Read Sony HCD-XG500 / HCD-XG60 Service Manual online
SERVICE MANUAL
COMPACT DISC DECK RECEIVER
US Model
Canadian Model
AEP Model
UK Model
HCD-XG500
E Model
HCD-XG60
SPECIFICATIONS
HCD-XG60/XG500
Photo: HCD-XG60
Ver 1.0 2001.02
9-929-577-11
Sony Corporation
2001B0500-1
Audio Entertainment Group
C
2001.2
General Engineering Dept.
HCD-XG60/XG500 is the amplifier, CD
player, tape deck and tuner section in
LBT-XG60/XG500.
player, tape deck and tuner section in
LBT-XG60/XG500.
Dolby noise reduction manufactured under license
from Dolby Laboratories Licensing Corporation.
“DOLBY” and the double-D symbol
from Dolby Laboratories Licensing Corporation.
“DOLBY” and the double-D symbol
;
are trade-
marks of Dolby Laboratories Licensing Corporation.
Model Name Using Similar Mechanism
HCD-LX6/LX50/LX70
CD
CD Mechanism Type
CDM37M-5BD32L
Section
Base Unit Name
BU-5BD32L
Optical Pick-up Name
KSS-213DH
TAPE
Model Name Using Similar Mechanism
NEW
Section
Tape Transport Mechanism Type
TCM-230PWR42
AUDIO POWER SPECIFICATIONS:
(US model only)
(US model only)
POWER OUTPUT AND TOTAL
HARMONIC DISTORTION
HARMONIC DISTORTION
With 6 ohm loads both channels driven, from
120-10,000 Hz; rates 140 watts per channel
minimum RMS power, with no more than 10%
total harmonic distortion.
120-10,000 Hz; rates 140 watts per channel
minimum RMS power, with no more than 10%
total harmonic distortion.
Amplifier section
Canadian model:
Continuous RMS power output (reference)
160 + 160 watts (6 ohms at
1 kHz, 10% THD)
1 kHz, 10% THD)
Total harmonic distortion less than 0.07%
(6 ohms at 1 kHz, 70 W)
AEP, UK models:
DIN power output (rated) 110 + 110 watts
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference)
140 + 140 watts
(6 ohms at 1 kHz, 10% THD)
(6 ohms at 1 kHz, 10% THD)
Music power output (reference)
240 + 240 watts
(6 ohms at 1 kHz, 10% THD)
(6 ohms at 1 kHz, 10% THD)
Other models:
The following measured at AC 120/220/240V, 50 Hz
DIN power output (rated) 150 + 150 watts
DIN power output (rated) 150 + 150 watts
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference)
200 + 200 watts
(6 ohms at 1 kHz, 10% THD)
(6 ohms at 1 kHz, 10% THD)
Inputs
DJ MIX*:
(phono jacks)
DJ MIX*:
(phono jacks)
sensitivity 250 mV,
impedance 47 kilohms
impedance 47 kilohms
GUITAR IN:
(phone jack)
(phone jack)
sensitivity 75 mV,
impedance 470 kilohms
impedance 470 kilohms
PHONO IN:
(phono jacks)
(phono jacks)
sensitivity 3 mV,
impedance 47 kilohms
impedance 47 kilohms
MIX MIC:
(phone jack)
(phone jack)
sensitivity 1 mV,
impedance 10 kilohms
impedance 10 kilohms
VIDEO IN:
(phono jacks)
(phono jacks)
sensitivity 250 mV,
impedance 47 kilohms
impedance 47 kilohms
GAME IN:
(phono jacks)
(phono jacks)
sensitivity 250 mV,
impedance 47 kilohms
impedance 47 kilohms
MD IN:
(phono jack)
(phono jack)
sensitivity 450 mV,
impedance 47 kilohms
impedance 47 kilohms
Outputs
DJ MIX*:
(phono jacks)
DJ MIX*:
(phono jacks)
sensitivity 250 mV,
impedance 1 kilohms
impedance 1 kilohms
PHONES:
(stereo phone jack)
(stereo phone jack)
accepts headphones of 8
ohms or more
ohms or more
VIDEO OUT:
(phono jack)
(phono jack)
voltage 250 mV
impedance 1 kilohm
impedance 1 kilohm
MD OUT:
(phono jacks)
(phono jacks)
voltage 250 mV
impedance 1 kilohm
impedance 1 kilohm
FRONT SPEAKER:
accepts impedance of 6 to
16 ohms
16 ohms
* US, Canadian, AEP, UK, and Mexican models
only
only
CD player section
System
Compact disc and digital
audio system
audio system
Laser
Semiconductor laser
(
(
λ
=780nm), Emission
duration: continuous
Wavelength
780 – 790 nm
Frequency response
2 Hz – 20 kHz (
±
0.5 dB)
Signal-to-noise ratio
More than 90 dB
Dynamic range
More than 90 dB
CD OPTICAL DIGITAL OUT
(Square optical connector jack, rear panel)
Wavelength:
(Square optical connector jack, rear panel)
Wavelength:
660 nm
Output level
–18 dBm
– Continued on next page –
2
HCD-XG60/XG500
