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2
STR-KSL50
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE WITH
MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
1. GENERAL
·········································································· 3
2. TEST MODE
······································································ 4
3. DIAGRAMS
········································································ 7
3-1. Block Diagrams
– Main Section – ··························································· 8
– Display/Power Section – ············································ 9
– Display/Power Section – ············································ 9
3-2. Printed Wiring Board – Digital Section – ··················· 10
3-3. Schematic Diagram – Digital (1/2) Section – ············· 11
3-4. Schematic Diagram – Digital (2/2) Section – ············· 12
3-5. Printed Wiring Board – Main/Standby Section – ········ 13
3-6. Schematic Diagram – Main (1/2) Section – ················ 14
3-7. Schematic Diagram – Main (2/2)/Standby Section – ·· 15
3-8. Printed Wiring Board – Display Section – ·················· 16
3-9. Schematic Diagram – Display Section – ····················· 17
3-10. IC Block Diagram ······················································· 18
3-19. IC Pin Function Descriptions ······································ 19
3-3. Schematic Diagram – Digital (1/2) Section – ············· 11
3-4. Schematic Diagram – Digital (2/2) Section – ············· 12
3-5. Printed Wiring Board – Main/Standby Section – ········ 13
3-6. Schematic Diagram – Main (1/2) Section – ················ 14
3-7. Schematic Diagram – Main (2/2)/Standby Section – ·· 15
3-8. Printed Wiring Board – Display Section – ·················· 16
3-9. Schematic Diagram – Display Section – ····················· 17
3-10. IC Block Diagram ······················································· 18
3-19. IC Pin Function Descriptions ······································ 19
4. EXPLODED VIEWS
4-1. Front Panel Section ····················································· 23
4-2. Chassis Section ···························································· 24
4-2. Chassis Section ···························································· 24
5. ELECTRICAL PARTS LIST
······································· 25
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40
• Unleaded solder melts at a temperature about 40
°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be damaged
• Notice that the minus side of a tantalum capacitor may be damaged
by heat.
TABLE OF CONTENTS
General
Power requirements
Area code
Power requirements
AEP, UK
230 V AC, 50/60 Hz
MY, SP
220 – 230 V AC, 50/60 Hz
Power consumption
Area code
Power consumption
AEP, UK
130 W
MY, SP
105 W
Power consumption (during standby mode)
0.3 W
Dimensions (w/h/d)
STR-KSL50:
430
× 56 × 290 mm
including projecting parts
and controls
and controls
Mass (Approx.)
4.5 kg
Parts No.
MODEL IDENTIFICATION
— BACK PANEL —
PARTS No.
4-246-465-0s
4-246-465-1s
4-246-465-2s
MODEL
AEP model
UK model
Malaysia, Singapore model
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