DAV-IS50, HCD-IS50 - Sony Audio Service Manual (repair manual). Page 4

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4
HCD-IS50
NOTES ON HANDLING THE OPTICAL PICK-UP 
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic 
break-down because of the potential difference generated by the 
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on 
the disc refl ective surface by the objective lens in the optical pick-up 
block. Therefore, when checking the laser diode emission, observe 
from more than 30 cm away from the objective lens.
BEGIN IT BEFORE THE REPAIR
When the HCD-IS50 is checked, connect to SA-WSIS50 (for active 
speaker of DAV-IS50).
Be sure in advance the SA-WSIS50 is prepared.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with 
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 
than ordinary solder.
  Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.
  Soldering irons using a temperature regulator should be set to 
about 350 
°C.
Caution: The printed pattern (copper foil) may peel away if 
the heated tip is applied for too long, so be careful!
• Strong viscosity
  Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.
•  Usable with ordinary solder
  It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.
RELEASING THE DISC SLOT LOCK
Releasing Procedure :
1.  Press the [
I
/
1
] button to turn on the system.
2.  Press the [FUNCTION] button on the remote commander to 
select “DVD”.
3.  Touch the [x] sensor and press the [Z] button on the set 
simultaneously and hold down until “UNLOCKED” displayed 
on the fl uorescent indicator tube (around 5 seconds).
Note: When “LOCKED” is displayed, the disc slot lock is not released by 
turning power on/off with the 
[
I
/
1
button.  
SECTION 1
SERVICING NOTES
MODEL IDENTIFICATION
Part No.
– Model number label –
 MODEL 
PART 
No.
US and Canadian models 
3-296-013-0[]
AEP and UK models 
3-296-014-0[]
Russian model 
3-296-015-0[]
Singapore model 
3-296-016-0[]
Thai model 
3-296-017-0[]
Australian model 
3-296-019-0[]
Argentina model 
3-296-022-0[]
Latin America models except Argentina 
3-300-365-0[]
Saudi Arabia model 
3-878-308-0[]
RELEASING THE DEMO DISC PLAY LOCK
Releasing Procedure :
1.  Press the [
I
/
1
] button to turn on the system.
2.  Press the [FUNCTION] button on the remote commander to 
select “DVD”.
3.  Touch the [x] and [B] sensor on the set simultaneously and 
hold down until “DEMO OFF” displayed on the fl uorescent 
indicator tube (around 5 seconds).
Note: When “DEMO ON” is displayed, the DEMO play lock is not released 
by turning power on/off with the 
[
I
/
1
]
 button.
NOTE OF REPLACING THE EEPROM (IC103) ON THE 
DMB-FIT BOARD
EEPROM (IC103) on the DMB-FIT board cannot exchange with 
single. When EEPROM (IC103) on the DMB-FIT board is damaged, 
exchange the entire mounted board.
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