Read Sony ICD-B600 (serv.man2) Service Manual online
SERVICE MANUAL
Sony Corporation
Audio&Video Business Group
Published by Sony Techno Create Corporation
ICD-B600
SPECIFICATIONS
IC RECORDER
9-887-999-03
2008G04-1
©
2008.07
E Model
Ver. 1.2 2008.07
Recording media
Built-in
Built-in
fl ash memory 512 MB, Monaural
recording
A part of the menory capacity is used as a
management
area.
Recording time
HQ: 61 hours 10 minutes
SP: 163 hours 10 minutes
LP: 301 hours 35 minutes
Frequency range
HQ: 260 Hz - 6,800 Hz
SP: 220 Hz - 3,400 Hz
LP: 220 Hz - 3,100 Hz
Speaker approx. 2.8 cm (1
1/8
in.) dia.
Power output
250
250
mW
Input/Output
• Headphone jack (minijack) for 8 - 300 ohms
ear
receiver/headphones
• Microphone jack (minijack, monaural)
Plug in power
Minimum input level 0.6 mV
Power requirements
Two LR03 (size AAA) alkaline batteries: 3 V DC
Dimensions (w/h/d) (not incl. projecting parts and
controls)
34.6
controls)
34.6
× 109.2 × 18.4 mm (1
3/8
× 4
3/8
×
3/4
in.)
Mass (incl. batteries)
65 g (2.3 oz)
Supplied accessories
Operating instructions (1)
LR03 (size AAA) alkaline batteries (2)
Headphone
(1)
Carrying pouch (1)
Design and specifi cations are subject to change without
notice.
notice.
ICD-B600
2
1. GENERAL
.................................................................. 3
2. DISASSEMBLY
2-1. Case (Front) Assy ........................................................... 4
2-2. Main Board ..................................................................... 5
2-2. Main Board ..................................................................... 5
3.
TEST MODE
............................................................
6
4. DIAGRAMS
4-1. Block
Diagram
................................................................ 9
4-2. Printed Wiring Board –MAIN Section– ......................... 11
4-3. Schematic Diagram –MAIN Section (1/2)– ................... 12
4-4. Schematic Diagram –MAIN Section (2/2)– ................... 13
4-3. Schematic Diagram –MAIN Section (1/2)– ................... 12
4-4. Schematic Diagram –MAIN Section (2/2)– ................... 13
5.
EXPLODED VIEWS
5-1. Case (Front) Section ....................................................... 15
5-2. Case (Rear) Section ........................................................ 16
5-2. Case (Rear) Section ........................................................ 16
6.
ELECTRICAL PARTS LIST
.............................. 17
TABLE OF CONTENTS
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
Notes on chip component replacement
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
Flexible Circuit Board Repairing
•
•
Keep the temperature of soldering iron around 270 °C during
repairing.
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
or unsoldering.
ICD-B600
3
SECTION 1
GENERAL
This section is extracted
from instruction manual.
from instruction manual.
Index to Parts and Controls
Main unit
Display window
Rear
Built-in microphone
* There is a tactile dot beside the control to show the
direction to turn up the volume.
** The button has a tactile dot.
(microphone) jack
Display window
DISPLAY/MENU
DIVIDE
Y(stop)
[9REC (record)
–
(review/fast backward)/
+ (cue/fast forward)
Speaker
Operation indicator
ERASE
VOL (volume) control*
HOLD
/YPLAY/ENTER**
J (headphone) jack
Battery
compartment
compartment
Hook for handstrap
(not supplied)
(not supplied)
Remaining battery
indicator
indicator
Recording mode
indication
indication
REC (recording)
indicator
indicator
Repeat play indicator
Number of messages in
a folder/Menu
indication/Counter /
Remaining time
indication /Recording
date indication /Current
time indication /
Messages
a folder/Menu
indication/Counter /
Remaining time
indication /Recording
date indication /Current
time indication /
Messages
Folder indication
Microphone sensitivity
Alarm indicator
Selected message number
REC DATE (recorded date)
indication
REMAIN indicator
Remaining memory
indicator
ICD-B600
4
SECTION 2
DISASSEMBLY
•
This set can be disassembled in the order shown below.
Note: Follow the disassembly procedure in the numerical order given.
2-1. CASE (FRONT) ASSY
2-1. CASE
(FRONT)
ASSY
(Page
4)
2-2. MAIN
BOARD
(Page
5)
SET
R
screw
RB two screws
RT two brackets (speaker)
RE speaker
RG case (front) assy
claw
claw
claw
claw
two claws
battery case lid
claw
claw