ICD-SX46VTP - Sony Audio Service Manual (repair manual). Page 2

2

...................................................................

3

2-1.

Disassembly Flow ...........................................................

5

2-2.

Cover (Jack) .....................................................................

5

2-3.

Case Block Assy ..............................................................

6

2-4.

AUDIO Board, Microphone Unit (Mic2/3) .....................

6

2-5.

Ornament Belt Assy, SW Board ......................................

7

2-6.

Cover (Chassis) Block Assy ............................................

7

2-7.

MAIN Board, Liquid Crystal Display Panel ...................

8

...............................................................

9

4-1.

Block Diagram  – MAIN Section-1 – ............................. 13

4-2.

Block Diagram  – MAIN Section-2 – ............................. 14

4-3.

Block Diagram  – PANEL Section – ............................... 15

4-4.

Printed Wiring Board  – AUDIO Board (Side A) – ......... 16

4-5.

Schematic Diagram  – AUDIO Board (Side B) – ............ 17

4-6.

Schematic Diagram  – AUDIO Board (1/2) – ................. 18

4-7.

Schematic Diagram  – AUDIO Board (2/2) – ................. 19

4-8.

Printed Wiring Board  – MAIN Board (Side A) – ........... 20

4-9.

Printed Wiring Board  – MAIN Board (Side B) – ........... 21

4-10. Schematic Diagram  – MAIN Board (1/2) – ................... 22
4-11. Schematic Diagram  – MAIN Board (2/2) – ................... 23
4-12. Printed Wiring Board  – SW Board – .............................. 24
4-13. Schematic Diagram  – SW Board – ................................. 25

5-1.

Case Block Assy .............................................................. 33

5-2.

Chassis Block Assy ......................................................... 34

.................................. 35

• Keep the temperature of the soldering iron around 270 °C

during repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be

damaged by heat.

*

Replacement of IC6001 and  IC7003 used in this set requires
a special tool.

•

The voltage and waveform of CSP (chip size package) cannot
be measured, because its lead layout is different from that of
conventional IC.

•

Lead layouts

surface

Lead layout of

conventional IC

CSP (chip size package)

Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.

• Unleaded solder melts at a temperature about 40 °C higher

than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 

°C.

Caution: The printed pattern (copper foil) may peel away if

the heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder. Operating instructiondd

Connect the AC power adaptor AC-E30HG (not
supplied) to the DC IN 3V jack of the unit and to the
wall outlet.  Do not use any other AC power
adaptor.