Read Sony HCD-GNX60 / HCD-GNX70 / HCD-GX9900 / MHC-GNX60 / MHC-GNX70 / MHC-GX9900 Service Manual online
HCD-GNX60/GNX70/
GX9900
US Model
HCD-GX9900
E Model
Australian Model
HCD-GNX60/GNX70
SERVICE MANUAL
MiNi Hi-Fi COMPONENT SYSTEM
SPECIFICATIONS
Ver. 1.1 2006.06
– Continued on next page –
• HCD-GNX60/GNX70/GX9900 are the Amplifier,
CD player, tape deck and tuner
section in MHC-GNX60/GNX70/GX9900.
section in MHC-GNX60/GNX70/GX9900.
Model Name Using Similar Mechanism
HCD-GN880
CD
CD Mechanism Type
CDM74-F1BD81
Section
Base Unit Name
BU-F1BD81A
Optical Pick-up Name
KSM-215DCP/C2NP
TAPE
Model Name Using Similar Mechanism
NEW
Section
Tape Transport Mechanism Type
CMAT5Z2
AUDIO POWER SPECIFICATION (MHC-GX9900 USA model only)
POWER OUTPUT AND TOTAL HARMONIC DISTORTION:
POWER OUTPUT AND TOTAL HARMONIC DISTORTION:
With 6-ohm loads, both channels driven, from 120 Hz – 10 kHz; rates 230
watts per channel minimum RMS power, with no more than 10% total
harmonic distortion from 250 miliwatts to rated output.
watts per channel minimum RMS power, with no more than 10% total
harmonic distortion from 250 miliwatts to rated output.
Amplifier section MHC-GX9900
Total harmonic distortion
Total harmonic distortion
Less than 0.1%
(6 ohms at 1 kHz, 100 W)
(6 ohms at 1 kHz, 100 W)
MHC-GNX70
The following are measured at
Mexican model:
The following are measured at
Mexican model:
AC 127 V, 60 Hz
Other models:
AC 120, 220, 240 V, 60 Hz
DIN power output (rated)
170 + 170 watts (6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference)
220 + 220 watts (6 ohms at 1 kHz, 10% THD)
MHC-GNX60
The following are measured at
Mexican model:
The following are measured at
Mexican model:
AC 127 V, 60 Hz
Brazil model:
AC 127 V or 220 V, 60 Hz
Other models:
AC 120, 220, 240 V, 50/60 Hz
DIN power output (rated)
150 + 150 watts (6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference)
200 + 200 watts (6 ohms at 1 kHz,10% THD)
Inputs
VIDEO/MD (AUDIO) IN (phono jacks):
VIDEO/MD (AUDIO) IN (phono jacks):
voltage 250/450 mV,
impedance 47 kiloohms
impedance 47 kiloohms
TV (AUDIO) IN (phono jack):
voltage 250 mV,
impedance 47 kiloohms
impedance 47 kiloohms
MIC (phone jack):
sensitivity 1 mV,
impedance 10 kiloohms
impedance 10 kiloohms
Outputs
PHONES (stereo mini jack):
PHONES (stereo mini jack):
accepts headphones of
8 ohms or more
8 ohms or more
FRONT SPEAKER:
Use only the supplied speaker
• SS-GNX100 (MHC-GNX70/GX9900)
• SS-GNX60 (MHC-GNX60)
• SS-GNX100 (MHC-GNX70/GX9900)
• SS-GNX60 (MHC-GNX60)
SURROUND SPEAKER: Use only the supplied speaker
• SS-RSX80 (MHC-GNX70/GX9900)
Disc player section
System
System
Compact disc and digital audio system
Laser
Semiconductor laser (l=780 nm)
Emission duration: continuous
Emission duration: continuous
Laser Output
Max. 44.6 mW*
*This output is the value measured at a
distance of 200 mm from the objective
lens surface on the Optical Pick-up Block
with 7 mm aperture.
*This output is the value measured at a
distance of 200 mm from the objective
lens surface on the Optical Pick-up Block
with 7 mm aperture.
Frequency response
2 Hz – 20 kHz (
±0.5 dB)
Wave length
780 – 790 nm
Signal-to-noise ratio
More than 90 dB
Dynamic range
More than 90 dB
OPTICAL CD DIGITAL OUT (Square optical connector jack, rear panel)
(For MHC-GNX60/GNX70)
Wave length
(For MHC-GNX60/GNX70)
Wave length
660 nm
Output Level
–18 dBm
Photo : HCD-GNX70
Sony Corporation
Home Audio Division
Published by Sony Techno Create Corporation
Published by Sony Techno Create Corporation
9-879-532-02
2006F02-1
© 2006.06
© 2006.06
2
HCD-GNX60/GNX70/GX9900
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
This appliance is classified as
a CLASS 1 LASER product.
