Read Sony CMT-SE7 / HCD-SE7 Service Manual online
SERVICE MANUAL
Sony Corporation
Audio&Video Business Group
Published by Sony Techno Create Corporation
Published by Sony Techno Create Corporation
E Model
MICRO HI-FI COMPONENT SYSTEM
9-877-950-07
2010C00-1
© 2010.03
© 2010.03
Ver. 1.6 2010.03
SPECIFICATIONS
HCD-SE7
Model Name Using Similar Mechanism
NEW
DVD
DVD Mechanism Type
CDM77A-DVBU20E
Section
Optical Pick-up Name
DBU-1
Model Name Using Similar Mechanism
NEW
MD
MD Mechanism Type
MDM-7S2D
Section
Optical Pick-up Name
KMS-262E
This system incorporates Dolby* Digital and DTS**
decorder system.
* Manufactured under license from Dolby
decorder system.
* Manufactured under license from Dolby
Laboratories. “Dolby” and the double-D symbol are
trademarks of Dolby Laboratories.
trademarks of Dolby Laboratories.
** Manufactured under license from Digital Theater
Systems, Inc. “DTS” and “DTS 2.0 + Digital Out”
are trademarks of Digital Theater Systems, Inc.
are trademarks of Digital Theater Systems, Inc.
HCD-SE7 is the amplifier, DVD/CD/SACD player,
MD deck and tuner section in CMT-SE7.
MD deck and tuner section in CMT-SE7.
Amplifier section
DIN power output (rated): 20 + 20 W
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
25 + 25 W
(6 ohms at 1 kHz,
10% THD)
(6 ohms at 1 kHz,
10% THD)
Music power output (reference):
45 + 45 W
Inputs
TAPE IN (phono jack):
TAPE IN (phono jack):
Voltage 250 mV,
impedance 47 kilohms
impedance 47 kilohms
DIGITAL OPTICAL IN:
Supported sampling
frequencies: 32 kHz,
44.1 kHz and 48 kHz
(PCM only)
frequencies: 32 kHz,
44.1 kHz and 48 kHz
(PCM only)
Outputs
TAPE OUT (phono jacks):
TAPE OUT (phono jacks):
Voltage 250 mV,
impedance 1 kilohm
impedance 1 kilohm
DIGITAL OPTICAL OUT:
Optical
Wavelength: 660 nm
Wavelength: 660 nm
PHONES (stereo mini phone jack):
Accepts headphones of
16 ohms or more
16 ohms or more
VIDEO OUT (phono jack):
Max. output level
1 Vp-p, unbalanced, Sync
negative, load impedance
75 ohms
1 Vp-p, unbalanced, Sync
negative, load impedance
75 ohms
S-VIDEO OUT (4-pin/mini-DIN jack):
Y: 1 Vp-p, unbalanced,
Sync negative
C: 0.286 Vp-p, load
impedance 75 ohms
Sync negative
C: 0.286 Vp-p, load
impedance 75 ohms
×
General
Power requirements
Power requirements
220 – 240 V AC, 50/60 Hz
Power consumption
DVD player/MD deck/Tuner:
DVD player/MD deck/Tuner:
70 W
0.3 W or less (in Power
Saving mode)
0.3 W or less (in Power
Saving mode)
Dimensions (w/h/d)
DVD player/MD deck/Tuner:
DVD player/MD deck/Tuner:
Approx. 215 142
×
334 mm
Mass
DVD player/MD deck/Tuner:
DVD player/MD deck/Tuner:
Approx. 6.2 kg
Design and specifications are subject to change
without notice.
without notice.
Sampling frequency
44.1 kHz
Frequency response
5 Hz – 20 kHz
MD deck section
System
Minidisc digital audio
system
system
Laser
Semiconductor laser
(
(
λ=780 nm)
Emission duration:
continuous
continuous
Antenna
AM loop antenna
Antenna terminals
External antenna terminal
Intermediate frequency
450 kHz
COMPONENT VIDEO OUT:
Y: 1 Vp-p, 75 ohms
P
P
B
, P
R
: 0.7 Vp-p, 75 ohms
Laser
Semiconductor laser
(DVD:
(DVD:
λ=650 nm,
CD:
λ =780 nm)
Emission duration:
continuous
continuous
Frequency response
DVD (PCM 48 kHz):
2 Hz – 22 kHz
CD: 2 Hz – 20 kHz
Super Audio CD:
2 Hz – 50 kHz
2 Hz – 22 kHz
CD: 2 Hz – 20 kHz
Super Audio CD:
2 Hz – 50 kHz
Video color system format:
NTSC, PAL
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
87.5 – 108.0 MHz
(50 kHz step)
(50 kHz step)
Antenna
FM lead antenna
Antenna terminals
75 ohm unbalanced
Intermediate frequency
10.7 MHz
AM tuner section
Tuning range
530 – 1,710 kHz
(with the tuning interval
set at 10 kHz)
531 – 1,602 kHz
(with the tuning interval
set at 9 kHz)
(with the tuning interval
set at 10 kHz)
531 – 1,602 kHz
(with the tuning interval
set at 9 kHz)
DVD player section
System
Compact disc, digital
audio and video system
audio and video system
and Super Audio CD
2
HCD-SE7
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 °C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
NOTES ON DMB03 BOARD EXCHANGE
If a DMB03 board is exchanged, “DRIVE AUTO ADJUSTMENT”
may be unable to be performed. In this case, initialize a memory in
the following procedure.
may be unable to be performed. In this case, initialize a memory in
the following procedure.
