Read Sony HCD-NEZ50 Service Manual online
2
HCD-NEZ50
Note on Printed Wiring Board:
•
X
: parts extracted from the component side.
•
Y
: parts extracted from the conductor side.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
•
Note for Printed Wiring Board and Schematic Diagram
2.
DIAGRAMS
Note on Schematic Diagram:
•
All capacitors are in
µ
F unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
and tantalums.
•
All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
C
: panel designation.
•
Signal path.
F
: TUNER
•
Abbreviation
AR
AR
: Argentina model
E51
: Chilean and Peruvian models
MX
: Mexican model
2-1. PRINTED WIRING BOARD – HEAD PHONE Board –
: Uses unleaded solder.
R542
R543
R544
R545
R546
R547
R548
R541
R529
R531
R533
R534
R532
R520
R527
R528
R526
R525
R519
R530
C521
C520
WIRE200
JW
241
JW238
JW239
JW231
JW240
JW245
JW244
J500
HEAD PHONE BOARD
1-870-481-
12,13
(12,13)
1
13
FFC501
PHONES
(CHASSIS)
EPT500
A
B
C
D
1
2
3
4
JW240
(AEP, UK)
(E, E51, MX, AR)
MAIN
BOARD
CN500
BOARD
CN500
2-2. SCHEMATIC DIAGRAM – HEAD PHONE Board –
R527
R525
R519
R520
R526
R528
J500
EPT500
R533
R531
R529
R534
R532
R530
R541
R542
R544
R546
R548
R543
R545
R547
470
470
470
470
470
470
470
470
∗
470
470
∗
10k
10k
10k
10k
10k
10k
10k
10k
HP-L
HPGND
HP-R
SP-L
SP-R
HP-L
HP-L
HP-R
HP-R
SP-L
SP-L
SP-R
SP-R
FFC501
1
13
(CHASSIS)
PHONES
∗
R529,530
220(E,E51,MX,AR)
470(AEP,UK)
C520 0.01
C520
0.01
JW240 0.45
µ
H
(AEP,UK)
(E,E51,MX,AR)
MAIN
BOARD
(1/2)
CN500
Ver. 1.2
Click on the first or last page to see other HCD-NEZ50 service manuals if exist.