Read Sony HCD-GTR333 / HCD-GTR555 / HCD-GTR777 / HCD-GTR888 / MHC-GTR333 / MHC-GTR555 / MHC-GTR777 / MHC-GTR888 Service Manual online
SERVICE MANUAL
Sony Corporation
Published by Sony EMCS (Malaysia) PG Tec
HCD-GTR333/GTR555/GTR777/GTR888
SPECIFICATIONS
9-890-567-04
2012E80-1
©
2012.05
E Model
Ver. 1.3 2012.05
• HCD-GTR333 is the amplifi er, USB, CD player and tuner
section in MHC-GTR333.
• HCD-GTR555 is the amplifi er, USB, CD player and tuner
section in MHC-GTR555.
• HCD-GTR777 is the amplifi er, USB, CD player and tuner
section in MHC-GTR777.
• HCD-GTR888 is the amplifi er, USB, CD player and tuner
section in MHC-GTR888.
Photo: HCD-GTR888 (E2 Model)
“WALKMAN” and “WALKMAN” logo are registered
trademarks of Sony Corporation.
trademarks of Sony Corporation.
MPEG Layer-3 audio coding technology and patents licensed
from Fraunhofer IIS and Thomson.
from Fraunhofer IIS and Thomson.
Windows Media is a registered trademark of Microsoft
Corporation in the United States and/or other countries.
Corporation in the United States and/or other countries.
This product contains technology subject to certain
intellectual property rights of Microsoft.
Use or distribution of this technology outside of this
product is prohibited without the appropriate license(s) from
Microsoft.
intellectual property rights of Microsoft.
Use or distribution of this technology outside of this
product is prohibited without the appropriate license(s) from
Microsoft.
CD Section
Model Name Using Similar Mechanism
HCD-GTR6/GTR6B/GTR7/GTR8/GTR8B
CD Mechanism Type
CDM74HF-DVBU101//M
Optical Pick-up Name
KHM-313CAB/C2NP
• Abbreviation
E2 : 120V AC area in E model
COMPACT DISC RECEIVER
Amplifi er section
The following are measured at AC 120 V –
240 V, 50/60 Hz
240 V, 50/60 Hz
MHC-GTR888
Front/Satellite speaker
Front/Satellite speaker
Power Output (rated):
290 W + 290 W (at 4 Ω, 1 kHz, 1% THD)
Front speaker
RMS output power (reference):
360 W + 360 W (per channel at 6 Ω, 1 kHz)
Satellite speaker
RMS output power (reference):
180 W + 180 W (per channel at 12 Ω, 1 kHz)
Subwoofer
RMS output power (reference):
260 W + 260 W (per channel at 8 Ω, 100 Hz)
MHC-GTR777
Front/Satellite speaker
Front/Satellite speaker
Power Output (rated):
190 W + 190 W (at 4 Ω, 1 kHz, 1% THD)
Front speaker
RMS output power (reference):
220 W + 220 W (per channel at 6 Ω, 1 kHz)
Satellite speaker
RMS output power (reference):
110 W + 110 W (per channel at 12 Ω, 1 kHz)
Subwoofer
RMS output power (reference):
170 W + 170 W (8 Ω, 100 Hz)
MHC-GTR555
Front speaker
Front speaker
Power Output (rated):
160 W + 160 W (at 5 Ω, 1 kHz, 1% THD)
RMS output power (reference):
250 W + 250 W (per channel at 5 Ω, 1 kHz)
Subwoofer
RMS output power (reference):
250
W
(5
Ω, 100 Hz)
MHC-GTR333
Front speaker
Front speaker
Power Output (rated):
130 W + 130 W (at 4 Ω, 1 kHz,1% THD)
RMS output power (reference):
250 W + 250 W (per channel at 4 Ω, 1 kHz)
Inputs
TV (AUDIO IN) L/R
TV (AUDIO IN) L/R
Voltage 1.2 V, impedance 47 kΩ
DVD/PC (AUDIO IN) L/R
Voltage 1.2 V, impedance 47 kΩ
MIC (MHC-GTR888/MHC-GTR777 only)
Sensitivity 1 mV, impedance 10 kΩ
A,
B port: Type A
USB section
Supported bit rate
Supported bit rate
MP3 (MPEG 1 Audio Layer-3):
32 kbps – 320 kbps, VBR
WMA: 48 kbps – 192 kbps
AAC: 48 kbps – 320 kbps
Sampling frequencies
MP3 (MPEG 1 Audio Layer-3):
32 kHz/44.1 kHz/48 kHz
WMA: 44.1 kHz
AAC: 44.1 kHz
Transfer speed
Full-Speed
Supported USB device
Full-Speed
Supported USB device
Mass Storage Class
Maximum current
500
500
mA
Disc player section
System
System
Compact disc and digital audio system
Laser Diode Properties
Emission Duration: Continuous
Laser Output*: Less than 44.6 μW
* This output is the value measurement at
a distance of 200 mm from the objective
lens surface on the Optical Pick-up Block
with 7 mm aperture.
