HCD-BX3, HCD-DX3, MHC-BX3, MHC-DX3 - Sony Audio Service Manual (repair manual). Page 3

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This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.

Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.

Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.

• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be

damaged by heat.

• Keep the temperature of soldering iron around 270˚C

during repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.

— BACK PANEL —

BX3: AEP, UK, G, AED models

DX3: AR, E, EA, SP, TW, MY models

BX3: US, CND models

DX3: AUS, KR, MX, TH models

BX3: CIS model

4-224-547-0

s

4-224-547-1

s

4-224-547-2

s

4-224-547-4

s

4-226-245-0

s

• Abbreviation

CND : Canadian model
AUS

: Australian model

G

: German model

AED

: North European model

EA

: Saudi Arabia model

MY

: Malaysia model

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7-1. Circuit Board Location ················································· 21
7-2. Block Diagrams ···························································· 22
7-3. Printed Wiring Board     BD Section ···························· 24
7-4. Schematic Diagram     BD Section ······························· 25
7-5. Printed Wiring Board     Main Section ························· 26
7-6. Schematic Diagram     Main Section (1/3) ··················· 27
7-7. Schematic Diagram     Main Section (2/3) ··················· 28
7-8. Schematic Diagram     Main Section (3/3) ··················· 29
7-9. Printed Wiring Board     AMP Section ························· 30
7-10. Schematic Diagram     AMP Section ·························· 31
7-11. Printed Wiring Board     Panel Section ······················· 32
7-12. Schematic Diagram     Panel Section ·························· 33
7-13. Printed Wiring Board     Leaf SW Section ·················· 34
7-14. Schematic Diagram     Leaf SW Section ···················· 35
7-15. Printed Wiring Board     Driver Section ······················ 36
7-16. Schematic Diagram     Driver Section ························ 37
7-17. Printed Wiring Board     Trans Section ······················· 38
7-18. Schematic Diagram     Trans Section ·························· 39
7-19. IC Pin Function Description ······································· 40
7-20. IC Block Diagrams ····················································· 42

8-1. Main Section ································································· 45
8-2. Panel Section ································································ 46
8-3. Main Board Section ······················································ 47
8-4. Tape Mechanism Section ·············································· 48
8-5. CD Mechanism Section ················································ 49

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SP

: Singapore model

TH

: Thai model

TW

: Taiwan model

KR

: Korea model

MX

: Mexican model

AR

: Argentina model