

Laser Output*: Less than 44.6 μW

 

*  This output is the value measure-

ment at a distance of 200 mm from 
the objective lens surface on the 
Optical Pick-up Block with 7 mm 
aperture.

Frequency response
 

20 Hz – 20 kHz

Video color system format
 

NTSC and PAL

Tuner section
FM stereo, FM superheterodyne tuner
Antenna
 

FM lead antenna

Tuning range
 

87.5 MHz – 108.0 MHz (50 kHz step)

BLUETOOTH section
Communication system
 

BLUETOOTH Standard version 3.0

Output
 

BLUETOOTH Standard Power Class 2

Maximum communication range
 

Line of sight approx. 10 m

1)

Frequency band
 

2.4 GHz band (2.4000 GHz – 

 2.4835 

GHz)

Modulation method
 

FHSS (Freq Hopping Spread Spectrum)

Compatible BLUETOOTH profiles

2)

 

A2DP (Advanced Audio Distribution 

 Profile)
 

AVRCP (Audio Video Remote 

 Control 

Profile)

 

SPP (Serial Port Profile)

Supported codecs
 

SBC (Sub Band Codec)

 

AAC (Advanced Audio Coding)

1)

 The actual range will vary depending on 

factors such as obstacles between devices, 
magnetic fields around a microwave oven, 
static electricity, reception sensitivity, 
antenna’s performance, operating system, 
software application, etc.

2)

  BLUETOOTH standard profiles 

indicate the purpose of BLUETOOTH 
communication between devices.

General
Power requirements
 

AC 120 V – 240 V, 50/60 Hz

Power consumption
 220 

W

Power consumption (at the Power Saving
mode)
 

0.5 W (When “BT STBY” is set to

 “OFF”)
 

4 W (When “BT STBY” is set to

 “ON”)
Dimensions (w/h/d) (Approx.)
 

340 mm × 924 mm × 320 mm

Mass (Approx.)
 19 

kg

Supplied accessories
•  Remote control (1)
•  R03 (size AAA) batteries (2)
•  FM lead antenna (1)
•  AC power cord (mains lead) (1)
•   AC plug adaptor (1) (supplied only for 

certain areas)

 

 The AC plug adaptor is not use in Chile. Use 
this plug adaptor in the countries where it is 
necessary.

Design and specifications are subject to 
change without notice.

0 OR  DOTTED  LINE  

0 ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  

SAFETY  CHECK-OUT
After correcting the original service problem, perform the following 
safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, 
screws, and all other exposed metal parts for AC leakage. Check 
leakage as described below.

LEAKAGE  TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes).
Leakage current can be measured by any one of three methods.
1.  A commercial leakage tester, such as the Simpson 229 or RCA
 

WT-540A. Follow the manufacturers’ instructions to use these

 instruments.
2.  A battery-operated AC milliammeter. The Data Precision 245
 

digital multimeter is suitable for this job.

3.  Measuring the voltage drop across a resistor by means of a
 

VOM or battery-operated AC voltmeter. The “limit” indication

 

is 0.75 V, so analog meters must have an accurate low-voltage

 

scale. The Simpson 250 and Sanwa SH-63Trd are examples

 

of a passive VOM that is suitable. Nearly all battery operated

 

digital multimeters that have a 2V AC range are suitable. (See

 Fig. 

A)

•  

 is a trademark of DVD Format/Logo Licensing Corporation.

•  

“DVD+RW”, “DVD-RW”, “DVD+R”, “DVD-R”, “DVD VIDEO”, and 
the “CD” logos are trademarks.

•   MPEG Layer-3 audio coding technology and patents licensed from 

Fraunhofer IIS and Thomson.

•   

Windows Media is either a registered trademark or trademark of 
Microsoft Corporation in the United States and/or other countries.

•   This product is protected by certain intellectual property rights of 

Microsoft Corporation. Use or distribution of such technology outside 
of this product is prohibited without a license from Microsoft or an 
authorized Microsoft subsidiary.

•   “WALKMAN” and “WALKMAN” logo are registered trademarks of 

Sony Corporation.

•  This system incorporates Dolby* Digital.
  

* 

Manufactured under license from Dolby Laboratories.

   

Dolby and the double-D symbol are trademarks of Dolby 
Laboratories.