lens surface on the Optical Pick-up Block
with 7 mm aperture.
Frequency response
20 Hz – 20 kHz
Signal-to-noise ratio
More than 90 dB
Dynamic range
More than 88 dB
Tuner section
FM stereo, FM/AM superheterodyne tuner
Antenna:
FM stereo, FM/AM superheterodyne tuner
Antenna:
FM lead antenna
AM loop antenna
FM tuner section
Tuning range
Tuning range
87.5 MHz – 108.0 MHz (50 kHz step)
AM tuner section
Tuning range
Pan
Tuning range
Pan
American
models:
530 kHz – 1,710 kHz (10 kHz step)
531 kHz – 1,710 kHz (9 kHz step)
Other
models:
530 kHz – 1,610 kHz (10 kHz step)
531 kHz – 1,602 kHz (9 kHz step)
General
Power requirements
Power requirements
AC 120 V – 240 V, 50/60 Hz
Power consumption
MHC-GTR888:
MHC-GTR888:
220
W
MHC-GTR777: 160 W
MHC-GTR555: 150 W
MHC-GTR333: 110 W
MHC-GTR555: 150 W
MHC-GTR333: 110 W
Dimensions (w/h/d) (excl. speakers)
(Approx.)
(Approx.)
280 mm × 333 mm × 439.5 mm
Mass (excl. speakers) (Approx.)
HCD-GTR888: 7.1 kg
HCD-GTR777/HCD-GTR555: 6.7 kg
HCD-GTR333: 6.4 kg
HCD-GTR777/HCD-GTR555: 6.7 kg
HCD-GTR333: 6.4 kg
Supplied accessories
Remote control (1)
R6 (Size AA) batteries (2)
FM lead/AM loop antenna (1)
Spacer A (MHC-GTR888 only) (2)
Spacer B (MHC-GTR888 only) (2)
R6 (Size AA) batteries (2)
FM lead/AM loop antenna (1)
Spacer A (MHC-GTR888 only) (2)
Spacer B (MHC-GTR888 only) (2)
Design and specifi cations are subject to change
without notice.
without notice.
HCD-GTR333/GTR555/GTR777/GTR888
2
NOTES ON CHIP COMPONENT REPLACEMENT
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
• Keep the temperature of soldering iron around 270 °C during
• Keep the temperature of soldering iron around 270 °C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous
radiation exposure.
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous
radiation exposure.
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
After correcting the original service problem, perform the following
safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
1.5 k
Ω
0.15
μF
AC
voltmeter
(0.75 V)
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Parts on Set
Earth Ground
Fig. A. Using an AC voltmeter to check AC leakage.
This appliance is classified as a CLASS 1
LASER product. This marking is located on
the rear exterior.
LASER product. This marking is located on
the rear exterior.
