Read Sony DAV-IS50 / HCD-IS50 Service Manual online
SERVICE MANUAL
DVD system
Laser
(DVD:
L = 645 - 660 nm) (CD: L = 770 - 800 nm)
Emission duration: continuous
Signal format system
US, Canadian and Latin American models: NTSC
European model: PAL/NTSC
Other models: NTSC/PAL
European model: PAL/NTSC
Other models: NTSC/PAL
Semiconductor laser
Video section
Outputs
VIDEO: 1 Vp-p 75 ohms
COMPONENT: Y: 1 Vp-p 75ohms
COMPONENT: Y: 1 Vp-p 75ohms
P
B
/C
B
, P
R
/C
R
: 0.7Vp-p 75 ohms
HDMI OUT: Type A (19 pin)
Control unit
Dimensions (approx.)
215
s 105 s 207 mm (8
1
/
2
s 4
1
/
4
s 8
1
/
4
inches)
(w/h/d)
Mass (approx.)
3.0 kg (6 lb 10 oz)
Power output
Except Latin American model:
(DIGITAL MEDIA PORT) DC OUT: 5 V, 700 mA
(DIGITAL MEDIA PORT) DC OUT: 5 V, 700 mA
Design and specifications are subject to change without notice.
Tuner section
System
PLL quartz-locked digital synthesizer
FM tuner section
Tuning range
Tuning range
US and Canadian models:
87.5
87.5
108.0 MHz (100kHz step)
Other models: 87.5
108.0 MHz (50kHz step)
Antenna (aerial)
FM wire antenna (aerial)
Antenna (aerial) terminals 75 ohms, unbalanced
Intermediate frequency
Intermediate frequency
10.7 MHz
AM tuner section
Tuning range
Tuning range
US, Canadian, Australian and Latin American models:
531
531
1,710kHz (with the interval set at 9kHz)
530
1,710kHz (with the interval set at 10kHz)
Other models:
531
531
1,602kHz (with the interval set at 9kHz)
530
1,610kHz (with the interval set at 10kHz)
European and Saudi Arabian models:
531
531
1,602kHz (with the interval set at 9kHz)
Antenna (aerial)
AM loop antenna (aerial)
Intermediate frequency
450 kHz
DVD RECEIVER
US Model
Canadian Model
AEP Model
UK Model
E Model
Australian Model
HCD-IS50
SPECIFICATIONS
9-890-507-02
2009B08-1
©
2009.02
Sony Corporation
Audio & Video Business Group
Published by Sony EMCS (Malaysia) PG Tec
Published by Sony EMCS (Malaysia) PG Tec
•
HCD-IS50 is the DVD system, tuner
and video section in DAV-IS50.
and video section in DAV-IS50.
•
In this set, repair in the state of having
connected with SA-WSIS50.
connected with SA-WSIS50.
Ver. 1.1 2009.02
This product incorporates copyright protection technology that is protected by
U.S. patents and other intellectual property rights. Use of this copyright
protection technology must be authorized by Macrovision, and is intended for
home and other limited viewing uses only unless otherwise authorized by
Macrovision. Reverse engineering or disassembly is prohibited.
U.S. patents and other intellectual property rights. Use of this copyright
protection technology must be authorized by Macrovision, and is intended for
home and other limited viewing uses only unless otherwise authorized by
Macrovision. Reverse engineering or disassembly is prohibited.
This system incorporates with Dolby* Digital and Dolby Pro Logic (II)
adaptive matrix surround decoder and the DTS** Digital Surround System.
adaptive matrix surround decoder and the DTS** Digital Surround System.
* Manufactured under license from Dolby Laboratories.
Dolby, Pro Logic, and the double-D symbol are trademarks of Dolby Laboratories.
** Manufactured under license under U.S. Patent #’s:
5,451,942; 5,956,674; 5,974,380; 5,978,762; 6,487,535 & other U.S. and worldwide
patents issued & pending. DTS and DTS Digital Surround are registered trademarks
and the DTS logos and Symbol are trademarks of DTS, Inc. © 1996-2007 DTS, Inc.