This label is located on the rear
exterior.
a CLASS 1 LASER product.
This label is located on the rear
exterior.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
Tape deck section
Recording system
Recording system
4-track 2-channel stereo
Frequency response
50 – 13,000 Hz (
±3 dB),
using Sony TYPE I tape
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
87.5 – 108.0 MHz
Antenna
FM lead antenna
Antenna terminals
75 ohm unbalanced
Intermediate frequency
10.7 MHz
AM tuner section
Tuning range
North and Latin American models:
530 – 1,710 kHz
(with the interval set at 10 kHz)
531 – 1,710 kHz
(with the interval set at 9 kHz)
(with the interval set at 10 kHz)
531 – 1,710 kHz
(with the interval set at 9 kHz)
Other models:
531 – 1,602 kHz
(with the interval set at 9 kHz)
530 – 1,710 kHz
(with the interval set at 10 kHz)
(with the interval set at 9 kHz)
530 – 1,710 kHz
(with the interval set at 10 kHz)
Antenna
AM loop antenna
Antenna terminals
External antenna terminal
Intermediate frequency
450 kHz
General
Power requirements
North American model:
Power requirements
North American model:
120 V AC, 60Hz
Australian model:
230 – 240 V AC, 50/60 Hz
Argentina model:
220 V AC, 50/60 Hz
Other models:
120 V, 220 V or 230 – 240 V AC, 50/60 Hz
Adjustable with voltage selector
Adjustable with voltage selector
Power consumption
MHC-GX9900
MHC-GX9900
250 watts
MHC-GNX70
225 watts
MHC-GNX60
200 watts
Dimensions (w/h/d) (Approx.)
280
× 360 × 398.5 mm
Mass (Approx.)
HCD-GNX70
HCD-GNX70
12.1 kg
HCD-GX9900
11.8 kg
HCD-GNX60
11.3 kg
Design and specifications are subject to change without notice.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40
°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
After correcting the original service problem, perform the following
safety checks before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, screws,
and all other exposed metal parts for AC leakage. Check leakage as
described below.
safety checks before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, screws,
and all other exposed metal parts for AC leakage. Check leakage as
described below.
LEAKAGE
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes).
Leakage current can be measured by any one of three methods.
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2V AC range are suitable. (See
Fig. A)
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2V AC range are suitable. (See
Fig. A)
SAFETY CHECK-OUT
To Exposed Metal
Parts on Set
0.15 µF
1.5 kΩ
AC
Voltmeter
(0.75 V)
Voltmeter
(0.75 V)
Earth Ground
Fig. A. Using an AC voltmeter to check AC leakage.
3
HCD-GNX60/GNX70/GX9900
TABLE OF CONTENTS
1.
SERVICING NOTES
................................................
4
2.
GENERAL
Location of Controls ........................................................
5
3.
DISASSEMBLY
3-1.
Disassembly Flow ...........................................................
7
3-2.
Side Panel, Top Case .......................................................
8
3-3.
Loading Panel Assy .........................................................
8
3-4.
Front Panel Assy ..............................................................
9
3-5.
Tuner Pack .......................................................................
9
3-6.
Tape Mechanism Deck, Mic Board ................................. 10
3-7.
Panel Board, CD-SW Board ............................................ 10
3-8.
CD Mechanism Deck ...................................................... 11
3-9.
Back Panel ....................................................................... 11
3-10. Primary Board ................................................................. 12
3-11. Power AMP PC Board Assy, Main Board ....................... 12
3-12. Surround Board, PA Board .............................................. 13
3-13. Power Transformer (T1200) ............................................ 13
3-14. Driver Board, SW Board ................................................. 14
3-15. CD Board ......................................................................... 14
3-16. Sensor Board ................................................................... 15
3-17. Motor (TB) Board ........................................................... 15
3-18. Motor (LD) Board ........................................................... 16
3-11. Power AMP PC Board Assy, Main Board ....................... 12
3-12. Surround Board, PA Board .............................................. 13
3-13. Power Transformer (T1200) ............................................ 13
3-14. Driver Board, SW Board ................................................. 14
3-15. CD Board ......................................................................... 14
3-16. Sensor Board ................................................................... 15
3-17. Motor (TB) Board ........................................................... 15
3-18. Motor (LD) Board ........................................................... 16
4.
