MHC-V6D - Sony Audio Service Manual (repair manual). Page 4

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

• 

Usable with ordinary solder

 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by 
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.

NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.

NOTE  OF  REPLACING  THE  MS-476  BOARD
When the MS-476 board is defective, replace the CDM90 ASSY 
(Ref. No. CDM1).

NOTE  OF  REPLACING  THE  IC001,  IC002,  IC105,  IC106,  
IC301 AND  IC302  ON  THE  ARAGON  BOARD
IC001, IC002, IC105, IC106, IC301 and IC302 on the ARAGON 
board cannot replace with single. When these parts are damaged, 
replace the complete mounted board.

NOTE  OF  PERFORMING  THE  OPERATION  CHECK  IN  
THE  STATE  THAT  HEAT  SINK  WAS  REMOVED
When performing the operation check in the state that this unit was 
disassembled, it is possible to perform the operation check in the 
state that heat sink was removed. But don’t perform the operation 
check in the long time, and perform the operation check in the 
volume state as low as possible.

TEST  DISCS
Use following TEST DISC when this unit confi rms the operation 
and checks it.

• For 

CD

Part No.

   

Description

3-702-101-01 DISC 

(YEDS-18), 

TEST

4-225-203-01 DISC 

(PATD-012), 

TEST

J-2501-307-A DISC 

(HLX-A1), 

TEST

• 

For DVD SL (Single Layer)

Part No.

   

Description

J-6090-069-A 

DISC (HLX-503), TEST (NTSC)

J-6090-088-A 

DISC (HLX-504), TEST (NTSC)

J-6090-077-A 

DISC (HLX-506), TEST (PAL)

• 

For DVD DL (Double Layer)

Part No.

   

Description

J-6090-071-A 

DISC (HLX-501), TEST (NTSC)

J-6090-089-A 

DISC (HLX-505), TEST (NTSC)

J-6090-078-A 

DISC (HLX-507), TEST (PAL)

RELEASING  THE  DISC  TRAY  LOCK
The disc tray lock function for the antitheft of sample disc in the 
shop is equipped.
Disc tray lock function can be released by the following procedure.

Releasing Procedure:
1.  Press the [

?/1

] button to turn the power on.

2.  Press the [FUNCTION] button to turn the DVD/CD function.
3.  Press two buttons of the [

x] and [ENTER] simultaneously for 

three seconds.

4.  The message “UNLOCKED” is displayed on the fl uorescent 

indicator tube and the disc tray is unlocked.

Note: When “LOCKED” is displayed, the disc tray lock is not released by 

turning power on/off with the [

?/1] button.

NEW/FORMER  DISCRIMINATION  OF  D-AMP  AND  SPEAK-
ER  LED  BOARDS
D-AMP and SPEAKER LED boards have been changed in the 
midway of production.
Distinguish by the part number of the silk print.