HCD-CX5BIP - Sony Audio Service Manual (repair manual)

hcd-cx5bip service manual
Model
HCD-CX5BIP
Pages
54
Size
2.6 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
hcd-cx5bip.pdf
Date

Read Sony HCD-CX5BIP Service Manual online

SERVICE MANUAL
Sony Corporation
Published by Sony Techno Create Corporation
HCD-CX5BiP
SPECIFICATIONS
COMPACT DISC RECEIVER
9-893-212-02
2013D33-1
© 
2013.04
AEP Model
UK Model
Australian Model
Ver. 1.1  2013.04
Model Name Using Similar Mechanism
NEW
CD Mechanism Type
CDM80BTK-F4BD94D-V
Base Unit Name
BU-F4BD94D-V
Optical Pick-up Block Name
KSM-215CFP
• HCD-CX5BiP 
is 
the 
Amplifi er, CD player, Tuner, 
and iPod/iPhone section in CMT-CX5BiP.
Amplifier section
AEP, UK models:
DIN power output (rated): 15 watts + 15 watts (8 ohms at 1 kHz, DIN)
Continuous RMS power output (reference): 20 watts + 20 watts (8 ohms at 
1 kHz, 10% THD)
Music power output (reference): 20 watts + 20 watts (8 ohms at 1 kHz, 10% 
THD)
Australian model:
DIN power output (rated): 15 watts + 15 watts (8 ohms at 1 kHz, DIN)
Continuous RMS power output (reference): 20 watts + 20 watts (8 ohms at 
1 kHz, 10% THD)
Input
AUDIO IN (stereo mini jack): Sensitivity 700 mV, impedance 47 kilohms
Outputs
SPEAKERS: Accepts impedance of 8 ohms
CD player section
System: Compact disc and digital audio system
Laser Diode Properties
Emission Duration: Continuous
Laser Output*: Less than 44.6μW
* This output is the value measurement at a distance of 200mm from the 
objective lens surface on the Optical Pick-up Block with 7mm aperture.
Frequency response: 20 Hz   20 kHz
Signal-to-noise ratio: More than 90 dB
Dynamic range: More than 90 dB
Tuner section
FM stereo, FM superheterodyne tuner
Tuning range:
87.5 MHz   108.0 MHz (50 kHz step)
Antenna: FM lead antenna
DAB/DAB+ tuner section:
FM stereo, DAB/FM superheterodyne tuner
Frequency range*
Band-III: 174.928 (5A) MHz   239.200 (13F) MHz
* For details, see “DAB/DAB+ frequency table” below.
Antenna: DAB/FM lead antenna
DAB/DAB+ frequency table (Band-III)
Frequency
Label
Frequency
Label
174.928 MHz
5A
209.936 MHz
10A
176.640 MHz
5B
211.648 MHz
10B
178.352 MHz
5C
213.360 MHz
10C
180.064 MHz
5D
215.072 MHz
10D
181.936 MHz
6A
216.928 MHz
11A
183.648 MHz
6B
218.640 MHz
11B
185.360 MHz
6C
220.352 MHz
11C
187.072 MHz
6D
222.064 MHz
11D
188.928 MHz
7A
223.936 MHz
12A
190.640 MHz
7B
225.648 MHz
12B
192.352 MHz
7C
227.360 MHz
12C
194.064 MHz
7D
229.072 MHz
12D
195.936 MHz
8A
230.784 MHz
13A
197.648 MHz
8B
232.496 MHz
13B
199.360 MHz
8C
234.208 MHz
13C
201.072 MHz
8D
235.776 MHz
13D
202.928 MHz
9A
237.488 MHz
13E
204.640 MHz
9B
239.200 MHz
13F
206.352 MHz
9C
208.064 MHz
9D
* Frequencies are displayed to two decimal places on this system.
iPod/iPhone section
Compatible iPod/iPhone models:
 iPod touch 4th generation
 iPod touch 3rd generation
 iPod touch 2nd generation
 iPod touch 1st generation
 iPod nano 6th generation
 iPod nano 5th generation (video camera) 
 iPod nano 4th generation (video) 
 iPod nano 3rd generation (video) 
 iPod nano 2nd generation (aluminum)
 iPod  classic 
iPhone 4
iPhone 3GS
iPhone 3G
iPhone
“Made for iPod,” and “Made for iPhone” mean that an electronic accessory has 
been designed to connect specifically to iPod or iPhone, respectively, and has 
been certified by the developer to meet Apple performance standards. Apple 
is not responsible for the operation of this device or its compliance with safety 
and regulatory standards. Please note that the use of this accessory with iPod 
or iPhone may affect wireless performance.
General
Power requirements:
AC adapter
Input: 100 V   240 V AC, 50/60 Hz
Output: DC 19.5 V 3.9A
Power consumption: 24 watts
Dimensions (W/H/D) (excl. speakers): 
Approx. 250 mm × 245 mm × 130 mm
Mass (excl. speakers): Approx. 2.2 kg
Quantity of the main unit: 1 piece
Design and specifications are subject to change without notice.
Standby power consumption: 0.5 W
HCD-CX5BiP
2
1. 
SERVICING  NOTES
  .............................................   3
2. DISASSEMBLY
2-1. Disassembly 
Flow 
...........................................................   5
2-2.  Panel (Back) Block .........................................................   5
2-3.  Panel (Front) Block .........................................................   6
2-4.  CD Mechanism Deck (CDM80BTK-F4BD94D-V) .......   7
2-5. MAIN 
Board 
...................................................................   8
2-6. Belt 
(MOT) 
.....................................................................   9
2-7.  Base Unit (BU-F4BD94D-V) .........................................   9
2-8.  Optical Pick-up (KSM-215CFP) ....................................   10
3. 
TEST  MODE 
 ............................................................   11
4. 
ELECTRICAL  CHECK 
 .........................................
 