All Rights Reserved.
patents issued & pending. DTS and DTS Digital Surround are registered trademarks
and the DTS logos and Symbol are trademarks of DTS, Inc. © 1996-2007 DTS, Inc.
All Rights Reserved.
Model Name Using Similar Mechanism
HCD-IS10
DVD Mechanism Type
CDM86A-DVBU101
Optical Pick-up Block Name
KHM-313CAB
2
HCD-IS50
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES
SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT.
NE REMPLACER CES COM- POSANTS QUE PAR DES PIÈCES
SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL
OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES
SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT.
NE REMPLACER CES COM- POSANTS QUE PAR DES PIÈCES
SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL
OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
When the self-diagnosis function is activated to
prevent the system from malfunctioning, a 5-
character service number (e.g., C 13 50) with a
combination of a letter and 4 digits appears on
the TV screen or the front panel display. In this
case, check the following table.
prevent the system from malfunctioning, a 5-
character service number (e.g., C 13 50) with a
combination of a letter and 4 digits appears on
the TV screen or the front panel display. In this
case, check the following table.
(When letters/numbers appear in the
display)
display)
First 3
characters of
the service
number
characters of
the service
number
Cause and/or corrective action
C 13
v The disc is dirty.
Clean the disc with a soft cloth.
v The disc is a format that the
Clean the disc with a soft cloth.
v The disc is a format that the
system cannot play.
C 31
The disc is not inserted correctly.
Restart the system, then re-insert
Restart the system, then re-insert
the disc correctly.
E XX
(xx is a number)
To prevent a malfunction, the
system has performed the self-
diagnosis function.
Contact your nearest Sony
system has performed the self-
diagnosis function.
Contact your nearest Sony
dealer or local authorized Sony
service facility and give the 5-
character service number.
service facility and give the 5-
character service number.
Example: E 61 10
C:13:50
SELF DIAGNOSIS FUNCTION
This appliance is
classified as a CLASS 1
LASER product. This
marking is located on
the bottom exterior.
classified as a CLASS 1
LASER product. This
marking is located on
the bottom exterior.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
3
HCD-IS50
1. SERVICING
NOTES ........................................... 4
2. GENERAL
............................................................ 9
3. DISASSEMBLY
3-1. Disassembly Flow ........................................................... 11
3-2. Cover
3-2. Cover
(Bottom)
Assy
.......................................................
12
3-3. Optical Pick-Up Block (KHM-313CAB) ........................ 12
3-4. Panel
3-4. Panel
(Side-L/R)
Assy
.....................................................
13
3-5. Panel (Top) Block, Shield Plate (Top) ............................. 13
3-6. MAIN
3-6. MAIN
Board
....................................................................
14
3-7. IO
Board
..........................................................................
14
3-8. REG
Board
.......................................................................
15
3-9. DMB-FIT
Board
..............................................................
