Read Sony HCD-CX5BIP Service Manual online
HCD-CX5BiP
2
1.
SERVICING NOTES
............................................. 3
2. DISASSEMBLY
2-1. Disassembly
Flow
........................................................... 5
2-2. Panel (Back) Block ......................................................... 5
2-3. Panel (Front) Block ......................................................... 6
2-4. CD Mechanism Deck (CDM80BTK-F4BD94D-V) ....... 7
2-5. MAIN
2-3. Panel (Front) Block ......................................................... 6
2-4. CD Mechanism Deck (CDM80BTK-F4BD94D-V) ....... 7
2-5. MAIN
Board
................................................................... 8
2-6. Belt
(MOT)
..................................................................... 9
2-7. Base Unit (BU-F4BD94D-V) ......................................... 9
2-8. Optical Pick-up (KSM-215CFP) .................................... 10
2-8. Optical Pick-up (KSM-215CFP) .................................... 10
3.
TEST MODE
............................................................ 11
4.
ELECTRICAL CHECK
.........................................
12
5. DIAGRAMS
5-1. Block Diagram - AUDIO INPUT, PANEL Section - ...... 13
5-2. Block
5-2. Block
Diagram
- AUDIO OUTPUT, POWER SUPPLY Section - .......... 14
5-3. Printed Wiring Board - BD94D-V Board - ..................... 16
5-4. Schematic Diagram - BD94D-V Board - ........................ 17
5-5. Printed Wiring Boards - MAIN Section (1/2) - .............. 18
5-6. Printed Wiring Board - MAIN Section (2/2) - ................ 19
5-7. Schematic Diagram - MAIN Section (1/4) - ................... 20
5-8. Schematic Diagram - MAIN Section (2/4) - ................... 21
5-9. Schematic Diagram - MAIN Section (3/4) - ................... 22
5-10. Schematic Diagram - MAIN Section (4/4) - ................... 23
5-11. Printed Wiring Board - DAB Board - ............................. 24
5-12. Schematic Diagram - DAB Board - ................................ 24
5-13. Printed Wiring Boards - PANEL Section - ..................... 25
5-14. Schematic Diagram - FL Board - .................................... 26
5-15. Schematic Diagram - PANEL Section - .......................... 27
5-4. Schematic Diagram - BD94D-V Board - ........................ 17
5-5. Printed Wiring Boards - MAIN Section (1/2) - .............. 18
5-6. Printed Wiring Board - MAIN Section (2/2) - ................ 19
5-7. Schematic Diagram - MAIN Section (1/4) - ................... 20
5-8. Schematic Diagram - MAIN Section (2/4) - ................... 21
5-9. Schematic Diagram - MAIN Section (3/4) - ................... 22
5-10. Schematic Diagram - MAIN Section (4/4) - ................... 23
5-11. Printed Wiring Board - DAB Board - ............................. 24
5-12. Schematic Diagram - DAB Board - ................................ 24
5-13. Printed Wiring Boards - PANEL Section - ..................... 25
5-14. Schematic Diagram - FL Board - .................................... 26
5-15. Schematic Diagram - PANEL Section - .......................... 27
6.
EXPLODED VIEWS
6-1. Panel (Back) Section ....................................................... 38
6-2. Panel (Front) Section ...................................................... 39
6-3. DAB
6-2. Panel (Front) Section ...................................................... 39
6-3. DAB
Tuner
Section
......................................................... 40
6-4. Chassis
Section
............................................................... 41
6-5. CD Mechanism Deck Section
(CDM80BTK-F4BD94D-V)
(CDM80BTK-F4BD94D-V)
..........................................
42
6-6. Base Unit Section (BU-F4BD94D-V) ............................ 43
7.
ELECTRICAL PARTS LIST
.............................. 44
TABLE OF CONTENTS
NOTES ON CHIP COMPONENT REPLACEMENT
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
•
•
Keep the temperature of soldering iron around 270 °C during
repairing.
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK
0 OR DOTTED LINE
WITH MARK
0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
exceeding the limit for Class 1.
iPhone, iPod, iPod classic, iPod nano, and iPod touch
are trademarks of Apple Inc., registered in the U.S. and
other countries.
MPEG Layer-3 audio coding technology and patents
licensed from Fraunhofer IIS and Thomson.
Windows Media is either a registered trademark or
trademark of Microsoft Corporation in the United
States and/or other countries.
This product is protected by certain intellectual
property rights of Microsoft Corporation. Use or
distribution of such technology outside of this product
is prohibited without a license from Microsoft or an
authorized Microsoft subsidiary.
All other trademarks and registered trademarks are of
their respective holders. In this manual,
are trademarks of Apple Inc., registered in the U.S. and
other countries.
MPEG Layer-3 audio coding technology and patents
licensed from Fraunhofer IIS and Thomson.
Windows Media is either a registered trademark or
trademark of Microsoft Corporation in the United
States and/or other countries.
This product is protected by certain intellectual
property rights of Microsoft Corporation. Use or
distribution of such technology outside of this product
is prohibited without a license from Microsoft or an
authorized Microsoft subsidiary.
All other trademarks and registered trademarks are of
their respective holders. In this manual,
™
and
®
marks
are not specified.
This appliance is classified
as a CLASS 1 LASER
product. This marking
is located on the bottom
exterior of the main unit.
as a CLASS 1 LASER
product. This marking
is located on the bottom
exterior of the main unit.
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