HCD-BX9, HCD-DX9 - Sony Audio Service Manual (repair manual). Page 3

3

— BACK PANEL —

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7-1.

Circuit Board Location ····················································· 21

7-2.

Block Diagrams ································································ 22

7-3.

Printed Wiring Board – BD Section – ······························ 24

7-4.

Schematic Diagram – BD Section – ································· 25

7-5.

Printed Wiring Board – Main Section – ··························· 26

7-6.

Schematic Diagram – Main (1/3) Section – ····················· 27

7-7.

Schematic Diagram – Main (2/3) Section – ····················· 28

7-8.

Schematic Diagram – Main (3/3) Section – ····················· 29

7-9.

Printed Wiring Board – Power AMP Section –
(BX9 model) ····································································· 30

7-10. Schematic Diagram – Power AMP Section –

(BX9 model) ····································································· 31

7-11. Printed Wiring Board – Power AMP Section –

(DX9 model) ····································································· 32

7-12. Schematic Diagram – Power AMP Section –

(DX9 model) ····································································· 33

7-13. Printed Wiring Board – Panel Section – ··························· 34
7-14. Schematic Diagram – Panel Section – ····························· 35
7-15. Printed Wiring Board  – Leaf SW Section – ···················· 36
7-16. Schematic Diagram – Leaf SW Section – ························ 37
7-17. Printed Wiring Board – Driver Section – ························· 38
7-18. Schematic Diagram – Driver Section – ···························· 39
7-19. Printed Wiring Board – Trans Section –

(BX9 model) ····································································· 40

7-20. Schematic Diagram – Trans Section –

(BX9 model) ····································································· 41

7-21. Printed Wiring Board – Trans Section –

(DX9 model) ····································································· 42

7-22. Schematic Diagram – Trans Section –

(DX9 model) ····································································· 43

7-23. IC Pin Function Description ············································· 44
7-24. IC Block Diagrams ··························································· 46

8-1.

Main Section ····································································· 49

8-2.

Panel Section ···································································· 50

8-3.

Main Board Section ·························································· 51

8-4.

Tape Mechanism Deck Section-1 ····································· 52

8-5.

Tape Mechanism Deck Section-2 ····································· 53

8-6.

CD Mechanism Deck Section (CDM58-K2BD38) ·········· 54

8-7.

Base Unit Section (BU-K2BD38) ···································· 55

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• Abbreviation

AUS

: Australian model

EA

: Saudi Arabia model

MY

: Malaysia model

SP

: Singapore model

MX

: Mexican model

AR

: Argentina model

BX9, DX9: MX models

DX9: E, AR, SP, MY, EA, AUS models

4-225-041-4s

4-225-041-5s