Read Sony HT-GT1 Service Manual online
HT-GT1
5
ADVANCE PREPARATION WHEN CONFIRMING OP-
ERATION
All of the units included in the HT-GT1 (SA-WGT1/SS-GT1) are
required to confi rming operation of SA-WGT1. Check in advance
that you have all of the units.
ERATION
All of the units included in the HT-GT1 (SA-WGT1/SS-GT1) are
required to confi rming operation of SA-WGT1. Check in advance
that you have all of the units.
NOTE OF PERFORMING THE OPERATION CHECK IN
THE STATE THAT HEAT SINK WAS REMOVED
When performing the operation check in the state that this unit was
disassembled, it is possible to perform the operation check in the
state that heat sink was removed. But don’t perform the operation
check in the long time, and perform the operation check in the
volume state as low as possible.
THE STATE THAT HEAT SINK WAS REMOVED
When performing the operation check in the state that this unit was
disassembled, it is possible to perform the operation check in the
state that heat sink was removed. But don’t perform the operation
check in the long time, and perform the operation check in the
volume state as low as possible.
NOTE OF REPLACING THE TUNER BOARD
When the TUNER board is defective, replace the complete mount-
ed board.
When the TUNER board is defective, replace the complete mount-
ed board.
NOTE OF REPLACING THE IC1002 AND IC4001 ON
THE MAIN BOARD
IC1002 and IC4001 on the MAIN board cannot replace with sin-
gle. When these parts are damaged, replace the complete mounted
board.
THE MAIN BOARD
IC1002 and IC4001 on the MAIN board cannot replace with sin-
gle. When these parts are damaged, replace the complete mounted
board.
NOTE OF REPLACING THE IC002 ON THE MAIN
BOARD AND THE COMPLETE MAIN BOARD
When IC002 on the MAIN board and the complete MAIN board
are replaced, it is necessary to spread the compound between the
MAIN board and the heat sink.
Spread the compound (THERMAL COMPOUND (G747)) refer-
ring to the fi gure below.
BOARD AND THE COMPLETE MAIN BOARD
When IC002 on the MAIN board and the complete MAIN board
are replaced, it is necessary to spread the compound between the
MAIN board and the heat sink.
Spread the compound (THERMAL COMPOUND (G747)) refer-
ring to the fi gure below.
– MAIN Board (Component Side) –
thermal compound (G747)
IC002
Click on the first or last page to see other HT-GT1 service manuals if exist.