Read Sony DAV-DZ30 / HCD-DZ30 Service Manual online
HCD-DZ30
2
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
Notes on chip component replacement
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
Flexible Circuit Board Repairing
•
•
Keep the temperature of soldering iron around 270 °C during
repairing.
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
or unsoldering.
SAFETY-RELATED COMPONET WARNING!
COMPONENTS IDENTIFIED BY MARK
0 OR DOTTED LINE
WITH MARK
0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
Laser component in this product is capable of emitting radiation exceed-
ing the limit for Class 1.
ing the limit for Class 1.
This appliance is classifi ed as a
CLASS 1 LASER product.
This marking is located on the
rear or bottom exterior.
CLASS 1 LASER product.
This marking is located on the
rear or bottom exterior.
CAUTION
Use of controls or adjustments or performance of procedures other than
those specifi ed herein may result in hazardous radiation exposure.
Use of controls or adjustments or performance of procedures other than
those specifi ed herein may result in hazardous radiation exposure.
Special Component Notice
The components identifi ed by mark
The components identifi ed by mark
9 contain confi dential infor-
mation.
Strictly follow the instructions whenever the components are re-
paired and/or replaced.
Strictly follow the instructions whenever the components are re-
paired and/or replaced.
• Abbreviation
E3
E3
: 240V AC area in E model
E12
: 220-240V AC area in E model
E32
: 110-240V AC area in E model
E87
: Venezuelan model
AR :
Argentine
model
EA
: Saudi Arabia model
MX
: Mexican model
RU
: Russian model
SP
: Singapore model
TH :
Thai
model
Model
Part No.
AEP, UK models
3-280-431-0[]
SP model
3-280-431-1[]
RU model
3-280-431-3[]
E12 model
3-280-431-4[]
E32 model
3-280-431-5[]
AR model
3-280-431-7[]
E3 model
3-280-431-8[]
MX, E87 model
3-280-431-9[]
EA model
4-111-423-0[]
TH model
4-111-423-1[]
MODEL IDENTIFICATION
– Rear Panel –
– Rear Panel –
Parts No.
Ver. 1.4
Click on the first or last page to see other DAV-DZ30 / HCD-DZ30 service manuals if exist.