HCD-GTR333, HCD-GTR555, HCD-GTR777, HCD-GTR888, MHC-GTR333, MHC-GTR555, MHC-GTR777, MHC-GTR888 - Sony Audio Service Manual (repair manual). Page 5

MICOM (IC500) ON MAIN BOARD SERVICE POSITION
•  In checking the MICOM (IC500) on the MAIN board, prepare two extension jigs (1-843-138-11: 14 cores, 150 mm (common)/

1-843-140-11: 10 cores, 150 mm (for 2CH DAMP board)/ 1-843-139-11: 12 cores, 150 mm (for 3CH DAMP board)/ 1-843-138-11:
14 cores, 150 mm (for 4CH DAMP board).

When installing a new OP unit, be sure to connect the fl exible 
printed circuit board fi rst of all before removing the static electric-
ity prevention solder bridge by unsoldering. 
Remove the static electricity prevention solder bridge by unsolder-
ing after the fl exible printed circuit board has already been con-
nected. 
(Do not remove nor unsolder the solder bridge as long as the OP 
unit is kept standalone.)