12
5. DIAGRAMS
5-1.  Block Diagram - AUDIO INPUT, PANEL Section - ......   13
5-2. Block 
Diagram 
- AUDIO OUTPUT, POWER SUPPLY Section - ..........   14
5-3.  Printed Wiring Board - BD94D-V Board - .....................   16
5-4.  Schematic Diagram - BD94D-V Board - ........................   17
5-5.  Printed Wiring Boards - MAIN Section (1/2) - ..............   18
5-6.  Printed Wiring Board - MAIN Section (2/2) - ................   19
5-7.  Schematic Diagram - MAIN Section (1/4) - ...................   20
5-8.  Schematic Diagram - MAIN Section (2/4) - ...................   21
5-9.  Schematic Diagram - MAIN Section (3/4) - ...................   22
5-10.  Schematic Diagram - MAIN Section (4/4) - ...................   23
5-11.  Printed Wiring Board - DAB Board - .............................   24
5-12.  Schematic Diagram - DAB Board - ................................   24
5-13.  Printed Wiring Boards - PANEL Section - .....................   25
5-14.  Schematic Diagram - FL Board - ....................................   26
5-15.  Schematic Diagram - PANEL Section - ..........................   27
6. 
EXPLODED  VIEWS
6-1.  Panel (Back) Section .......................................................   38
6-2.  Panel (Front) Section ......................................................   39
6-3. DAB 
Tuner 
Section 
.........................................................  40
6-4. Chassis 
Section 
...............................................................  41
6-5.  CD Mechanism Deck Section 
 (CDM80BTK-F4BD94D-V) 
..........................................  
42
6-6.  Base Unit Section (BU-F4BD94D-V) ............................   43
7. 
ELECTRICAL  PARTS  LIST
  ..............................   44
TABLE  OF  CONTENTS
NOTES  ON  CHIP  COMPONENT  REPLACEMENT
• 
Never reuse a disconnected chip component.
• 
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
FLEXIBLE  CIRCUIT  BOARD  REPAIRING
• 
Keep the temperature of soldering iron around 270 °C during 
repairing.
• 
Do not touch the soldering iron on the same conductor of the 
circuit board (within 3 times).
• 
Be careful not to apply force on the conductor when soldering 
or unsoldering.
SAFETY-RELATED  COMPONENT  WARNING!
COMPONENTS  IDENTIFIED  BY  MARK  
0  OR  DOTTED  LINE  
WITH  MARK  
0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 
 
