MHC-RG222 (serv.man2) - Sony Audio Service Manual (repair manual). Page 3

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3-1. Tampa Superior ······························································· 8
3-2. Porta do CD······································································ 8
3-3. Seção Painel Frontal ························································ 9
3-4. Mecanismo do CD (CDM74-F1BD81) ··························· 9
3-5. Mecanismo do Tape Deck, Placa GAME JACK ··············· 10
3-6. Placa PAINEL ······························································· 10
3-7. Seção PAINEL TRASEIRO, Placa SUB-TRANS  ········· 11
3-8. Transformador de Força················································· 11
3-9. Placa PRINCIPAL ························································ 12
3-10. Placa AMP  ································································· 12
3-11. Placa BD81A  ····························································· 13
3-12. Placa CONNECT  ······················································· 13
3-13. Placa DRIVER , Placa SW  ········································ 14
3-14. Unidade Ótica (KSM-215DCP/C2NP) ····················· 14
3-15. Placa SENSOR  ·························································· 15
3-16. Placa MOTOR (TB)  ··················································· 15
3-17. Placa MOTOR (LD)  ·················································· 16

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5-1. Diagramas em Blocos – Seção PAINEL  – ···.··············· 22

– Seção PRINCIPAL – ················································ 23
– Seção BD/DRIVER  – ············································ 24

5-2. Placa de Circuito Impresso – Seção BD81A  – ············· 25
5-3. Diagrama Esquemático – Seção BD81A Section – ·········· 26
5-4. Placa de Circuito Impresso – Seção MECANISMO DO CD – ·...... 27
5-5. Diagrama Esquemático – Seção MECANISMO DO CD – ···· 28
5-6. Placa de Circuito Impresso – Seção PRINCIPAL – ········ 29
5-7. Diagrama Esquemático – Seção PRINCIPAL (1/2) – ········ 30
5-8. Diagrama Esquemático – Seção PRINCIPAL (2/2) – ········ 31
5-9. Placa de Circuito Impresso – Seção PAINEL COMB – ······· 32
5-10. Diagrama Esquemático – Seção PAINEL COMB – ······· 33
5-11. Placa de Circuito Impresso – Seção PAINEL – ··············· 34
5-12. Diagrama Esquemático – Seção PAINEL (1/2) – ··········· 35
5-13. Diagrama Esquemático – Seção PAINEL (2/2) – ··········· 36

5-15. Placa de Circuito Impresso

– SeçãoTRANS  ··············································· ··········· 38

5-17. Placa de Circuito Impresso

– Seção AMP  ······························································ 40

5-18. Diagrama Esquemático – AMP POWER Section – ········· 41
5-19. Descrição do Pino de IC ············································· 44

6-1. Seção PRINCIPAL ························································ 49
6-2. Seção Painel Frontal ······················································ 50
6-3. Seção Placa Principal ···················································· 51
6-4. Mecanismo do CD Seção -1 (CDM74-F1BD81) ·········· 52
6-4. Mecanismo do CD Seção -2 (CDM74-F1BD81) ·········· 53

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O uso dos controles, ajustes ou execução de procedimentos
que não sejam os descritos nesse manual, podem causar exposição
a uma perigosa radiação.

• Nunca reutilize um componente tipo chip.
• Informamos que os capacitores eletrolíticos de tântalo podem

ser danificados se expostos a altas temperaturas.

• Mantenha a temperatura do ferro de solda por volta de 270˚C

durante o reparo.

• Não ressolde componentes em um mesmo ponto da placa mais

de três vezes.

• Tenha cuidado para não forçar os condutores (trilhas) da placa

durante o processo de soldagem e dessoldagem.

O diodo laser da unidade óptica é sensível a descargas eletroestáticas
podendo ser danificado por descargas causadas por roupas ou mes-
mo pelo corpo humano. Durante o reparo tenha cuidado para não
causar danos a unidade, devido a descargas eletroestáticas e siga
corretamente os procedimentos descritos nesse manual para a exe-
cução de reparos e troca de componentes.
A placa flexível é  facilmente danificadas, tenha muito cuidado 
para manuseá-las.

O feixe laser nesse modelo é concentrado e deve ser focado na super-
fície reflexiva do disco, pela lente objetiva da unidade óptica. Quan-
do observar a emissão do diodo laser, tome o cuidado de estar

no mínimo a 30 cm da lente objetiva.