HBD-E2100, HBD-E3100, HBD-E3200, HBD-E4100, HBD-E6100 - Sony Audio Service Manual (repair manual). Page 4

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HBD-E2100/E3100/E3200/E4100/E6100
4
1. 
SERVICING  NOTES
 ..............................................   5
2. DISASSEMBLY
2-1. Disassembly 
Flow 
...........................................................  13
2-2.  How To Bend FFC ..........................................................   14
2-3. Case 
.................................................................................  15
2-4. Panel 
Loading 
Assy 
........................................................  15
2-5. Front 
Panel 
Assy 
.............................................................  16
2-6.  BD Drive (BPX-7) ..........................................................   16
2-7.  POWER KEY Board, WLAN/BT COMBO Card, 
KARAOKE Board (SP, RU), PANEL Board ..................   17
2-8. MB1002 
Board 
...............................................................  18
2-9. AMP 
Board 
.....................................................................  18
2-10.  SWITCHING REGULATOR (SWR1) ...........................   19
2-11.  Optical Pick-up Block (KEM480AAA), 
 Wire 
(Flat 
Type) 
..............................................................  
20
3. 
TEST  MODE
 .............................................................   21
4. 
ELECTRICAL  CHECK
 ..........................................   32
5. TROUBLESHOOTING
 ...........................................   33
6. DIAGRAMS
6-1.  Block Diagram - SERVO Section - ................................   37
6-2.  Block Diagram - MEMORY/HDMI Section - ................   38
6-3.  Block Diagram - MAIN Section - ...................................   39
6-4.  Block Diagram - AMP Section - .....................................   40
6-5.  Block Diagram - POWER SUPPLY Section - ................   41
6-6. Printed 
Wiring 
Board 
- MB1002 Board (Component Side) - ............................   43
6-7. Printed 
Wiring 
Board 
- MB1002 Board (Conductor Side) - ..............................   44
6-8.  Schematic Diagram - MB1002 Board (1/6) - .................   45
6-9.  Schematic Diagram - MB1002 Board (2/6) - .................   46
6-10.  Schematic Diagram - MB1002 Board (3/6) - .................   47
6-11.  Schematic Diagram - MB1002 Board (4/6) - .................   48
6-12.  Schematic Diagram - MB1002 Board (5/6) - .................   49
6-13.  Schematic Diagram - MB1002 Board (6/6) - .................   50
6-14. Printed Wiring Board 
- AMP Board (Component Side) - ..................................   51
6-15. Printed Wiring Board 
- AMP Board (Conductor Side) - ....................................   52
6-16.  Schematic Diagram - AMP Board (1/3) - .......................   53
6-17.  Schematic Diagram - AMP Board (2/3) - .......................   54
6-18.  Schematic Diagram - AMP Board (3/3) - .......................   55
TABLE  OF  CONTENTS
6-19.  Printed Wiring Board - PANEL Board - .........................   56
6-20.  Schematic Diagram - PANEL Board - ............................   57
6-21. Printed Wiring Board
- KARAOKE Board (SP, RU) - ......................................   58
6-22. Schematic Diagram
- KARAOKE Board (SP, RU) - ......................................   58
6-23.  Printed Wiring Board - POWER KEY Board -...............   58
6-24.  Schematic Diagram - POWER KEY Board - .................   58
7. 
EXPLODED  VIEWS
7-1. Case 
Section 
....................................................................  76
7-2.  Front Panel Section .........................................................   77
7-3.  Chassis Bottom Section ..................................................   78
7-4. Chassis 
Section 
...............................................................  80
7-5.  BD Drive Section (BPX-7) .............................................   81
8. 
ELECTRICAL  PARTS  LIST
  ..............................   82
NOTES  ON  CHIP  COMPONENT  REPLACEMENT
• 
Never reuse a disconnected chip component.
• 
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
FLEXIBLE  CIRCUIT  BOARD  REPAIRING
• 
Keep the temperature of soldering iron around 270 °C during 
repairing.
• 
Do not touch the soldering iron on the same conductor of the 
circuit board (within 3 times).
• 
Be careful not to apply force on the conductor when soldering 
or unsoldering.
This appliance is classified as a 
CLASS 3R LASER product. 
Visible and invisible laser radiation 
is emitted when the laser protective 
housing is opened, so be sure to 
avoid direct eye exposure.
This appliance is classified as a 
CLASS 1 LASER product. This 
marking is located on the rear 
exterior.
The nameplate is located on the 
bottom exterior.
This marking is located on the laser 
protective housing inside the 
enclosure.
Ver. 1.5
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