WHOSE  PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  
MANUAL  OR  IN  SUPPLEMENTS  PUBLISHED  BY  SONY.
Laser component in this product is capable of emitting radiation 
exceeding the limit for Class 1.
iPhone, iPod, iPod classic, iPod nano, and iPod touch 
are trademarks of Apple Inc., registered in the U.S. and 
other countries.
MPEG Layer-3 audio coding technology and patents 
licensed from Fraunhofer IIS and Thomson.
Windows Media is either a registered trademark or 
trademark of Microsoft Corporation in the United 
States and/or other countries.
This product is protected by certain intellectual 
property rights of Microsoft Corporation. Use or 
distribution of such technology outside of this product 
is prohibited without a license from Microsoft or an 
authorized Microsoft subsidiary.
All other trademarks and registered trademarks are of 
their respective holders. In this manual, 
 and 
®
 marks 
are not specified.
This appliance is classified 
as a CLASS 1 LASER 
product. This marking 
is located on the bottom 
exterior of the main unit.
HCD-CX5BiP
3
SECTION  1
SERVICING  NOTES
UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 
the lead free mark due to their particular size)
 : LEAD  FREE  MARK
Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 
than ordinary solder.
 
Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.
 
Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 
the heated tip is applied for too long, so be careful!
• Strong 
viscosity
 
Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.
• 
Usable with ordinary solder
 
It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.
NOTES  ON  HANDLING  THE OPTICAL  PICK-UP  
BLOCK  OR  BASE  UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by 
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.
NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.
RELEASING  THE  DISC  SLOT  LOCK
The disc slot lock function for the antitheft of an demonstration 
disc in the store is equipped.
Releasing Procedure:
1.  Press the [
?/1
] button to turn the power on.
2.  Press two buttons of [
x
] and [
Z
] for 5 seconds.
3.  The message “UNLOCKED” is displayed on the fl uorescent 
indicator tube and the disc slot is unlocked.
Note: When “LOCKED”is displayed, the disc slot lock is not released by 
turning power on/off with the [?/1] button.
NOTE  OF  REPLACING  THE  DRIVER  BOARD
When the DRIVER board is damaged, exchange the entire 
CDM80BTK ASSY.
MODEL  IDENTIFICATION
Part No.
Model
Part No.
AEP and UK models (black color type)
4-286-923-0[]
AEP and UK models (white color type)
4-286-924-0[]
Australian model (black color type)
4-286-925-0[]
Australian model (white color type)
4-286-926-0[]
CAPACITOR  ELECTRICAL  DISCHARGE  PROCESSING
When checking the board, the electrical discharge is necessary for 
the electric shock prevention.
Connect the resistors referring to the fi gure below.
•  MAIN board (C310, C312, C735 or C736)
  Both ends of respective capacitors.
– MAIN Board (Side A) –
(To both ends of one capacitor in these capacitors)
C312
C310
C736
C735
800 
:/2 W
HCD-CX5BiP
4
HOW  TO  EJECT  THE  DISC  WHEN  POWER  SWITCH  TURNS  OFF
Note: Please take out the CD mechanism block from a set referring to “SECTION 2 DISASSEMBLY”.
SERVICE  POSITION
disc
The CD mechanism deck is taken out, and please 
rotate the pulley in the direction of the arrow after 
detaching and take out the disc.
– CD mechanism deck block bottom view –
FL board
POWER-KEY board
MAIN board
DC-JACK board
AUDIO-JACK board
DAB board block
SP board
IP board
RMC board
CD mechanism deck
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