MDS-JA555ES - Sony Audio Service Manual (repair manual). Page 3

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3
This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
The following caution label is located inside the unit.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
MODEL IDENTIFICATION
— BACK PANEL —
Parts No.
4-220-300-1
 : AEP, UK model
4-220-300-2
 : US model
4-220-300-3
 : Canadian model
TABLE OF CONTENTS
1. SERVICING NOTE
·························································· 6
2. GENERAL
········································································ 12
3. DISASSEMBLY
3-1.
Case ·················································································· 14
3-2.
Loading Panel ··································································· 14
3-3.
Front Panel Assembly ······················································· 15
3-4.
MD Mechanism Deck ······················································ 15
3-5.
Tray Assembly ·································································· 16
3-6.
BU Holder Assembly ························································ 17
3-7.
Motor (Loading) Assembly (M10) ··································· 17
3-8.
Base Unit (MBU-5C) ······················································· 18
3-9.
BD Board ·········································································· 18
3-10. Over Light Head (HP901) ················································ 19
3-11. Mini Disc Device (KMS-260B/JN) ·································· 19
4. TEST MODE
···································································· 20
5. ELECTRICAL ADJUSTMENTS
······························· 25
6. DIAGRAMS
6-1.
Block Diagrams
BD Section ······································································· 34
MAIN Section ·································································· 35
Display/Power Supply Section ········································· 36
6-2.
Circuit Boards Location ··················································· 37
6-3.
Printed Wiring Board    BD Section ································· 38
6-4.
Schematic Diagram    BD (2/1) Section ··························· 39
6-5.
Schematic Diagram    BD (2/1) Section ··························· 40
6-6.
Schematic Diagram    BD Switch Section ························ 41
6-7.
Printed Wiring Board    BD Switch Section ····················· 41
6-8.
Printed Wiring Board    AD Section ································· 42
6-9.
Schematic Diagram    AD (2/1) Section ··························· 43
6-10. Schematic Diagram    AD (2/1) Section ··························· 44
6-11. Schematic Diagram    DA (2/1) Section ··························· 45
6-12. Printed Wiring Board    DA Section ································· 48
6-13. Schematic Diagram    DA (2/1) Section ··························· 47
6-14. Printed Wiring Board    Digital Section ··························· 48
6-15. Schematic Diagram     Digital Section ····························· 50
6-16. Printed Wiring Board    AC Section ································· 51
6-17. Schematic Diagram     Power Section ······························ 52
6-18. Printed Wiring Board    Power Section ···························· 53
6-19. Printed Wiring Board    Panel Section ······························ 54
6-20. Schematic Diagram    Panel Section ································ 55
6-21. IC Block Diagrams ··························································· 57
6-22. IC Pin Functions ······························································· 62
7. EXPLODED VIEWS
7-1.
Upper Case Assembly ······················································ 71
7-2.
Front Panel Assembly ······················································· 72
7-3.
Chassis Assembly ····························································· 73
7-4.
Mechanism Deck Assembly-1 (MDM-6A) ······················ 74
7-5.
Mechanism Deck Assembly-2 (MDM-6A) ······················ 75
7-6.
Base Unit (MBU-5C) ······················································· 76
8. ELECTRICAL PARTS LIST
······································· 77
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