Read Sony HCD-GS200 / MHC-GS200 Service Manual online
23
23
HCD-GS200
SECTION 7
DIAGRAMS
7-1. Circuit Boards Location
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed
in each block.)
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed
in each block.)
For schematic diagrams.
Note:
• All capacitors are in
• All capacitors are in
µ
F unless otherwise noted. pF:
µµ
F
50 WV or less are not indicated except for electrolytics
and tantalums.
and tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
f
: internal component.
•
2
: nonflammable resistor.
•
5
: fusible resistor.
•
C
: panel designation.
For printed wiring boards.
Note:
• X
: parts extracted from the component side.
• Y
: parts extracted from the conductor side.
•
f
: internal component.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
•
A
: B+ Line.
•
B
: B– Line.
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
tion tolerances.
• Circled numbers refer to waveforms.
• Indication of transistor
B
These are omitted.
C
E
C
B
These are omitted.
E
Q
Note:
The components identi-
fied by mark
The components identi-
fied by mark
0
or dotted
line with mark
0
are criti-
cal for safety.
Replace only with part
number specified.
Replace only with part
number specified.
Note:
Les composants identifiés par
une marque
Les composants identifiés par
une marque
0
sont critiques
pour la sécurité.
Ne les remplacer que par une
piéce por tant le numéro
spécifié.
Ne les remplacer que par une
piéce por tant le numéro
spécifié.
• Signal path.
F
: FM
f
: AM
J
: CD
c
: DIGITAL OUT
E
: TAPE (PB)
a
: TAPE (REC)
j
: AUDIO IN
k
: VIDEO IN
• Abbreviation
CND : Canadian model.
Caution:
Pattern face side:
Pattern face side:
Parts on the pattern face side seen from
(Conductor B)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Component A)
the parts face are indicated.
• Waveforms
– CD Board –
– CD Board –
0.96Vp-p
1
IC101 t; (RFAC)
(CD Play Mode)
2
IC101 el (FE)
(CD Play Mode)
200mV/DIV, 1
µs/DIV
100mV/DIV, 200
µs/DIV
100mV/DIV, 200
µs/DIV
1V/DIV, 20ns/DIV
250mVp-p
470mVp-p
3
IC101 ra (TE)
(CD Play Mode)
4
IC104 yd (XO)
3.9Vp-p
59ns
– MAIN Board –
– DISPLAY Board –
6
IC801 qd (XOUT)
1V/DIV, 40ns/DIV
1V/DIV, 20
µs/DIV
5
IC801 qa (SUBXOUT)
3.5Vp-p
30.6
µ
s
3.2Vp-p
62ns
1V/DIV, 100ns/DIV
7
IC701 id (X1)
3.8Vp-p
250ns
MAIN board
AMP board
POWER board
D.SENSOR (OUT) board
T.SENSOR board
D.SENSOR (IN) board
L.T MOTOR board
LOAD SW board
CD LED board
CD board
DISPLAY board
GAME LINK board
DOOR LED board
KEY board
HEADPHONE board
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