Read Sony HT-GT1 Service Manual online
SERVICE MANUAL
Sony Corporation
Published by Sony Techno Create Corporation
HT-GT1
SA-WGT1
SPECIFICATIONS
HT-GT1
SOUND BAR
SA-WGT1
ACTIVE SUBWOOFER
9-896-032-03
2015A33-1
©
2015.01
US Model
AEP Model
UK Model
E Model
Australian Model
Ver. 1.2 2015.01
• All of the units included in the HT-GT1 (SA-WGT1/SS-GT1)
are required to confi rming operation of SA-WGT1. Check in
advance that you have all of the units.
advance that you have all of the units.
COMPONENT MODEL NAME
HT-GT1
Bar Speaker (Speaker System)
SS-GT1
Subwoofer (Active Subwoofer)
SA-WGT1
Speaker section
Speaker system:
Subwoofer, Bass reflex
Speaker unit:
180 mm (7
1
/
8
in), cone type
Rated impedance:
4 ohms
Inputs
AUDIO IN/PARTY CHAIN IN L/R:
Voltage 0.8 V, impedance
47
47
kilohms
OPT IN:
Supported audio signal:
2-channel Linear PCM
2-channel Linear PCM
Outputs
AUDIO OUT/PARTY CHAIN OUT L/R:
Voltage 2 V, impedance 1 kilohm
Tuner section
FM stereo, FM superheterodyne tuner
Antenna:
Antenna:
FM lead antenna
Tuning range:
BLUETOOTH section
Communication system:
BLUETOOTH Standard version 3.0
Output:
BLUETOOTH Standard Power
Class 2
Class 2
Maximum communication range:
Line of sight approx. 10 m
1)
Frequency band:
2.4 GHz band (2.4000 GHz –
Modulation method:
FHSS (Freq Hopping Spread
Spectrum)
Spectrum)
Compatible BLUETOOTH profiles
2)
:
A2DP (Advanced Audio
Distribution Profile)
AVRCP 1.3 (Audio Video Remote
Control Profile)
Distribution Profile)
AVRCP 1.3 (Audio Video Remote
Control Profile)
Supported codecs:
SBC (Sub Band Codec)
AAC (Advanced Audio Coding)
AAC (Advanced Audio Coding)
1)
The actual r ange will vary depending
on factors such as obstacles between
devices, magnetic fields around a
microwave oven, static electricity,
reception sensitivity, antenna’s
performance, operating system,
software application, etc.
devices, magnetic fields around a
microwave oven, static electricity,
reception sensitivity, antenna’s
performance, operating system,
software application, etc.
2)
BL UETOOTH standard profiles
indicate the purpose of BLUETOOTH
communication between devices.
communication between devices.
USB section
Supported format:
MP3 (MPEG 1 Audio Layer-3):
32 kbps – 320 kbps, VBR
WMA:
48 kbps – 192 kbps
AAC:
48 kbps – 320 kbps
WAV:
16 bit PCM
32 kbps – 320 kbps, VBR
WMA:
48 kbps – 192 kbps
AAC:
48 kbps – 320 kbps
WAV:
16 bit PCM
Sampling frequencies:
MP3 (MPEG 1 Audio Layer-3):
32 kHz/44.1 kHz/48 kHz
WMA:
32 kHz/44.1 kHz/48 kHz
AAC:
32 kHz/44.1 kHz/48 kHz
WAV:
8 kHz – 48 kHz
32 kHz/44.1 kHz/48 kHz
WMA:
32 kHz/44.1 kHz/48 kHz
AAC:
32 kHz/44.1 kHz/48 kHz
WAV:
8 kHz – 48 kHz
Supported USB device:
Mass Storage Class
Maximum current:
1 A
(USB) port:
Type A
General
Power requirements:
Power consumption:
70 W
Power consumption (at the Power
Saving mode):
Saving mode):
European model:
mode is set to off)
mode is set to on)
Other models:
Other models:
Active subwoofer:
290 mm × 420 mm × 275 mm
290 mm × 420 mm × 275 mm
0.5 W
Speaker system:
800 mm × 110 mm × 102 mm
800 mm × 110 mm × 102 mm
Mass (Approx.):
Active subwoofer:
7.1 kg (15 lb 10
7.1 kg (15 lb 10
1
/
2
oz)
Speaker system:
2.8 kg (6 lb 2
2.8 kg (6 lb 2
3
/
4
oz)
Quantity:
Active subwoofer:
1 piece
Speaker system:
1 piece
1 piece
Speaker system:
1 piece
Supplied accessories
Optical digital cable (1)
Remote control (1)
R03 (Size AAA) batteries (2)
FM lead antenna (1)
Remote control (1)
R03 (Size AAA) batteries (2)
FM lead antenna (1)
Design and specifications are subject
to change without notice.
to change without notice.
