MHC-RG444S (serv.man2) - Sony Audio Service Manual (repair manual). Page 3

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3-2. Porta do CD····································································· 8
3-3. Seção Painel Frontal ······················································· 9
3-4. Mecanismo do CD (CDM74-K6BD80) ························· 9
3-5. Mecanismo do Tape Deck, Placa GAME JACK ········· 10
3-6. Placa PAINEL ······························································ 10
3-7. Seção PAINEL TRASEIRO, Placa SUB-TRANS  ······ 11
3-8. Transformador de Força················································ 11
3-9. Placa PRINCIPAL ······················································· 12
3-10. Placa SUB WOOFER················································· 12
3-11. Placa AMP  ································································· 13
3-12. Placa BD80A  ····························································· 13
3-13. Placa CONNECT  ······················································· 14
3-14. Placa DRIVER , Placa SW  ········································ 14
3-15. Unidade Ótica (KSM-213DCP/Z-NP) ····················· 15
3-16. Placa SENSOR  ·························································· 15
3-17. Placa MOTOR (TB)  ··················································· 16
3-18. Placa MOTOR (LD)  ·················································· 16

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5-1. Diagramas em Blocos – Seção PAINEL  – ···.··············· 21
5-2. Diagramas em Blocos– Seção PRINCIPAL – ·············· 22

5-3. Diagramas em Blocos– Seção BD/DRIVER  – ··········· 23

5-4. Diagramas em Blocos– Seção SUB WOOFER  – ········ 24
5-5. Placa de Circuito Impresso – Seção BD80A  –············· 25
5-6. Diagrama Esquemático – Seção BD80A Section – ······ 26
5-7. Placa de Circuito Impresso – Seção MECANISMO DO CD – ·...... 27
5-8. Diagrama Esquemático – Seção MECANISMO DO CD – ···· 28
5-9. Placa de Circuito Impresso – Seção PRINCIPAL – ········ 29
5-10. Diagrama Esquemático – Seção PRINCIPAL (1/2) – ········ 30
5-11. Diagrama Esquemático – Seção PRINCIPAL (2/2) – ········ 31
5-12. Placa de Circuito Impresso – Seção PAINEL COMB – ······· 32
5-13. Diagrama Esquemático – Seção PAINEL COMB – ······· 33
5-14. Placa de Circuito Impresso – Seção SUB WOOFER – ··········· 37
5-15. Diagrama Esquemático – Seção SUB WOOFER – ··········· 38

5-19. Placa de Circuito Impresso

– SeçãoTRANS  ··············································· ··········· 39

5-21. Placa de Circuito Impresso

– Seção AMP  ······························································ 41

5-22. Diagrama Esquemático – Seção AMP POWER  – ········· 42

Descrição do Pino de IC ············································· 43

6-1. Seção PRINCIPAL ························································ 51
6-2. Seção Painel Frontal ······················································ 52
6-3. Seção Placa Principal ···················································· 54
6-4. Mecanismo do CD Seção -1 (CDM74-K6BD80) ········· 55
6-4. Mecanismo do CD Seção -2 (CDM74-K6BD80) ········· 56

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O uso dos controles, ajustes ou execução de procedimentos
que não sejam os descritos nesse manual, podem causar exposição
a uma perigosa radiação.

• Nunca reutilize um componente tipo chip.
• Informamos que os capacitores eletrolíticos de tântalo podem

ser danificados se expostos a altas temperaturas.

• Mantenha a temperatura do ferro de solda por volta de 270˚C

durante o reparo.

• Não ressolde componentes em um mesmo ponto da placa mais

de três vezes.

• Tenha cuidado para não forçar os condutores (trilhas) da placa

durante o processo de soldagem e dessoldagem.

O diodo laser da unidade óptica é sensível a descargas eletroestáticas
podendo ser danificado por descargas causadas por roupas ou mes-
mo pelo corpo humano. Durante o reparo tenha cuidado para não
causar danos a unidade, devido a descargas eletroestáticas e siga
corretamente os procedimentos descritos nesse manual para a exe-
cução de reparos e troca de componentes.
A placa flexível é  facilmente danificadas, tenha muito cuidado 
para manuseá-las.

O feixe laser nesse modelo é concentrado e deve ser focado na super-
fície reflexiva do disco, pela lente objetiva da unidade óptica. Quan-
do observar a emissão do diodo laser, tome o cuidado de estar

no mínimo a 30 cm da lente objetiva.

3-1. Tampa Superior ······························································ 8

5-20. Diagrama Esquemático – Seção TRANS – ················ 40

5-18. Diagrama Esquemático – Seção PAINEL (2/2) – ······ 38

5-17. Diagrama Esquemático – Seção PAINEL (1/2) – ······ 37

5-16. Placa de Circuito Impresso – Seção PAINEL –··············· 36

SS-RG444 ··········································································· 72
SS-WG450 ········································································· 73