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SA-WSF200/WSF500/SS-CTF500/F500/TSF200/TSF500
4
BOND FIXATION OF ELECTRIC PARTS (SA-WSF200/WSF500)
When AMP-DSP, POWER and SPEAKER boards are exchanged or the following object parts are exchanged, it is necessary to fi x parts to
the substrate by using a specifi ed bond without fail.
When AMP-DSP, POWER and SPEAKER boards are exchanged or the following object parts are exchanged, it is necessary to fi x parts to
the substrate by using a specifi ed bond without fail.
• Object boards
Board name
Part No.
AMP-DSP
A-1508-649-A (SA-WSF200: AEP and UK models)
A-1508-673-A (SA-WSF200: Singapore and Thai models)
A-1508-692-A (SA-WSF500: Russian model)
A-1508-695-A (SA-WSF500: Canadian model)
A-1508-698-A (SA-WSF500: Singapore , Taiwan and Thai models)
A-1508-713-A (SA-WSF500: Korean model)
A-1508-716-A (SA-WSF500: 240V AC area in E, Iranian and Saudi Arabia models)
A-1508-719-A (SA-WSF500: Australian)
A-1508-722-A (SA-WSF500: Latin American model (110 – 240V AC area))
A-1508-738-A (SA-WSF500: Mexican model)
POWER
A-1508-660-A (SA-WSF200: AEP and UK models/SA-WSF500: Russian model)
A-1508-670-A (SA-WSF500: Canadian model)
A-1508-676-A (SA-WSF200: Singapore model/
SA-WSF500: 240V AC area in E, Iranian, Singapore and Australian models)
SPEAKER
A-1508-652-A (SA-WSF200)
A-1508-687-A (SA-WSF500)
• Object parts
Board name
Part No.
AMP-DSP
C307, C309, C317, C327, C329, C337, C407, C409, C417, L323, L403, L553 (SA-WSF200/WSF500)
C387, C389, C397, L383 (SA-WSF500)
C387, C389, C397, L383 (SA-WSF500)
POWER
C902, C905, C908, C910, C913, C927, C928, C929, C932, C933, C940, C963, C964, D901, LF901, LF902, TH901,
VDR901
VDR901
SPEAKER
L101, L102, L103, L104
• Use bond
7-432-912-52 BOND, SONY (SC-608LV)
7-432-912-52 BOND, SONY (SC-608LV)
• Parts position
Note: Picture used is SA-WSF500.
C317
C407 C409 C387 C389 C327 C329 C307 C309
L553
L323
L383
L403
C337
C397
C417
– AMP-DSP Board (Component Side) –
bond
bond
bond
bond
bond
bond
bond
bond
Ver. 1.1
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