HCD-MD1DX, HCD-MD1EX (serv.man2) - Sony Audio Service Manual (repair manual). Page 6

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• Keep the temperature of the soldering iron around 270 ˚C dur-

ing repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

Eksplosjonsfare ved feilaktig skifte av batteri.

Benytt samme batteritype eller en tilsvarende type

anbefalt av apparatfabrikanten.

Brukte batterier kasseres i henhold til fabrikantens

instruksjoner.

Explosionsfara vid felaktigt batteribyte.
Använd samma batterityp eller en likvärdig typ som
 rekommenderas av apparattillverkaren.
Kassera använt batteri enligt gällande föreskrifter.

Paristo voi räjähtää, jos se on virheellisesti asennettu.
Vaihda paristo ainoastaan laitevalmistajan suosittelemaan tyyppiin.
Hävitä käytetty paristo valmistajan ohjeiden mukaisesti.

Lithiumbatteri-Eksplosionsfare ved fejlagtig håndtering.

Udskiftning må kun ske med batteri

af samme fabrikat og type.

Levér det brugte batteri tilbage til leverandøren.

Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type recommended by
the manufacturer.
Discard used batteries according to the manufacturer’s instructions.

The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.

Carry out the “S curve check” in “CD section adjustment” and
check that the S curve waveforms is output three times.

• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

• Keep the temperature of the soldering iron around 270 ˚C dur-

ing repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

!

!

Note:
Be sure to connect all wires (including FFC) in the MD
section before applying power or ICs may be damaged.