Amplifier section
U.S. model:
POWER OUTPUT AND TOTAL
HARMONIC DISTORTION (FTC output
power):
POWER OUTPUT AND TOTAL
HARMONIC DISTORTION (FTC output
power):
Front L/F ront R:
With 3 ohms loads, both channels
driven, from 400 – 10,000 Hz;
rated 32 watts per channel
minimum RMS powe r, with no
more than 1.0% total harmonic
distortion from 250 milliwatts to
rated output.
With 3 ohms loads, both channels
driven, from 400 – 10,000 Hz;
rated 32 watts per channel
minimum RMS powe r, with no
more than 1.0% total harmonic
distortion from 250 milliwatts to
rated output.
Output power (reference):
Front L/F ront R:
40 W + 40 W (per channel at 3
ohms, 1 kHz)
Subwoof er:
180 W (at 4 ohms, 100 Hz)
40 W + 40 W (per channel at 3
ohms, 1 kHz)
Subwoof er:
180 W (at 4 ohms, 100 Hz)
Brazilian model:
Total RMS output power:
Total RMS output power:
200 W
Front L/F ront R:
RMS output power:
80 W (40 W per channel × 2, at
3 ohms, 1 kHz, 10% THD*)
80 W (40 W per channel × 2, at
3 ohms, 1 kHz, 10% THD*)
Subwoof er:
RMS output power:
120 W (at 4 ohms, 100 Hz, 10%
THD*)
120 W (at 4 ohms, 100 Hz, 10%
THD*)
Other models:
Power output (rated):
Power output (rated):
Front L/F ront R:
32 W + 32 W (at 3 ohms, 1 kHz, 1%
THD*)
32 W + 32 W (at 3 ohms, 1 kHz, 1%
THD*)
Power output (reference):
Front L/F ront R:
40 W + 40 W (per channel at
3 ohms, 1 kHz)
Subwoof er:
180 W (at 4 ohms, 100 Hz)
40 W + 40 W (per channel at
3 ohms, 1 kHz)
Subwoof er:
180 W (at 4 ohms, 100 Hz)
* Total Harmonic Distortion
USA and Brazilian models:
87.5 MHz - 108.0 MHz (100 kHz
step)
Other models:
87.5 MHz - 108.0 MHz (50 kHz
step)
87.5 MHz - 108.0 MHz (100 kHz
step)
Other models:
87.5 MHz - 108.0 MHz (50 kHz
step)
USA and Mexican models:
AC 120 V, 60 Hz
Latin American model (except for
Bolivian, Chilean, Argentine, and
AC 120 V, 60 Hz
Latin American model (except for
Bolivian, Chilean, Argentine, and
Mexican models):
AC 110 V – 240 V, 50/60 Hz
Saudi Arabian,African and Irarian
models:
AC 120 V – 240 V, 50/60 Hz
Other models:
AC 220 V – 240 V, 50/60 Hz
AC 110 V – 240 V, 50/60 Hz
Saudi Arabian,African and Irarian
models:
AC 120 V – 240 V, 50/60 Hz
Other models:
AC 220 V – 240 V, 50/60 Hz
(11
3
/
8
in × 16
1
/
2
in × 10
7
/
8
in )
(31
1
/
2
in × 4
3
/
8
in × 4 in )
0.5 W (When BLUETOOTH standby
6 W (When BLUETOOTH standby
(33
feet)
2.4835
GHz)
Dimensions (W/H/D) (Approx.):
Note:
Be sure to keep your PC used for service and
checking of this unit always updated with the
latest version of your anti-virus software.
In case a virus affected unit was found during
service, contact your Service Headquarters.
Be sure to keep your PC used for service and
checking of this unit always updated with the
latest version of your anti-virus software.
In case a virus affected unit was found during
service, contact your Service Headquarters.
• Please refer to service manual separately issued for Bar
Speaker.
HT-GT1
2
NOTES ON CHIP COMPONENT REPLACEMENT
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
License and Trademark Notice
MPEG Layer-3 audio coding
technology and patents licensed
from Fraunhofer IIS and Thomson.
from Fraunhofer IIS and Thomson.
Windows Media is either a
registered trademark or trademark
of Microsoft Corporation in
the United States and/or other
countries.
of Microsoft Corporation in
the United States and/or other
countries.
This product is protected by
certain intellectual property rights
of Microsoft Corporation. Use or
distribution of such technology
outside of this product is prohibited
without a license from Microsoft or
an authorized Microsoft subsidiary.
of Microsoft Corporation. Use or
distribution of such technology
outside of this product is prohibited
without a license from Microsoft or
an authorized Microsoft subsidiary.