15
3-10. Front Panel Block ............................................................ 16
3-11. Mechanism Deck Section (CDM86A-DVBU101) .......... 16
3-12. MD (86A) Assy ................................................................ 17
3-13. Motor (Pulley) Assy (Loading) (M001) ........................... 17
3-14. Holder (BU) Assy ............................................................ 18
3-15. Lever (BU Lock) .............................................................. 18
3-16. Close Lever ...................................................................... 19
3-17. Lever (DIR), Gear (IDL-B) ............................................. 19
3-18. Chassis (Top) ................................................................... 20
3-19. Lever (Loading-L/R) ........................................................ 21
3-20. Lever (Disc Senser)/(Disc Stop) ...................................... 22
3-21. Gear (IDL-C) ................................................................... 22
3-11. Mechanism Deck Section (CDM86A-DVBU101) .......... 16
3-12. MD (86A) Assy ................................................................ 17
3-13. Motor (Pulley) Assy (Loading) (M001) ........................... 17
3-14. Holder (BU) Assy ............................................................ 18
3-15. Lever (BU Lock) .............................................................. 18
3-16. Close Lever ...................................................................... 19
3-17. Lever (DIR), Gear (IDL-B) ............................................. 19
3-18. Chassis (Top) ................................................................... 20
3-19. Lever (Loading-L/R) ........................................................ 21
3-20. Lever (Disc Senser)/(Disc Stop) ...................................... 22
3-21. Gear (IDL-C) ................................................................... 22
4. TEST
MODE
........................................................ 23
5. ELECTRICAL
ADJUSTMENTS
....................... 28
6. DIAGRAMS
6-1. Block Diagram – DVD SERVO, VIDEO Section – ........ 29
6-2. Block Diagram – MAIN, HDMI Section – ...................... 30
6-3. Block
6-2. Block Diagram – MAIN, HDMI Section – ...................... 30
6-3. Block
Diagram
– PANEL, POWER SUPPLY Section – ........................... 31
6-4. Printed
Wiring
Board
– DMB-FIT Board (Component Side) – .......................... 33
6-5. Printed
Wiring
Board
– DMB-FIT Board (Conductor Side) – ............................ 34
6-6. Schematic Diagram – DMB-FIT Board (1/7) – ............... 35
6-7. Schematic Diagram – DMB-FIT Board (2/7) – ............... 36
6-8. Schematic Diagram – DMB-FIT Board (3/7) – ............... 37
6-9. Schematic Diagram – DMB-FIT Board (4/7) – ............... 38
6-10. Schematic Diagram – DMB-FIT Board (5/7) – ............... 39
6-11. Schematic Diagram – DMB-FIT Board (6/7) – ............... 40
6-12. Schematic Diagram – DMB-FIT Board (7/7) – ............... 41
6-13. Printed Wiring Board
6-7. Schematic Diagram – DMB-FIT Board (2/7) – ............... 36
6-8. Schematic Diagram – DMB-FIT Board (3/7) – ............... 37
6-9. Schematic Diagram – DMB-FIT Board (4/7) – ............... 38
6-10. Schematic Diagram – DMB-FIT Board (5/7) – ............... 39
6-11. Schematic Diagram – DMB-FIT Board (6/7) – ............... 40
6-12. Schematic Diagram – DMB-FIT Board (7/7) – ............... 41
6-13. Printed Wiring Board
– MAIN Board (Component Side) – ................................ 42
6-14. Printed Wiring Board
– MAIN Board (Conductor Side) – ................................. 43
6-15. Schematic Diagram – MAIN Board (1/4) – ..................... 44
6-16. Schematic Diagram – MAIN Board (2/4) – ..................... 45
6-17. Schematic Diagram – MAIN Board (3/4) – ..................... 46
6-18. Schematic Diagram – MAIN Board (4/4) – ..................... 47
6-19. Printed Wiring Board – IO Board – ................................. 48
6-20. Schematic Diagram – IO Board – .................................... 49
6-21. Printed Wiring Board – FL Board – ................................. 50
6-22. Schematic Diagram – FL Board –.................................... 51
6-23. Printed Wiring Board – REG Board – ............................. 52
6-24. Schematic Diagram – REG Board – ................................ 53
6-16. Schematic Diagram – MAIN Board (2/4) – ..................... 45
6-17. Schematic Diagram – MAIN Board (3/4) – ..................... 46
6-18. Schematic Diagram – MAIN Board (4/4) – ..................... 47
6-19. Printed Wiring Board – IO Board – ................................. 48
6-20. Schematic Diagram – IO Board – .................................... 49
6-21. Printed Wiring Board – FL Board – ................................. 50
6-22. Schematic Diagram – FL Board –.................................... 51
6-23. Printed Wiring Board – REG Board – ............................. 52
6-24. Schematic Diagram – REG Board – ................................ 53
TABLE OF CONTENTS
7. EXPLODED
VIEWS
7-1. Bottom
Cover
Section
......................................................