•  

The 

BLUETOOTH

®

 word mark and logos are registered trademarks 

owned by Bluetooth SIG, Inc. and any use of such marks by Sony 
Corporation is under license. Other trademarks and trade names are 
those of their respective owners.

•   The N Mark is a trademark or registered trademark of NFC Forum, 

Inc. in the United States and in other countries.

•  Android™ is a trademark of Google Inc.

•  Google Play™ is a trademark of Google Inc.

•   Apple, the Apple logo, iPhone, and iPod touch are trademarks of 

Apple Inc., registered in the U.S. and other countries. App Store 
is a service mark of Apple Inc.

•   “Made for iPod” and “Made for iPhone” mean that an electronic 

accessory has been designed to connect specifically to iPod or 
iPhone, respectively, and has been certified by the developer to 
meet Apple performance standards. Apple is not responsible for 
the operation of this device or its compliance with safety and 
regulatory standards. Please note that the use of this accessory 
with iPod or iPhone may affect wireless performance.

•   THIS PRODUCT IS LICENSED UNDER THE MPEG-4 VISUAL 

PATENT PORTFOLIO LICENSE FOR THE PERSONAL AND 
NON-COMMERCIAL USE OF A CONSUMER FOR

  (i)  ENCODING VIDEO IN COMPLIANCE WITH THE MPEG-4 

VISUAL STANDARD (“MPEG-4 VIDEO”)

 AND/OR

  (ii) 

 

DECODING MPEG-4 VIDEO THAT WAS ENCODED BY 
A CONSUMER ENGAGED IN A PERSONAL AND NON-
COMMERCIAL ACTIVITY AND/OR WAS OBTAINED FROM 
A VIDEO PROVIDER LICENSED TO PROVIDE MPEG-4 
VIDEO.

   NO LICENSE IS GRANTED OR SHALL BE IMPLIED FOR ANY 

OTHER USE. ADDITIONAL INFORMATION INCLUDING THAT 
RELATING TO PROMOTIONAL, INTERNAL AND COMMER-
CIAL USES AND LICENSING MAY BE OBTAINED FROM MPEG 
LA, L.L.C.

 HTTP://WWW.MPEGLA.COM

•   All other trademarks are trademarks of their respective owners.
•   In this manual, ™ and ® marks are not specified.

•

 Abbreviation

 AR 

: 

Argentina 

model

 AUS  : 

Australian 

model

 E4 

: 

African 

model

  E93 

: 240 V AC area in E model

 LA9  : 

Latin-American 

model

 MY 

: 

Malaysia 

model

 RU 

: 

Russian 

model

 TH 

: 

Thai 

model

  .............................................   4

2-1.   Disassembly Flow ...........................................................   9
2-2.   Side Case L, R ................................................................   10
2-3.   Top Panel Block ..............................................................   10
2-4.   Panel Loading Block .......................................................   11
2-5.   Back Panel Block ............................................................   12
2-6.   CDM Block .....................................................................   13
2-7.   MOTHERBOARD Board, 2CH DAMP Board ..............   14
2-8.   REGULATOR, SWITCHING (SSN-152AD) ................   15
2-9.   Front Panel Block ...........................................................   16
2-10.  Loudspeaker (25cm) (Woofer) (SP5) ..............................   17
2-11.  Loudspeaker (12cm) (Mid: L-CH) (SP1), 

Loudspeaker (12cm) (Mid: R-CH) (SP3) .......................   18

2-12.  Service, Optical Device (7G), Flexible Flat Cable .........   19

TEST  MODE 

 ............................................................   20

ELECTRICAL  CHECK 

 .........................................   25

5. TROUBLESHOOTING 

 ..........................................   27

6-1.  Block Diagram - RS SERVO, USB Section - .................   33
6-2.  Block Diagram - MAIN Section - ...................................   34
6-3.  Block Diagram - AMP Section - .....................................   35
6-4. Block 

Diagram

 

- PANEL, POWER SUPPLY Section - ...........................   36

6-5. Printed 

Wiring 

Board 

 

- MOTHERBOARD Board (Component Side) - ............   38

6-6. Printed 

Wiring 

Board

 

- MOTHERBOARD Board (Conductor Side) - .............   39

6-7. Schematic 

Diagram

 

- MOTHERBOARD Board (1/8) - .................................   40

6-8. Schematic 

Diagram

 

- MOTHERBOARD Board (2/8) - .................................   41

6-9. Schematic 

Diagram

 

