Read Sony HCD-EC68USB / MHC-EC68USB Service Manual online
SERVICE MANUAL
Sony Corporation
Audio Business Group
Published by Sony Techno Create Corporation
HCD-EC68USB
SPECIFICATIONS
COMPACT DISC RECEIVER
9-889-055-02
2008F05-1
©
2008.06
AEP Model
E Model
Ver. 1.1 2008.06
• HCD-EC68USB is the amplifi er, USB, CD player
and tuner section in MHC-EC68USB.
Model Name Using Similar Mechanism
NEW
Mechanism Type
CDM88A-K6BD91UR-WOD
Base Unit Name
BU-K6BD91UR-WOD
Optical Pick-up Block Name
KSM-213DCP
European model:
Power output (rated):
Power output (rated):
70 W + 70 W (at 6 Ω, 1 kHz,
1% THD)
1% THD)
RMS output power (reference):
90 W + 90 W (per channel at 6 Ω,
1 kHz, 10% THD)
1 kHz, 10% THD)
Other models:
220, 240 V, 50/60 Hz
Power output (rated):
Power output (rated):
50 W + 50 W (at 6 Ω, 1 kHz,
1% THD)
1% THD)
RMS output power (reference):
70 W + 70 W (per channel at 6 Ω,
1 kHz, 10% THD)
1 kHz, 10% THD)
Inputs
AUDIO IN (stereo mini jack):
Sensitivity 800 mV, impedance 22 kilohms
Sensitivity 800 mV, impedance 22 kilohms
(USB) port: Type A
Outputs
PHONES (stereo mini jack): accepts
headphones with an impedance of 8 Ω or
more
SPEAKER: impedance
6 Ω
headphones with an impedance of 8 Ω or
more
SPEAKER: impedance
6 Ω
USB section
Supported bit rate
MP3 (MPEG 1 Audio Layer-3):
32 − 320 kbps, VBR
32 − 320 kbps, VBR
Sampling frequencies
MP3 (MPEG 1 Audio Layer-3):
32/44.1/48 kHz
32/44.1/48 kHz
Transfer speed
Full-Speed
Supported USB device
Mass Storage Class
Maximum current
500 mA
CD player section
System: Compact disc and digital audio
system
Laser: Semiconductor laser (λ=770 −
810 nm)
Emission duration: continuous
Frequency response: 20 Hz − 20 kHz
Signal-to-noise ratio: More than 90 dB
Dynamic range: More than 88 dB
system
Laser: Semiconductor laser (λ=770 −
810 nm)
Emission duration: continuous
Frequency response: 20 Hz − 20 kHz
Signal-to-noise ratio: More than 90 dB
Dynamic range: More than 88 dB
Tuner section
FM stereo, FM/AM superheterodyne tuner
Antenna:
Antenna:
FM lead antenna
AM loop antenna
AM loop antenna
FM tuner section:
Tuning range:
87.5 − 108.0 MHz (50 kHz step)
Intermediate frequency: 10.7 MHz
AM tuner section:
Tuning range
European model:
European model:
531 − 1,602 kHz
(with 9 kHz tuning interval)
(with 9 kHz tuning interval)
Other models:
530 − 1,710 kHz
(with 10 kHz tuning interval)
531 − 1,710 kHz
(with 9 kHz tuning interval)
(with 10 kHz tuning interval)
531 − 1,710 kHz
(with 9 kHz tuning interval)
Intermediate frequency: 450 kHz
General
Power requirements
European model:
AC 230 V, 50/60 Hz
Mexican model: AC 127 V, 60 Hz
Argentine model: AC 220 V, 50/60 Hz
Other models: AC 120, 220 or 230 – 240 V,
50/60 Hz, adjustable with voltage selector
European model:
AC 230 V, 50/60 Hz
Mexican model: AC 127 V, 60 Hz
Argentine model: AC 220 V, 50/60 Hz
Other models: AC 120, 220 or 230 – 240 V,
50/60 Hz, adjustable with voltage selector
Power consumption
European model:
European model:
130 W
0.5 W (in Power Saving Mode)
0.5 W (in Power Saving Mode)
Other models: 110 W
Dimensions (w/h/d) (excl. speakers)
Dimensions (w/h/d) (excl. speakers)
Approx. 200 × 306 × 415 mm
Mass (excl. speakers)
European model:
6.0 kg
Other models:
5.6 kg
6.0 kg
Other models:
5.6 kg
change without notice.