HCD-GTR333/GTR555/GTR777/GTR888
3
TABLE OF CONTENTS
1. SERVICING
NOTES
................................................
4
2. DISASSEMBLY
2-1. Disassembly
Flow
........................................................... 6
2-2. Case
................................................................................. 7
2-3. Loading
Panel
................................................................. 7
2-4. Front Panel Section ......................................................... 8
2-5. TUNER
2-5. TUNER
Board
................................................................ 8
2-6. CD Mechanism Section (CDM74HFV-DVBU101) ....... 9
2-7. MAIN
2-7. MAIN
Board
................................................................... 9
2-8. Back Panel Section ......................................................... 10
2-9. 2CH DAMP Board, 3CH DAMP Board,
2-9. 2CH DAMP Board, 3CH DAMP Board,
4CH DAMP Board .......................................................... 10
2-10. Chassis Section ............................................................... 11
2-11. Cover Dust (CDM) ......................................................... 11
2-12. Optical Device ................................................................ 12
2-13. DMB21 Board ................................................................ 12
2-14. DRIVER Board, SWITCH Board ................................... 13
2-15. SENSOR Board .............................................................. 13
2-16. MOTOR (TB) Board....................................................... 14
2-17. MOTOR (LD) Board ...................................................... 14
2-11. Cover Dust (CDM) ......................................................... 11
2-12. Optical Device ................................................................ 12
2-13. DMB21 Board ................................................................ 12
2-14. DRIVER Board, SWITCH Board ................................... 13
2-15. SENSOR Board .............................................................. 13
2-16. MOTOR (TB) Board....................................................... 14
2-17. MOTOR (LD) Board ...................................................... 14
3.
TEST MODE
............................................................. 15
4.
ELECTRICAL CHECK
.......................................... 16
5. DIAGRAMS
5-1. Block Diagram - USB Section - ..................................... 17
5-2. Block Diagram - RF/SERVO Section - .......................... 18
5-3. Block Diagram - TUNER Section - ................................ 19
5-4. Block Diagram - MAIN Section - ................................... 20
5-5. Block Diagram - DISPLAY Section - ............................. 21
5-6. Block Diagram - DAMP Section (1/2) - ......................... 22
5-7. Block Diagram - DAMP Section (2/2) - ......................... 23
5-8. Printed Wiring Board - DMB21 Board (Side A) ............ 25
5-9. Printed Wiring Board - DMB21 Board (Side B) ............ 26
5-10. Schematic Diagram - DMB21 Board (1/3) - .................. 27
5-11. Schematic Diagram - DMB21 Board (2/3) - .................. 28
5-12. Schematic Diagram - DMB21 Board (3/3) - .................. 29
5-13. Printed Wiring Board - MAIN Board (Side A) ............... 30
5-14. Printed Wiring Board - MAIN Board (Side B) ............... 31
5-15. Schematic Diagram - MAIN Board (1/4) - ..................... 32
5-16. Schematic Diagram - MAIN Board (2/4) - ..................... 33
5-17. Schematic Diagram - MAIN Board (3/4) - ..................... 34
5-18. Schematic Diagram - MAIN Board (4/4) - ..................... 35
5-2. Block Diagram - RF/SERVO Section - .......................... 18
5-3. Block Diagram - TUNER Section - ................................ 19
5-4. Block Diagram - MAIN Section - ................................... 20
5-5. Block Diagram - DISPLAY Section - ............................. 21
5-6. Block Diagram - DAMP Section (1/2) - ......................... 22
5-7. Block Diagram - DAMP Section (2/2) - ......................... 23
5-8. Printed Wiring Board - DMB21 Board (Side A) ............ 25
5-9. Printed Wiring Board - DMB21 Board (Side B) ............ 26