- MOTHERBOARD Board (3/8) - .................................   42

6-10. Schematic Diagram
 

- MOTHERBOARD Board (4/8) - .................................   43

6-11. Schematic Diagram
 

- MOTHERBOARD Board (5/8) - .................................   44

6-12. Schematic Diagram
 

- MOTHERBOARD Board (6/8) - .................................   45

6-13. Schematic Diagram
 

- MOTHERBOARD Board (7/8) - .................................   46

6-14. Schematic Diagram
 

- MOTHERBOARD Board (8/8) - .................................   47

6-15.  Printed Wiring Board - 2CH DAMP Board - ..................   48
6-16.  Schematic Diagram - 2CH DAMP Board - ....................   49
6-17.  Printed Wiring Board -

STR Board - ..............................   50

6-18.  Schematic Diagram -

STR Board - .................................   51

6-19.  Printed Wiring Board - GESTURE Board - ....................   52
6-20.  Schematic Diagram -

GESTURE Board - ......................   53

6-21.  Printed Wiring Board -

GESTURE LED Board - ...........   54

6-22.  Schematic Diagram -

GESTURE LED Board - .............   54

6-23.  Printed Wiring Board -

LCD Board - .............................   55

6-24.  Schematic Diagram -

LCD Board - ................................   56

6-25.  Printed Wiring Board -

MIC Board - ..............................   57

6-26.  Schematic Diagram -

MIC Board - .................................   58

6-27.  Printed Wiring Board -

IR Board - .................................   58

6-28.  Schematic Diagram -

IR Board - ....................................   58

6-29.  Printed Wiring Board -

PARTY LED Board - ................   59

6-30.  Schematic Diagram -

PARTY LED Board - ...................   59

6-31.  Printed Wiring Board -

SPK PARTY LED Board - ........   59

6-32.  Schematic Diagram -

SPK PARTY LED Board - ...........   59

6-33.  Printed Wiring Board -

SPK LED Board - .....................   60

6-34.  Schematic Diagram -

SPK LED Board - ........................   60

7-1.  Side Panel Section ..........................................................   74
7-2.  Panel Loading Section ....................................................   75
7-3.  Back Panel Section .........................................................   76
7-4.  MOTHERBOARD Board Section ..................................   77
7-5. Chassis 

Section 

...............................................................  78

7-6.  Front Panel Section .........................................................   79
7-7.  Speaker Cabinet Section .................................................   80
7-8.  Top Panel Section ...........................................................   81
7-9.  RV MODULE Section ....................................................   82
7-10.  CDM BLOCK Section ....................................................   83
7-11.  DVD Mechanism Section

(CDM90-DVBU204//C) .................................................   84

  ..............................   85

Accessories are given in the last of the electrical parts list.

Notes on chip component replacement
•  Never reuse a disconnected chip component.
•  Notice that the minus side of a tantalum capacitor may be
 

damaged by heat.

Flexible Circuit Board Repairing
•  Keep the temperature of the soldering iron around 270 °C
 during 

repairing.

•  Do not touch the soldering iron on the same conductor of the
 

circuit board (within 3 times).

•  Be careful not to apply force on the conductor when soldering
 or 

unsoldering.

UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the 
leadfree mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with
 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher
 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be

 

applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to

 

about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
 

the heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow)

 

than ordinary solder so use caution not to let solder bridges

 

occur such as on IC pins, etc.

•  Usable with ordinary solder
 

It is best to use only unleaded solder but unleaded solder may

 

also be added to ordinary solder.

CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radiation
exposure.

The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.

NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.

This appliance is classifi ed as a 
CLASS 1 LASER product by 
IEC60825-1:2007. This marking 
is located on the rear exterior.

AEP

4-566-331-0[]

UK

4-567-170-0[]

RU

4-567-171-0[]

E4

4-567-172-0[]

MY

4-567-173-0[]

AUS

4-567-174-0[]

TH

4-567-175-0[]

LA9

4-567-177-0[]

AR

4-567-179-0[]

E93

4-567-181-0[]

• Abbreviation
 AR  : 

Argentina 

model

 AUS  : Australian 

model

 E4 

: African 

model

  E93 

: 240 V AC area in E model

 LA9  : 

Latin-American 

model

 MY  : 

Malaysia 

model

 RU  : 

Russian 

model

 TH 

: 

Thai 

model