Read Sony HCD-DX70 Service Manual online
Model Name Using Similar Mechanism
NEW
CD Mechanism Type
CDM58E-30BD60
Base Unit Type
BU-30BD60
Optical Pick-up Type
A-MAX.3
Model Name Using Similar Mechanism
NEW
Tape Transport Mechanism Type
TCM-230AWR41/MWR41
HCD-DX70
SERVICE MANUAL
HCD-DX70 is the tuner, deck, CD and amplifier
section in MHC-DX70.
section in MHC-DX70.
SPECIFICATIONS
COMPACT DISC DECK RECEIVER
— Continued on next page —
CD
SECTION
TAPE DECK
SECTION
E Model
Ver 1.2 2003.12
9-929-580-13
2003L02-1
© 2003.12
Sony Corporation
Home Audio Company
Published by Sony Engineering Corporation
2
HCD-DX70
TABLE OF CONTENTS
1. GENERAL
·········································································· 4
2. DISASSEMBLY
2-1.
Case (Top) ·········································································· 5
2-2.
Loading Panel ····································································· 6
2-3.
Front Panel Section ···························································· 6
2-4.
Tape Mechanism Deck ······················································· 7
2-5.
CD SW Board, Panel Board, Pad Switch Board ················ 7
2-6.
Main Trans Board ······························································· 8
2-7.
Main Board, Power Board ·················································· 8
2-8.
SW Board, Head (A) Board, Head (B) Board ···················· 9
2-9.
Base Unit ············································································ 9
2-10. Driver Board, Motor Board, CD Sensor Board and
Video Board ······································································ 10
3. TEST MODE
···································································· 11
4. MECHANICAL ADJUSTMENTS
····························· 15
5. ELECTRICAL ADJUSTMENTS
······························· 15
6. DIAGRAMS
6-1.
Circuit Board Location ····················································· 21
6-2.
Block Diagrams ································································ 22
6-3.
Schematic Diagram – BD Section – ································· 24
6-4.
Printed Wiring Board – BD Section – ······························ 25
6-5.
Printed Wiring Board – Main Section – ··························· 26
6-6.
Schematic Diagram – Main (1/4) Section – ····················· 27
6-7.
Schematic Diagram – Main (2/4) Section – ····················· 28
6-8.
Schematic Diagram – Main (3/4) Section – ····················· 29
6-9.
Schematic Diagram – Main (4/4) Section – ····················· 30
6-10. Schematic Diagram – Video SW Section – ······················ 31
6-11. Printed Wiring Board – Video SW Section – ··················· 31
6-12. Printed Wiring Board – Power AMP Section – ················ 32
6-13. Schematic Diagram – Power AMP Section – ··················· 33
6-14. Printed Wiring Board – Panel Section – ··························· 34
6-15. Schematic Diagram – Panel Section – ····························· 35
6-16. Printed Wiring Boards – Switch Section – ······················· 36
6-17. Schematic Diagram – Switch Section – ··························· 37
6-18. Printed Wiring Boards – Leaf SW Section – ···················· 38
6-19. Schematic Diagram – Leaf SW Section – ························ 39
6-20. Printed Wiring Boards – Driver Section – ························ 40
6-21. Schematic Diagrams – Driver Section – ·························· 41
6-22. Printed Wiring Board – Trans Section – ··························· 42
6-23. Schematic Diagram – Trans Section – ····························· 43
6-24. IC Pin Functions ······························································· 44
6-25. IC Block Diagrams ··························································· 48
6-11. Printed Wiring Board – Video SW Section – ··················· 31
6-12. Printed Wiring Board – Power AMP Section – ················ 32
6-13. Schematic Diagram – Power AMP Section – ··················· 33
6-14. Printed Wiring Board – Panel Section – ··························· 34
6-15. Schematic Diagram – Panel Section – ····························· 35
6-16. Printed Wiring Boards – Switch Section – ······················· 36
6-17. Schematic Diagram – Switch Section – ··························· 37
6-18. Printed Wiring Boards – Leaf SW Section – ···················· 38
6-19. Schematic Diagram – Leaf SW Section – ························ 39
6-20. Printed Wiring Boards – Driver Section – ························ 40
6-21. Schematic Diagrams – Driver Section – ·························· 41
6-22. Printed Wiring Board – Trans Section – ··························· 42
6-23. Schematic Diagram – Trans Section – ····························· 43
6-24. IC Pin Functions ······························································· 44
6-25. IC Block Diagrams ··························································· 48
7. EXPLODED VIEWS
7-1.
Main Section ····································································· 51
7-2.
Front Panel Section ·························································· 52
7-3.
Chassis Section ································································· 53
7-4.
Tape Mechanism Section-1 (TCM-230MWR41) ············· 54
7-5.
Tape Mechanism Section-2 (TCM-230AWR41) ·············· 55
7-6.
CD Mechanism Deck Section (CDM58E-30BD60) ········ 56
7-7.
Base Unit Section (BU-30BD60) ····································· 57
8. ELECTRICAL PARTS LIST
······································· 58
3
HCD-DX70
This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
of emitting radiation exceeding the limit for
Class 1.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
MODEL IDENTIFICATION
— BACK PANEL —
PARTS No.
• Abbreviation
AR
: Argentina model
SP
: Singapore model
MX
: Mexican model
E51
: Chiri and Peru model
MODEL
E, E51, AR, SP models
MX model
PARTS No.
4-231-580-1s
4-231-580-3s
SETTING THE TIME
This section is extracted
from instruction manual.
from instruction manual.
4
HCD-DX70
Location of Parts and Controls
1
@/1 (POWER) button and indicator
2
DISC 1 button and indicator
3
DISC 2 button and indicator
4
DISC 3 button and indicator
5
DISC SKIP EX-CHANGE button
6
CD (OPEN) button
7
CD button and indicator
8
TUNER/BAND button and indicator
9
TAPE A/B button and indicator
q;
MD (VIDEO) button and indicator
qa
VOLUME knob
qs
PHONES jack
qd
MIC jack
qf
MIC LEVEL knob
qg
GAME INPUT (VIDEO, AUDIO L/R) jack
qh
GAME button and indicator
qj
DISPLAY button
qk
SPECTRUM button
ql
EDIT (DIRECTION) button
w;
REPEAT (FM MODE/DOLBY NR) button
wa
PLAY MODE (TUNER MEMORY) button
SECTION 1
GENERAL
Front Panel
qj qk ql w; wa ws
1
2 3 4
56
7
9
qa
qs
8
q;
qh
qf
qd
qg
eheg ed es e; wk
wh
wj
ef
ea wl
el
r;
ej
ek
ra
wf
wg
wd
ws
Remote sensor
wd
MOVIE EQ button
wf
ENTER button and indicator
wg
P FILE button
wh
M/+ button
wj
REC PAUSE/START button and indicator
wk
> button
wl
CD SYNC HI-DUB button
e;
X button
ea
SURROUND button
es
bB button
ed
x button
ef
GROOVE button
eg
. button
eh
m/– button
ej
b/v/B/V button
ek
GAME EQ button
el
KARAOKE PON button
r;
EFFECT ON/OFF button
ra
MUSIC EQ button