5-10. Schematic Diagram - DMB21 Board (1/3) - .................. 27
5-11. Schematic Diagram - DMB21 Board (2/3) - .................. 28
5-12. Schematic Diagram - DMB21 Board (3/3) - .................. 29
5-13. Printed Wiring Board - MAIN Board (Side A) ............... 30
5-14. Printed Wiring Board - MAIN Board (Side B) ............... 31
5-15. Schematic Diagram - MAIN Board (1/4) - ..................... 32
5-16. Schematic Diagram - MAIN Board (2/4) - ..................... 33
5-17. Schematic Diagram - MAIN Board (3/4) - ..................... 34
5-18. Schematic Diagram - MAIN Board (4/4) - ..................... 35
5-19. Printed Wiring Board - 2CH DAMP Board - .................. 36
5-20. Schematic Diagram - 2CH DAMP Board (1/4) - ............ 37
5-21. Schematic Diagram - 2CH DAMP Board (2/4) - ............ 38
5-22. Schematic Diagram - 2CH DAMP Board (3/4) - ............ 39
5-23. Schematic Diagram - 2CH DAMP Board (4/4) - ............ 40
5-24. Printed Wiring Board - 3CH DAMP Board (Side A)...... 41
5-25. Printed Wiring Board - 3CH DAMP Board (Side B)...... 42
5-26. Schematic Diagram - 3CH DAMP Board (1/4) - ............ 43
5-27. Schematic Diagram - 3CH DAMP Board (2/4) - ............ 44
5-28. Schematic Diagram - 3CH DAMP Board (3/4) - ............ 45
5-29. Schematic Diagram - 3CH DAMP Board (4/4) - ............ 46
5-30. Printed Wiring Board - 4CH DAMP Board (Side A)...... 47
5-31. Printed Wiring Board - 4CH DAMP Board (Side B)...... 48
5-32. Schematic Diagram - 4CH DAMP Board (1/4) - ............ 49
5-33. Schematic Diagram - 4CH DAMP Board (2/4) - ............ 50
5-34. Schematic Diagram - 4CH DAMP Board (3/4) - ............ 51
5-35. Schematic Diagram - 4CH DAMP Board (4/4) - ............ 52
5-36. Printed Wiring Board - DISPLAY Board - ..................... 53
5-37. Schematic Diagram - DISPLAY Board - ........................ 54
5-38. Printed Wiring Board - TUNER Board - ........................ 55
5-39. Schematic Diagram - TUNER Board - ........................... 55
5-40. Printed Wiring Board - MIC Board - .............................. 56
5-41. Schematic Diagram - MIC Board - ................................. 56
5-42. Printed Wiring Board - USB and VOLUME Board - ..... 57
5-43. Schematic Diagram - USB and VOLUME Board - ........ 58
5-44. Printed Wiring Board - DRIVER Board - ....................... 59
5-45. Schematic Diagram - DRIVER Board - ......................... 60
5-20. Schematic Diagram - 2CH DAMP Board (1/4) - ............ 37
5-21. Schematic Diagram - 2CH DAMP Board (2/4) - ............ 38
5-22. Schematic Diagram - 2CH DAMP Board (3/4) - ............ 39
5-23. Schematic Diagram - 2CH DAMP Board (4/4) - ............ 40
5-24. Printed Wiring Board - 3CH DAMP Board (Side A)...... 41
5-25. Printed Wiring Board - 3CH DAMP Board (Side B)...... 42
5-26. Schematic Diagram - 3CH DAMP Board (1/4) - ............ 43
5-27. Schematic Diagram - 3CH DAMP Board (2/4) - ............ 44
5-28. Schematic Diagram - 3CH DAMP Board (3/4) - ............ 45
5-29. Schematic Diagram - 3CH DAMP Board (4/4) - ............ 46
5-30. Printed Wiring Board - 4CH DAMP Board (Side A)...... 47
5-31. Printed Wiring Board - 4CH DAMP Board (Side B)...... 48
5-32. Schematic Diagram - 4CH DAMP Board (1/4) - ............ 49
5-33. Schematic Diagram - 4CH DAMP Board (2/4) - ............ 50
5-34. Schematic Diagram - 4CH DAMP Board (3/4) - ............ 51
5-35. Schematic Diagram - 4CH DAMP Board (4/4) - ............ 52
5-36. Printed Wiring Board - DISPLAY Board - ..................... 53
5-37. Schematic Diagram - DISPLAY Board - ........................ 54
5-38. Printed Wiring Board - TUNER Board - ........................ 55
5-39. Schematic Diagram - TUNER Board - ........................... 55
5-40. Printed Wiring Board - MIC Board - .............................. 56
5-41. Schematic Diagram - MIC Board - ................................. 56
5-42. Printed Wiring Board - USB and VOLUME Board - ..... 57
5-43. Schematic Diagram - USB and VOLUME Board - ........ 58
5-44. Printed Wiring Board - DRIVER Board - ....................... 59
5-45. Schematic Diagram - DRIVER Board - ......................... 60
6.