HCD-EC68USB
2
1.
SERVICING NOTES
............................................. 3
2. GENERAL
.................................................................. 7
3. DISASSEMBLY
3-1. Disassembly
Flow
........................................................... 8
3-2. Side
Panel
(L)/(R)
........................................................... 9
3-3. Panel
(Top)
...................................................................... 9
3-4. MAIN
Board
................................................................... 10
3-5. Front Panel Block ........................................................... 10
3-6. Back Panel Block ............................................................ 11
3-7. 3 CD Mechanism Block .................................................. 11
3-8. Base
3-6. Back Panel Block ............................................................ 11
3-7. 3 CD Mechanism Block .................................................. 11
3-8. Base
Unit
......................................................................... 12
3-9. OP Base Assy (KSM-213D) ........................................... 12
3-10. Belt (DLM3A) ................................................................ 13
3-10. Belt (DLM3A) ................................................................ 13
4.
TEST MODE
............................................................ 14
5. ELECTRICAL
ADJUSTMENTS
........................ 18
6. DIAGRAMS
6-1. Block Diagram - CD SERVO, TUNER Section - ........... 20
6-2. Block Diagram - USB Section - ..................................... 21
6-3. Block Diagram - MAIN Section - ................................... 22
6-4. Printed Wiring Board - CD Board - ................................ 24
6-5. Schematic Diagram - CD Board - ................................... 25
6-6. Printed Wiring Boards - USB Section - .......................... 26
6-7. Schematic Diagram - USB Section - .............................. 27
6-8. Printed
6-2. Block Diagram - USB Section - ..................................... 21
6-3. Block Diagram - MAIN Section - ................................... 22
6-4. Printed Wiring Board - CD Board - ................................ 24
6-5. Schematic Diagram - CD Board - ................................... 25
6-6. Printed Wiring Boards - USB Section - .......................... 26
6-7. Schematic Diagram - USB Section - .............................. 27
6-8. Printed
Wiring
Board
- MAIN Board (Suffi x-12/-13) - ..................................... 28
6-9. Printed Wiring Board - MAIN Board (Suffi x-14) - ........ 29
6-10. Schematic Diagram - MAIN Board (1/2) - ..................... 30
6-11. Schematic Diagram - MAIN Board (2/2) - ..................... 31
6-12. Printed Wiring Board - LOW AMP Board - ................... 32
6-13. Schematic Diagram - LOW AMP Board - ...................... 32
6-14. Printed Wiring Boards - KEY Section - .......................... 33
6-15. Schematic Diagram - KEY Section - .............................. 33
6-16. Printed Wiring Board - PANEL Board (Suffi x-12) - ...... 34
6-17. Printed Wiring Board - PANEL Board (Suffi x-13) - ...... 35
6-18. Printed Wiring Board - PANEL Board (Suffi x-14) - ...... 36
6-19. Schematic Diagram - PANEL Board - ............................ 37
6-20. Printed Wiring Board - PT Board - ................................. 38
6-21. Schematic Diagram - PT Board - .................................... 39
6-10. Schematic Diagram - MAIN Board (1/2) - ..................... 30
6-11. Schematic Diagram - MAIN Board (2/2) - ..................... 31
6-12. Printed Wiring Board - LOW AMP Board - ................... 32
6-13. Schematic Diagram - LOW AMP Board - ...................... 32
6-14. Printed Wiring Boards - KEY Section - .......................... 33
6-15. Schematic Diagram - KEY Section - .............................. 33
6-16. Printed Wiring Board - PANEL Board (Suffi x-12) - ...... 34
6-17. Printed Wiring Board - PANEL Board (Suffi x-13) - ...... 35
6-18. Printed Wiring Board - PANEL Board (Suffi x-14) - ...... 36
6-19. Schematic Diagram - PANEL Board - ............................ 37
6-20. Printed Wiring Board - PT Board - ................................. 38
6-21. Schematic Diagram - PT Board - .................................... 39
7.