Tape player section
Recording system
4-track 2-channel stereo
Frequency response
40 – 13,000 Hz (
±
3 dB),
(DOLBY NR OFF)
using Sony TYPE I cassette
40 – 14,000 Hz (
40 – 14,000 Hz (
±
3 dB),
using Sony TYPE II cassette
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
US, Canadian models:
US, Canadian models:
87.5 – 108.0 MHz (100
kHz step)
kHz step)
Other models:
87.5 – 108.0 MHz
(50 kHz step)
(50 kHz step)
Antenna
FM lead antenna
Antenna terminals
75 ohm unbalanced
Intermediate frequency
10.7 MHz
AM tuner section
Tuning range
US, Canadian, Mexican, Argentina models:
US, Canadian, Mexican, Argentina models:
530 – 1,710 kHz
(with the interval set at 10
kHz)
531 – 1,710 kHz
(with the interval set at 9
kHz)
(with the interval set at 10
kHz)
531 – 1,710 kHz
(with the interval set at 9
kHz)
Other models:
531 – 1,602 kHz
(with the interval set at 9
kHz)
(with the interval set at 9
kHz)
Singapore model:
531 – 1,602 kHz
(with the interval set at 9
kHz)
530 – 1,710 kHz
(with the interval set at 10
kHz)
(with the interval set at 9
kHz)
530 – 1,710 kHz
(with the interval set at 10
kHz)
Antenna
AM loop antenna
Antenna terminals
External antenna terminal
Intermediate frequency
450 kHz
General
Power requirements
US, Canadian models:
US, Canadian models:
120 V AC, 60 Hz
AEP, UK models:
230 V AC, 50/60 Hz
Mexican model:
120 V AC, 50/60 Hz
Other models:
120 V, 220 V or 230 – 240
V AC, 50/60 Hz
Adjustable with voltage
selector
V AC, 50/60 Hz
Adjustable with voltage
selector
Power consumption
US model:
US model:
240 watts
Canadian model:
320VA
AEP, UK models:
220 watts
0.6 watts (at the power
saving mode)
0.6 watts (at the power
saving mode)
Other models:
180 watts
Dimensions (w/h/d)
Approx. 355 x 425 x 450
mm
mm
Mass :
HCD-XG500
HCD-XG500
Approx. 13.5 kg
HCD-XG60
Approx. 15.0 kg
Supplied accessories:
AM loop antenna (1)
FM lead antenna (1)
Speaker cords (2)
Speaker pads (8)
Remote commander (1)
Batteries (2)
FM lead antenna (1)
Speaker cords (2)
Speaker pads (8)
Remote commander (1)
Batteries (2)
Design and specifications are subject to change
without notice.
without notice.
3
HCD-XG60/XG500
TABLE OF CONTENTS
1.
SERVICING NOTES
................................................
5
2.
GENERAL
Location of Controls .......................................................
6
Setting the Time ..............................................................
7
3.
DISASSEMBLY
3-1. Disassembly Flow ...........................................................
8
3-2. Case .................................................................................
8
3-3. Front Panel Section .........................................................
9
3-4. Cover (TC), Tape Mechanism Deck
(TCM-230PWR42) .........................................................
9
3-5. MAIN Board, Fan, D.C. (M901)
(Except AEP, UK Models) .............................................. 10
3-6. MAIN Board (AEP, UK Models) ................................... 10
3-7. CD Mechanism Deck (CDM37M-5BD32L) .................. 11
3-8. Base Unit (BU-5B32L) ................................................... 12
3-9. Disc Table ........................................................................ 12
3-7. CD Mechanism Deck (CDM37M-5BD32L) .................. 11
3-8. Base Unit (BU-5B32L) ................................................... 12
3-9. Disc Table ........................................................................ 12
4.
TEST MODE
.............................................................. 13
5.
MECHANICAL ADJUSTMENTS
....................... 15
6.
ELECTRICAL ADJUSTMENTS
Deck section .................................................................... 15
CD Section ...................................................................... 18
CD Section ...................................................................... 18
7.