EXPLODED VIEWS
6-1. Case Section ................................................................... 72
6-2. Front Panel Section ........................................................ 73
6-3. Back Panel Section ......................................................... 74
6-4. Chassis
6-2. Front Panel Section ........................................................ 73
6-3. Back Panel Section ......................................................... 74
6-4. Chassis
Section
............................................................... 75
6-5. CD Mechanism Section (1)
(CDM74HFV-DVBU101) .............................................. 76
6-6. CD Mechanism Section (2) ............................................. 77
7.
ELECTRICAL PARTS LIST
............................... 78
Ver. 1.3
HCD-GTR333/GTR555/GTR777/GTR888
4
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTE OF REPLACING 2CH/3CH/4CH DAMP BOARD
Thermal Sheet (P/N: 4-265-384-01) which is attached to heat sink
on DAMP board may deform by contact of IC long time. When
you replace DAMP board, please remove the original sheet from
heat sink and attach new one.
Thermal Sheet (P/N: 4-265-384-01) which is attached to heat sink
on DAMP board may deform by contact of IC long time. When
you replace DAMP board, please remove the original sheet from
heat sink and attach new one.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
NOTE OF REPLACING THE IC102 AND IC4605 ON
THE DMB21 BOARD
IC102 and IC4605 on the DMB21 board cannot exchange with
single. When these parts on the DMB21 board are damaged, ex-
change the entire mounted board.
THE DMB21 BOARD
IC102 and IC4605 on the DMB21 board cannot exchange with
single. When these parts on the DMB21 board are damaged, ex-
change the entire mounted board.
RELEASING THE DISC TRAY LOCK
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
Releasing Procedure:
1. Press
1. Press
[I/
1
STANDBY] button to turn the power on.
2. Press the [CD/DISC SKIP] button to select CD function.
3. While pressing the [TV] button, press the [
3. While pressing the [TV] button, press the [
Z
OPEN/CLOSE]
button for more 5 seconds).
4. The message “UNLOCKED” is displayed and the disc tray is
unlocked.
Note: When
“
LOCKED
”
is displayed, the slot lock is not released by
turning power on/off with the
[I/
1
STANDBY]
button.
MODEL IDENTIFICATION
– Back Panel –
– Back Panel –
PART No.
Model
Part No.
HCD-GTR333: E2, E51, AR /
HCD-GTR555: AR
HCD-GTR555: AR
4-265-400-0[]
HCD-GTR333: MX
4-265-400-2[]
HCD-GTR555: E2, E51
4-265-400-5[]
HCD-GTR555: MX
4-265-400-7[]
HCD-GTR777, GTR888: E2, E51, AR
4-265-401-0[]
HCD-GTR777, GTR888: MX
4-265-401-2[]
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
Ver. 1.3
Note: Refer to supplement-1 for the printed wiring board,
schematic diagram and electrical parts list of MAIN board
(Suffi x-13 and Suffi x-21, 41, 51).
(Suffi x-13 and Suffi x-21, 41, 51).