EXPLODED VIEWS
7-1. Panel
Section
................................................................... 48
7-2. Front Panel Section ......................................................... 49
7-3. Chassis
7-3. Chassis
Section
............................................................... 50
7-4. Main
Section
................................................................... 51
7-5. 3 CD Mechanism Section
(CDM88A-K6BD91UR-WOD)
(CDM88A-K6BD91UR-WOD)
......................................
52
8.
ELECTRICAL PARTS LIST
.............................. 53
Note: Refer to “Suffi x-14” for DIAGRAMS of 120V AC area in E
model.
TABLE OF CONTENTS
Notes on chip component replacement
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
Flexible Circuit Board Repairing
•
•
Keep the temperature of soldering iron around 270 °C during
repairing.
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
or unsoldering.
This appliance is
classified as a CLASS 1
LASER product. This
marking is located on the
rear exterior.
classified as a CLASS 1
LASER product. This
marking is located on the
rear exterior.
CAUTION
Use of controls or adjustments or performance of procedures other than
those specifi ed herein may result in hazardous radiation exposure.
Use of controls or adjustments or performance of procedures other than
those specifi ed herein may result in hazardous radiation exposure.
SAFETY-RELATED COMPONET WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
Ver. 1.1
HCD-EC68USB
3
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostat-
ic break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
ic break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
RELEASING THE DISC TRAY LOCK
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
Releasing Procedure:
1. Press
1. Press
[
?/1
] button to turn the power on.
2. Press the [FUNCTION] button to select CD function.
3. While pressing the [
3. While pressing the [
x
] button, press the [
Z
] button for more 5
seconds).
4. The message “UNLOCKED” is displayed and the disc tray is
unlocked.
Note: When
“
LOCKED
”
is displayed, the slot lock is not released by
turning power on/off with the
[
?/1
]
button.
Model
Part No.
AEP model
3-398-095-0[]
120V AC area in E, Chilean and Peruvian
models
models
3-398-096-0[]
Mexican model
3-398-097-0[]
Argentina model
3-398-098-0[]
MODEL IDENTIFICATION
– Back Panel –
– Back Panel –
MODEL
NUMBER
LABEL
NUMBER
LABEL
Ver. 1.1
HCD-EC68USB
4
SUFFIX-12/-13/-14 DISCRIMINATION OF PRINTED WIRING BOARDS
– MAIN Board (Component Side) –
– PANEL Board (Component Side) –
– USB CONN Board (Component Side) –
– JACK Board (Component Side) –
Suffix-12 : 1-875-488-12
Suffix-13 : 1-875-488-13
Suffix-14 : 1-875-488-14
Suffix-13 : 1-875-488-13
Suffix-14 : 1-875-488-14
Suffix-12 : 1-875-490-12
Suffix-13 : 1-875-490-13
Suffix-14 : 1-875-490-14
Suffix-13 : 1-875-490-13
Suffix-14 : 1-875-490-14
Suffix-12 : 1-875-497-12
Suffix-13 : 1-875-497-13
Suffix-14 : 1-875-497-14
Suffix-13 : 1-875-497-13
Suffix-14 : 1-875-497-14
Suffix-12 : 1-875-493-12
Suffix-13 : 1-875-493-13
Suffix-14 : 1-875-493-14
Suffix-13 : 1-875-493-13
Suffix-14 : 1-875-493-14