FST-GTK1I, FST-GTK2I, HCD-GTK1I, HCD-GTK2I, RDH-GTK1I - Sony Audio Service Manual (repair manual). Page 15

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HCD-GTK1i/GTK2i
HCD-GTK1i/GTK2i
15
15
For Schematic Diagrams.

Note:
•  All capacitors are in μF unless otherwise noted. (p: pF) 50 
WV or less are not indicated except for electrolytics and 
tantalums.
•  All resistors are in Ω and 1/4 W or less unless otherwise 
specifi ed.
•  2 : nonfl ammable resistor.
•  C : panel designation.
THIS  NOTE  IS  COMMON  FOR  PRINTED  WIRING  BOARDS  AND  SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
•  A : B+ Line.
•  B : B– Line.
•  Voltages and waveforms are dc with respect to ground 
under no-signal (detuned) conditions.
  no mark : FM
       
*
  : Impossible to measure
•  Voltages are taken with VOM (Input impedance 10 M
).
  Voltage variations may be noted due to normal production 
tolerances.
•  Waveforms are taken with a oscilloscope.
  Voltage variations may be noted due to normal production 
tolerances.
•  Circled numbers refer to waveforms.
• Signal path.
  F : 
AUDIO
  I : IPOD
  f : 
TUNER
  J : 
USB
• Abbreviation
 AR  : 
Argentina 
model
 AUS : 
Australian 
model
  CND  : Canadian model
  E2 
: 120V AC area in E model
 E4  : 
African 
model
  E51 
: Chilean and Peruvian model
  MX 
: Mexican model
For Printed Wiring Boards.

Note:
•  X : Parts extracted from the component side.
•  Y : parts extracted from the conductor side.
• 
 : Pattern from the side which enables seeing.
  (The other layers' patterns are not indicated.)
• Abbreviation
 AR  : 
Argentina 
model
 AUS : 
Australian 
model
  CND  : Canadian model
  E2 
: 120V AC area in E model
 E4  : 
African 
model
  E51 
: Chilean and Peruvian model
  MX 
: Mexican model

Caution:
Pattern face side:
(Conductor Side)
Parts face side: 
(Component Side)
Parts on the pattern face side seen from 
the pattern face are indicated.
Parts on the parts face side seen from 
the parts face are indicated.

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 
the lead free mark due to their particular size)
 : LEAD  FREE  MARK
Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 
than ordinary solder.
 
Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.
 
Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 
the heated tip is applied for too long, so be careful!
• Strong 
viscosity
 
Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.
•  Usable with ordinary solder
 
It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.
• Waveforms
– MAIN Board –
– IPOD Board –

Note: 
The components identi-
fi
 ed by mark 0 or dotted 
line with mark 0 are criti-
cal for safety. 
Replace only with part 
number specifi ed.

Note: 
Les composants identifi és 
par une marque 0 sont 
critiques pour la sécurité. 
Ne les remplacer que par 
une piéce portant le nu-
méro spécifi é.
1

 IC102 qh (CLK IN)
200mV/DIV, 24.6msec/DIV
2

 IC100 qd (/X-OUT)
100mV/DIV, 12.3msec/DIV
50 Hz
556.7 mVp-p
376mHz
266.7 mp-p
3

 IC1100 ra (X OUT-PLL)
100mV/DIV, 49.3nsec/DIV
30 MHz
320.0mVp-p
Display
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