Read Sony ICD-UX512 / ICD-UX512F / ICD-UX513F Service Manual online
ICD-UX512/UX512F/UX513F
3
1. DISASSEMBLY
1-1. Case
Assy
........................................................................ 5
1-2. KEY Board, LED Board ................................................. 5
1-3. LCD
1-3. LCD
Assy
........................................................................ 6
1-4. Main
Board
..................................................................... 6
1-5. Slot
Board
....................................................................... 7
1-6. SP301, MIC301, MIC302 ............................................... 7
1-7. USB
1-7. USB
Assy
........................................................................ 8
1-8. USB
Board
Assy
............................................................. 8
1-9. USB
Board
...................................................................... 9
2.
TEST MODE
............................................................ 10
3. DIAGRAMS
3-1. Block Diagram –Main Section– ..................................... 15
3-2. Block Diagram –Power/Display Section– ...................... 16
3-3. Printed Wiring Board –Main Section (1/2)– ................... 17
3-4. Printed Wiring Board –Main Section (2/2) ..................... 18
3-5. Schematic Diagram –Main Section (1/6)– ...................... 19
3-6. Schematic Diagram –Main Section (2/6)– ...................... 20
3-7. Schematic Diagram –Main Section (3/6)– ...................... 21
3-8. Schematic Diagram –Main Section (4/6)– ...................... 22
3-9. Schematic Diagram –Main Section (5/6)– ...................... 23
3-10. Schematic Diagram –Main Section (6/6)– ...................... 24
3-11. Printed Wiring Boards –Key/LED Section– ................... 25
3-12. Schematic Diagram –Key/LED Section– ....................... 26
3-13. Printed Wiring Boards –Slot/USB Section– ................... 27
3-14. Schematic Diagram –Slot/USB Section– ....................... 28
3-2. Block Diagram –Power/Display Section– ...................... 16
3-3. Printed Wiring Board –Main Section (1/2)– ................... 17
3-4. Printed Wiring Board –Main Section (2/2) ..................... 18
3-5. Schematic Diagram –Main Section (1/6)– ...................... 19
3-6. Schematic Diagram –Main Section (2/6)– ...................... 20
3-7. Schematic Diagram –Main Section (3/6)– ...................... 21
3-8. Schematic Diagram –Main Section (4/6)– ...................... 22
3-9. Schematic Diagram –Main Section (5/6)– ...................... 23
3-10. Schematic Diagram –Main Section (6/6)– ...................... 24
3-11. Printed Wiring Boards –Key/LED Section– ................... 25
3-12. Schematic Diagram –Key/LED Section– ....................... 26
3-13. Printed Wiring Boards –Slot/USB Section– ................... 27
3-14. Schematic Diagram –Slot/USB Section– ....................... 28
4.
EXPLODED VIEWS
4-1. Front Case Section .......................................................... 38
4-2. LCD
4-2. LCD
Assy
Section
........................................................... 39
4-3. Main Board Section ........................................................ 40
4-4. USB Board Section ......................................................... 41
4-5. Rear Case Section ........................................................... 42
4-4. USB Board Section ......................................................... 41
4-5. Rear Case Section ........................................................... 42
5.
ELECTRICAL PARTS LIST
.............................. 43
TABLE OF CONTENTS
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
NOTES ON CHIP COMPONENT REPLACEMENT
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
•
•
Keep the temperature of soldering iron around 270 °C during
repairing.
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
or unsoldering.
CAUTION
Risk of explosion if battery is replaced by an incorrect type.
Dispose of used batteries according to the instructions.
Risk of explosion if battery is replaced by an incorrect type.
Dispose of used batteries according to the instructions.
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