DIAGRAMS
7-1. Block Diagram – CD SERVO Section – ....................... 19
7-2. Block Diagram – TUNER/TAPE DECK Section – ...... 20
7-3. Block Diagram – MAIN Section – ................................ 21
7-4. Block Diagram – DISPLAY/KEY CONTROL/
7-2. Block Diagram – TUNER/TAPE DECK Section – ...... 20
7-3. Block Diagram – MAIN Section – ................................ 21
7-4. Block Diagram – DISPLAY/KEY CONTROL/
POWER SUPPLY Section – ........................................... 22
7-5. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 23
7-6. Printed Wiring Board – BD Board – ............................. 24
7-7. Schematic Diagram – BD Board – ................................ 25
7-8. Printed Wiring Boards – CD MOTOR Section – .......... 26
7-9. Schematic Diagram – CD MOTOR Section – .............. 27
7-10. Printed Wiring Board – AUDIO Board – ...................... 28
7-11. Schematic Diagram – AUDIO Board – ......................... 29
7-12. Printed Wiring Board – LEAF SW Board – .................. 30
7-13. Schematic Diagram – LEAF SW Board – ..................... 30
7-14. Schematic Diagram – MAIN Board (1/3) – .................. 31
7-15. Schematic Diagram – MAIN Board (2/3) – .................. 32
7-16. Schematic Diagram – MAIN Board (3/3) – .................. 33
7-17. Printed Wiring Board – MAIN Board – ........................ 34
7-18. Printed Wiring Board – PA Board – .............................. 36
7-19. Schematic Diagram – PA Board – ................................. 37
7-20. Printed Wiring Boards – MIC/FRONT INPUT/
7-7. Schematic Diagram – BD Board – ................................ 25
7-8. Printed Wiring Boards – CD MOTOR Section – .......... 26
7-9. Schematic Diagram – CD MOTOR Section – .............. 27
7-10. Printed Wiring Board – AUDIO Board – ...................... 28
7-11. Schematic Diagram – AUDIO Board – ......................... 29
7-12. Printed Wiring Board – LEAF SW Board – .................. 30
7-13. Schematic Diagram – LEAF SW Board – ..................... 30
7-14. Schematic Diagram – MAIN Board (1/3) – .................. 31
7-15. Schematic Diagram – MAIN Board (2/3) – .................. 32
7-16. Schematic Diagram – MAIN Board (3/3) – .................. 33
7-17. Printed Wiring Board – MAIN Board – ........................ 34
7-18. Printed Wiring Board – PA Board – .............................. 36
7-19. Schematic Diagram – PA Board – ................................. 37
7-20. Printed Wiring Boards – MIC/FRONT INPUT/
HEADPHONES Boards – ............................................... 38
7-21. Schematic Diagram – MIC/FRONT INPUT/
HEADPHONES Boards – ............................................. 39
7-22. Printed Wiring Board – PANEL FL Board – ................ 40
7-23. Schematic Diagram – PANEL FL Board – ................... 41
7-24. Printed Wiring Boards
7-23. Schematic Diagram – PANEL FL Board – ................... 41
7-24. Printed Wiring Boards
– PANEL VR/ILLUMINATION Boards – ..................... 42
7-25. Schematic Diagram
– PANEL VR/ILLUMINATION Boards – ..................... 43
7-26. Printed Wiring Boards – TC-A/TC-B/CD-L/
CD-R (1)/CD-R (2) Boards – ......................................... 44
7-27. Schematic Diagram – TC-A/TC-B/CD-L/
CD-R (1)/CD-R (2) Boards – ......................................... 45
7-28. Printed Wiring Board – TRANSFORMER Section– .... 46
7-29. Schematic Diagram – TRANSFORMER Section– ....... 46
7-30. IC Pin Function Description ........................................... 50
7-29. Schematic Diagram – TRANSFORMER Section– ....... 46
7-30. IC Pin Function Description ........................................... 50
8.
EXPLODED VIEWS
8-1. Case, Back Panel Section ................................................ 55
8-2. Front Panel Section-1 ...................................................... 56
8-3. Front Panel Section-2 ...................................................... 57
8-4. Chassis Section ............................................................... 58
8-5. Tape Mechanism Deck Section-1
8-2. Front Panel Section-1 ...................................................... 56
8-3. Front Panel Section-2 ...................................................... 57
8-4. Chassis Section ............................................................... 58
8-5. Tape Mechanism Deck Section-1
(TCM-230PWR42) ......................................................... 59
8-6. Tape Mechanism Deck Section-2
(TCM230PWR42) ........................................................... 60
8-7. CD Mechanism Deck Section (CDM37M-5BD32L) .... 61
8-8. Base Unit Section (BU-5BD32L) ................................... 62
8-8. Base Unit Section (BU-5BD32L) ................................... 62
9.
ELECTRICAL PARTS LIST
............................... 63
4
HCD-XG60/XG500
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
other than those specified herein may result in hazardous ra-
diation exposure.
SAFETY CHECK-OUT
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indica-
tion is 0.75 V, so analog meters must have an accurate low-
voltage scale. The Simpson 250 and Sanwa SH-63Trd are ex-
amples of a passive VOM that is suitable. Nearly all battery
operated digital multimeters that have a 2 V AC range are suit-
able. (See Fig. A)
tion is 0.75 V, so analog meters must have an accurate low-
voltage scale. The Simpson 250 and Sanwa SH-63Trd are ex-
amples of a passive VOM that is suitable. Nearly all battery
operated digital multimeters that have a 2 V AC range are suit-
able. (See Fig. A)
Fig. A.
Using an AC voltmeter to check AC leakage.
1.5 k
Ω
0.15
µ
F
AC
voltmeter
(0.75 V)
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Parts on Set
Earth Ground
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE
0
SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE
DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ
DE FONCTIONNEMENT. NE REMPLACER CES COM-
POSANTS QUE PAR DES PIÈCES SONY DONT LES
NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ
DE FONCTIONNEMENT. NE REMPLACER CES COM-
POSANTS QUE PAR DES PIÈCES SONY DONT LES
NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED
LINE WITH MARK
0
ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
The following caution label is located inside the unit.
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.