The BLUETOOTH® word mark and
logos are registered trademarks
owned by Bluetooth SIG, Inc. and
any use of such marks by Sony
Corporation is under license. Other
trademarks and trade names are
those of their respective owners.
owned by Bluetooth SIG, Inc. and
any use of such marks by Sony
Corporation is under license. Other
trademarks and trade names are
those of their respective owners.
The N Mark is a trademark or
registered trademark of NFC Forum,
Inc. in the United States and in other
countries.
Inc. in the United States and in other
countries.
Android™ is a trademark of Google
Inc.
Google Play™ is a trademark of
Google Inc.
iPhone and iPod touch are
trademarks of Apple Inc., registered
in the U.S. and other countries. App
Store is a service mark of Apple Inc.
in the U.S. and other countries. App
Store is a service mark of Apple Inc.
“Made for iPod” and “Made for
iPhone” mean that an electronic
accessory has been designed
to connect specifically to iPod
or iPhone, respectively, and has
been certified by the developer
to meet Apple performance
standards. Apple is not responsible
for the operation of this device
or its compliance with safety and
regulatory standards. Please note
that the use of this accessory with
iPod or iPhone may affect wireless
performance.
accessory has been designed
to connect specifically to iPod
or iPhone, respectively, and has
been certified by the developer
to meet Apple performance
standards. Apple is not responsible
for the operation of this device
or its compliance with safety and
regulatory standards. Please note
that the use of this accessory with
iPod or iPhone may affect wireless
performance.
All other trademarks and registered
trademarks are of their respective
holders. In this manual, ™ and ®
marks are not specified.
holders. In this manual, ™ and ®
marks are not specified.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK
0 OR DOTTED LINE
WITH MARK
0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
Ver. 1.1
SAFETY CHECK-OUT
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
1.5 k
Ω
0.15
μF
AC
voltmeter
(0.75 V)
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Parts on Set
Earth Ground
Fig. A. Using an AC voltmeter to check AC leakage.
HT-GT1
3
1.
SERVICING NOTES
.............................................
4
2. DISASSEMBLY
2-1. Disassembly
Flow
........................................................... 6
2-2. Side L, R Panel ............................................................... 7
2-3. Top Panel Block .............................................................. 8
2-4. Front Panel Block ........................................................... 9
2-5. NFC Module (NFC1) ...................................................... 10
2-6. Bluetooth Module (BT1) ................................................ 11
2-7. PANEL Board Block ....................................................... 12
2-8. Button
2-3. Top Panel Block .............................................................. 8
2-4. Front Panel Block ........................................................... 9
2-5. NFC Module (NFC1) ...................................................... 10
2-6. Bluetooth Module (BT1) ................................................ 11
2-7. PANEL Board Block ....................................................... 12
2-8. Button
Assy
..................................................................... 13
2-9. Knob
Assy
....................................................................... 14
2-10. Top Panel Assy ................................................................ 15
2-11. Rear Panel Block ............................................................ 16
2-12. DC Fan (M1) ................................................................... 17
2-13. TUNER Board ................................................................ 17
2-14. MAIN Board-1 ................................................................ 18
2-15. MAIN Board-2 ................................................................ 19
2-16. Sub Chassis ..................................................................... 20
2-17. Power Cord (AC1) .......................................................... 21
2-18. SMPS Board ................................................................... 22
2-19. Loudspeaker (18 cm) (SP1) ............................................ 23
2-20. Service Position .............................................................. 24
2-11. Rear Panel Block ............................................................ 16
2-12. DC Fan (M1) ................................................................... 17
2-13. TUNER Board ................................................................ 17
2-14. MAIN Board-1 ................................................................ 18
2-15. MAIN Board-2 ................................................................ 19
2-16. Sub Chassis ..................................................................... 20
2-17. Power Cord (AC1) .......................................................... 21
2-18. SMPS Board ................................................................... 22
2-19. Loudspeaker (18 cm) (SP1) ............................................ 23
2-20. Service Position .............................................................. 24
3.
TEST MODE
............................................................ 25
4.