TEST MODE
.............................................................. 17
5.
MECHANICAL ADJUSTMENTS
....................... 21
6.
ELECTRICAL ADJUSTMENTS
Deck section .................................................................... 21
CD Section ...................................................................... 22
CD Section ...................................................................... 22
7.
DIAGRAMS
7-1.
Circuit Board Location .................................................... 26
7-2.
Block Diagram – CD Section – ...................................... 27
7-3.
Block Diagram – Tape Section – .................................... 28
7-4.
Block Diagram – Main Section – ................................... 29
7-5.
Block Diagram – AMP Section – ................................... 30
7-6.
Block Diagram – Display Section – ............................... 31
7-7.
Printed Wiring Board – CD Board – .............................. 32
7-8.
Schematic Diagram – CD Board – ................................. 33
7-9.
Printed Wiring Board – CD Mechanism Boards – ......... 34
7-10. Schematic Diagram – CD Mechanism Boards – ............ 35
7-11. Printed Wiring Boards – Main Board – .......................... 36
7-12. Schematic Diagram – Main Board (1/3) – ..................... 37
7-13. Schematic Diagram – Main Board (2/3) – ..................... 38
7-14. Schematic Diagram – Main Board (3/3) – ..................... 39
7-15. Printed Wiring Boards – Panel Board – ......................... 40
7-16. Schematic Diagram – Panel Board – ............................... 41
7-17. Printed Wiring Board – CD-SW, Jog, Mic Boards – ...... 42
7-18. Schematic Diagram – CD-SW, Jog, Mic Boards – ........ 43
7-19. Printed Wiring Board – PA Board – ............................... 44
7-20. Schematic Diagram – PA Board – .................................. 45
7-21. Printed Wiring Board – Trans, Primary Boards – .......... 46
7-22. Schematic Diagram – Trans, Primary Boards – ............. 47
7-23. IC Pin Function Description ............................................ 50
7-11. Printed Wiring Boards – Main Board – .......................... 36
7-12. Schematic Diagram – Main Board (1/3) – ..................... 37
7-13. Schematic Diagram – Main Board (2/3) – ..................... 38
7-14. Schematic Diagram – Main Board (3/3) – ..................... 39
7-15. Printed Wiring Boards – Panel Board – ......................... 40
7-16. Schematic Diagram – Panel Board – ............................... 41
7-17. Printed Wiring Board – CD-SW, Jog, Mic Boards – ...... 42
7-18. Schematic Diagram – CD-SW, Jog, Mic Boards – ........ 43
7-19. Printed Wiring Board – PA Board – ............................... 44
7-20. Schematic Diagram – PA Board – .................................. 45
7-21. Printed Wiring Board – Trans, Primary Boards – .......... 46
7-22. Schematic Diagram – Trans, Primary Boards – ............. 47
7-23. IC Pin Function Description ............................................ 50
8.
EXPLODED VIEWS
8-1.
Case (Top), Rear Panel Section ....................................... 56
8-2.
Front Panel Section ......................................................... 57
8-3.
Chassis Section ................................................................ 58
8-4.
CD Mechanism Deck Section-1
(CDM74-F1BD81) .......................................................... 59
8-5. CD Mechanism Deck Section-2
(CDM74-F1BD81) .......................................................... 60
9.
ELECTRICAL PARTS LIST
................................ 61
4
HCD-GNX60/GNX70/GX9900
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
CHECK
Carry out the “S curve check” in “CD section adjustment” and check
that the S curve waveform is output several times.
that the S curve waveform is output several times.
• MODEL IDENTIFICATION
– Back Panel –
– Back Panel –
MODEL
PART No.
GNX60: E2, E3 models
2-547-454-0[]
GNX70: E2, E3 models
2-547-456-0[]
GX9900 model
2-547-458-0[]
GNX60: AR model
2-588-965-0[]
GNX60: E51 model
2-588-966-0[]
GNX70: AUS model
2-588-967-0[]
GNX70: E51 model
2-588-968-0[]
GNX60: AUS model
2-588-974-0[]
• Abbreviation
AR
: Argentine model
E2
: 120 V AC Area in E model
E3
: 240 V AC Area in E model
E51 : Chilean and Peruvian model
AUS : Australian model
AUS : Australian model
PART No.