69
7-2. Panel (Top) Section ......................................................... 70
7-3. MAIN
7-3. MAIN
Board
Section
...................................................... 71
7-4. Chassis
Section
............................................................... 72
7-5. Mechanism Deck Section-1 (CDM86A-DVBU101) ...... 73
7-6. Mechanism Deck Section-2 (CDM86A-DVBU101) ...... 74
7-7. Mechanism Deck Section-3 (CDM86A-DVBU101) ...... 75
7-8. Mechanism Deck Section-4 (CDM86A-DVBU101) ...... 76
7-6. Mechanism Deck Section-2 (CDM86A-DVBU101) ...... 74
7-7. Mechanism Deck Section-3 (CDM86A-DVBU101) ...... 75
7-8. Mechanism Deck Section-4 (CDM86A-DVBU101) ...... 76
8.
ELECTRICAL PARTS LIST
................................. 77
4
HCD-IS50
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc refl ective surface by the objective lens in the optical pick-up
block. Therefore, when checking the laser diode emission, observe
from more than 30 cm away from the objective lens.
The laser beam on this model is concentrated so as to be focused on
the disc refl ective surface by the objective lens in the optical pick-up
block. Therefore, when checking the laser diode emission, observe
from more than 30 cm away from the objective lens.
BEGIN IT BEFORE THE REPAIR
When the HCD-IS50 is checked, connect to SA-WSIS50 (for active
speaker of DAV-IS50).
Be sure in advance the SA-WSIS50 is prepared.
When the HCD-IS50 is checked, connect to SA-WSIS50 (for active
speaker of DAV-IS50).
Be sure in advance the SA-WSIS50 is prepared.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
RELEASING THE DISC SLOT LOCK
Releasing Procedure :
1. Press the [
I
/
1
] button to turn on the system.
2. Press the [FUNCTION] button on the remote commander to
select “DVD”.
3. Touch the [x] sensor and press the [Z] button on the set
simultaneously and hold down until “UNLOCKED” displayed
on the fl uorescent indicator tube (around 5 seconds).
on the fl uorescent indicator tube (around 5 seconds).
Note: When “LOCKED” is displayed, the disc slot lock is not released by
turning power on/off with the
[
I
/
1
]
button.
SECTION 1
SERVICING NOTES
MODEL IDENTIFICATION
Part No.
– Model number label –
MODEL
PART
No.
US and Canadian models
3-296-013-0[]
AEP and UK models
3-296-014-0[]
Russian model
3-296-015-0[]
Singapore model
3-296-016-0[]
Thai model
3-296-017-0[]
Australian model
3-296-019-0[]
Argentina model
3-296-022-0[]
Latin America models except Argentina
3-300-365-0[]
Saudi Arabia model
3-878-308-0[]
RELEASING THE DEMO DISC PLAY LOCK
Releasing Procedure :
1. Press the [
I
/
1
] button to turn on the system.
2. Press the [FUNCTION] button on the remote commander to
select “DVD”.
3. Touch the [x] and [B] sensor on the set simultaneously and
hold down until “DEMO OFF” displayed on the fl uorescent
indicator tube (around 5 seconds).
indicator tube (around 5 seconds).
Note: When “DEMO ON” is displayed, the DEMO play lock is not released
by turning power on/off with the
[
I
/
1
]
button.
NOTE OF REPLACING THE EEPROM (IC103) ON THE
DMB-FIT BOARD
EEPROM (IC103) on the DMB-FIT board cannot exchange with
single. When EEPROM (IC103) on the DMB-FIT board is damaged,
exchange the entire mounted board.
DMB-FIT BOARD
EEPROM (IC103) on the DMB-FIT board cannot exchange with
single. When EEPROM (IC103) on the DMB-FIT board is damaged,
exchange the entire mounted board.