ICF-C717PJ - Sony Audio Service Manual (repair manual). Page 2

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ICF-C717PJ
2
1. 
SERVICING  NOTES
  .............................................   3
2. DISASSEMBLY
2-1. Disassembly 
Flow 
...........................................................   4
2-2.  Cover (Lens), Cover (Projection) ...................................   4
2-3.  Backup Battery (CR2032) (B001), 
 
Cabinet (Rear) Block ......................................................   5
2-4. Projector 
Assy 
(PROJ1) 
..................................................   5
2-5.  MAIN Board Block ........................................................   6
2-6. MAIN 
Board 
...................................................................   7
2-7. Cabinet 
(Front) 
Assy 
.......................................................   8
2-8.  LCD Board Block ...........................................................   8
2-9.  TOP KEY Board .............................................................   9
2-10.  Speaker (36 mm) (SP201) ...............................................   9
3. 
TEST  MODE 
 ............................................................   10
4. DIAGRAMS
4-1.  Printed Wiring Board - MAIN Board - ...........................   12
4-2.  Schematic Diagram - MAIN Board - ..............................   13
4-3.  Printed Wiring Boards - PANEL Section - .....................   14
4-4.  Schematic Diagram - PANEL Section - ..........................   15
5. 
EXPLODED  VIEWS
5-1.  Front Cabinet Section .....................................................   19
5-2. Chassis 
Section 
...............................................................  20
5-3.  Rear Cabinet Section ......................................................   21
6. 
ELECTRICAL  PARTS  LIST
  ..............................   22
Accessories are given in the last of the electrical parts list.
TABLE  OF  CONTENTS
NOTES  ON  CHIP  COMPONENT  REPLACEMENT
• 
Never reuse a disconnected chip component.
• 
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
FLEXIBLE  CIRCUIT  BOARD  REPAIRING
• 
Keep the temperature of soldering iron around 270 °C during 
repairing.
• 
Do not touch the soldering iron on the same conductor of the 
circuit board (within 3 times).
• 
Be careful not to apply force on the conductor when soldering 
or unsoldering.
SAFETY-RELATED  COMPONENT  WARNING!
COMPONENTS  IDENTIFIED  BY  MARK  
0  OR  DOTTED  LINE  
WITH  MARK  
0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 
 
WHOSE  PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  
MANUAL  OR  IN  SUPPLEMENTS  PUBLISHED  BY  SONY.
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