ELECTRICAL CHECK
......................................... 27
5. TROUBLESHOOTING
.......................................... 28
TABLE OF CONTENTS
6. DIAGRAMS
6-1. Block Diagram - MAIN Section - ................................... 29
6-2. Block Diagram - AMP Section - ..................................... 30
6-3. Block
6-2. Block Diagram - AMP Section - ..................................... 30
6-3. Block
Diagram
- PANEL/POWER SUPPLY Section - ............................ 31
6-4. Schematic Diagram - MAIN Section (1/5) - ................... 33
6-5. Schematic Diagram - MAIN Section (2/5) - ................... 34
6-6. Schematic Diagram - MAIN Section (3/5) - ................... 35
6-7. Schematic Diagram - MAIN Section (4/5) - ................... 36
6-8. Schematic Diagram - MAIN Section (5/5) - ................... 37
6-9. Printed Wiring Boards - MAIN Section (1/2) - .............. 38
6-10. Printed Wiring Board - MAIN Section (2/2) - ................ 39
6-11. Printed Wiring Boards - KEY Section - .......................... 40
6-12. Schematic Diagram - KEY Section - .............................. 41
6-13. Printed Wiring Board - PANEL Board - ......................... 42
6-14. Schematic Diagram - PANEL Board - ............................ 43
6-15. Printed Wiring Board - SMPS Board - ........................... 44
6-16. Schematic Diagram - SMPS Board - .............................. 45
6-5. Schematic Diagram - MAIN Section (2/5) - ................... 34
6-6. Schematic Diagram - MAIN Section (3/5) - ................... 35
6-7. Schematic Diagram - MAIN Section (4/5) - ................... 36
6-8. Schematic Diagram - MAIN Section (5/5) - ................... 37
6-9. Printed Wiring Boards - MAIN Section (1/2) - .............. 38
6-10. Printed Wiring Board - MAIN Section (2/2) - ................ 39
6-11. Printed Wiring Boards - KEY Section - .......................... 40
6-12. Schematic Diagram - KEY Section - .............................. 41
6-13. Printed Wiring Board - PANEL Board - ......................... 42
6-14. Schematic Diagram - PANEL Board - ............................ 43
6-15. Printed Wiring Board - SMPS Board - ........................... 44
6-16. Schematic Diagram - SMPS Board - .............................. 45
7.
EXPLODED VIEWS
7-1. Side Panel Section .......................................................... 53
7-2. Top Panel Section ........................................................... 54
7-3. Front Panel Section ......................................................... 55
7-4. MAIN Board Section ...................................................... 56
7-5. SMPS Board Section ...................................................... 57
7-6. Speaker Cabinet Section ................................................. 58
7-2. Top Panel Section ........................................................... 54
7-3. Front Panel Section ......................................................... 55
7-4. MAIN Board Section ...................................................... 56
7-5. SMPS Board Section ...................................................... 57
7-6. Speaker Cabinet Section ................................................. 58
8.
ELECTRICAL PARTS LIST
.............................. 59
Accessories are given in the last of the electrical parts list.
HT-GT1
4
SECTION 1
SERVICING NOTES
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
CAPACITOR ELECTRICAL DISCHARGE PROCESSING
When checking the board, for the electric shock prevention, con-
nect the resistors to both ends of resistor (R156) to discharge the
capacitor (C129).
When checking the board, for the electric shock prevention, con-
nect the resistors to both ends of resistor (R156) to discharge the
capacitor (C129).
– SMPS Board (Component Side) –
R156
C129
800
:/2 W
MODEL IDENTIFICATION
Distinguish by Part No. and destination code on the back side of
a main unit.
Distinguish by Part No. and destination code on the back side of
a main unit.
– Back panel view –
Part No.
Destination code
Destination
Part No.
Destination code
Latin American
4-540-495-0[]
E32
US
4-540-495-1[]
U2
Indian, African,
Iranian
Iranian
4-540-495-2[]
E12, E3
AEP, UK
4-540-495-3[]
CEL, CEK
Brazilian
4-540-495-4[]
BR1
Chilean, Peruvian
4-540-495-5[]
E51
Mexican
4-540-495-6[]
MX2
Argentina
4-540-495-7[]
AR2
Saudi Arabia
4-540-495-8[]
EA3
Russian
4-540-495-9[]
RU3
Singapore
4-543-516-0[]
SP1
Australian
4-543-516-1[]
AU1
Thai
4-543-516-2[]
TH1
DESTINATION ABBREVIATIONS
The following abbreviations for model destinations are used in this
service manual.
The following abbreviations for model destinations are used in this
service manual.
• Abbreviations
AR :
AR :
Argentina
model
AUS :
Australian
model
BR
: Brazilian model
E3
: African and Iranian models
E12
: Indian model
E32
: Latin American model
E51
: Chilean and Peruvian models
EA
: Saudi Arabia model
MX
: Mexican model
RU
: Russian model
SP
: Singapore model
TH :
Thai
model
The SERVICING NOTES contains important information for servicing. Be sure to read this section before repairing the unit.
Ver. 1.2