1. Starting Test Mode (see page 33).
2. Press the 2 button of remote commander to set the Drive
2. Press the 2 button of remote commander to set the Drive
Manual Operation (see page 36).
3. Press the 6 button of remote commander to set the Memory
Check (see page 38).
4. Press the [CLEAR] button of remote commander to initialize
a memory.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
other than those specified herein may result in hazardous radiation
exposure.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
exceeding the limit for Class 1.
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
Ver 1.1
3
HCD-SE7
TABLE OF CONTENTS
1.
SERVICING NOTES
...........................................
11
2.
GENERAL
............................................................
16
3.
DISASSEMBLY
3-1.
Side PANEL (L,R), ROOF, FRONT PANEL Section ..... 19
3-2.
PANEL Board, H/P Board, DOOR-SW Board ............... 19
3-3.
PANEL Top Board ........................................................... 20
3-4.
BACK PANEL, MAIN Board, I/O Board ....................... 20
3-5.
DC Fan ............................................................................ 21
3-6.
REG Board, Tuner (FM/AM) .......................................... 21
3-7.
AMP Board, POWER Board, SUB REG Board ............. 22
3-8.
TRANS Board, Power Transformer ................................ 22
3-9.
DVD Mechanism Deck (CDM77A-DVBU20E) ............. 23
3-10. Tray (AU) ........................................................................ 23
3-11. MS-128 Board ................................................................. 24
3-12. Base Unit ......................................................................... 24
3-13. RF Board, Optical Pick-up (DBU-1) ............................... 25
3-14. Bracket (CDM) ................................................................ 25
3-15. DMB03 Board ................................................................. 26
3-16. MD Mechanism Deck (MDM-7S2D),
3-11. MS-128 Board ................................................................. 24
3-12. Base Unit ......................................................................... 24
3-13. RF Board, Optical Pick-up (DBU-1) ............................... 25
3-14. Bracket (CDM) ................................................................ 25
3-15. DMB03 Board ................................................................. 26
3-16. MD Mechanism Deck (MDM-7S2D),
MD DIGITAL Board ....................................................... 26
3-17. Holder Assy ..................................................................... 27
3-18. BD (MD) Board ............................................................... 27
3-19. Motor Section .................................................................. 28
3-20. Over Right Head (HR901) .............................................. 28
3-21. Optical Pick-up (KMS-262E) .......................................... 29
3-18. BD (MD) Board ............................................................... 27
3-19. Motor Section .................................................................. 28
3-20. Over Right Head (HR901) .............................................. 28
3-21. Optical Pick-up (KMS-262E) .......................................... 29
4.
TEST MODE
.........................................................
30
5.
ELECTRICAL ADJUSTMENT
DVD Section ................................................................... 41
MD Section ...................................................................... 42
MD Section ...................................................................... 42
6.
DIAGRAMS
6-1.
Block Diagram – RF SERVO Section – ........................ 54
– VIDEO Section – .......................................................... 55
– MD Section – ................................................................ 56
– USB Section – .............................................................. 57
– AUDIO Section – .......................................................... 58
– PANEL POWER SUPPLY Section – ........................... 59
– VIDEO Section – .......................................................... 55
– MD Section – ................................................................ 56
– USB Section – .............................................................. 57
– AUDIO Section – .......................................................... 58
– PANEL POWER SUPPLY Section – ........................... 59
6-2.
Printed Wiring Board – RF Section – .............................. 60
6-3.
Schematic Diagram – RF Section – ................................ 61
6-4.
Printed Wiring Board – BD(MD) Section – .................... 62
6-5.
Schematic Diagram – BD(MD) Section(1/2) – ............... 63
6-6.
Schematic Diagram – BD(MD) Section(2/2) – ............... 64
6-7.
Printed Wiring Board – DMB03 Section(SideA) – ........ 65
6-8.
Printed Wiring Board – DMB03 Section(SideB) – ......... 66
6-9.
Schematic Diagram – DMB03 Section(1/9) – ................ 67
6-10. Schematic Diagram – DMB03 Section(2/9) – ................ 68
6-11. Schematic Diagram – DMB03 Section(3/9) – ................ 69
6-12. Schematic Diagram – DMB03 Section(4/9) – ................ 70
6-13. Schematic Diagram – DMB03 Section(5/9) – ................ 71
6-14. Schematic Diagram – DMB03 Section(6/9) – ................ 72
6-15. Schematic Diagram – DMB03 Section(7/9) – ................ 73
6-16. Schematic Diagram – DMB03 Section(8/9) – ................ 74
6-17. Schematic Diagram – DMB03 Section(9/9) – ................ 75
6-18. Printed Wiring Board – MD DIGITAL Section – ........... 76
6-19. Schematic Diagram – MD DIGITAL Section – .............. 77
6-20. Printed Wiring Board
6-11. Schematic Diagram – DMB03 Section(3/9) – ................ 69
6-12. Schematic Diagram – DMB03 Section(4/9) – ................ 70
6-13. Schematic Diagram – DMB03 Section(5/9) – ................ 71
6-14. Schematic Diagram – DMB03 Section(6/9) – ................ 72
6-15. Schematic Diagram – DMB03 Section(7/9) – ................ 73
6-16. Schematic Diagram – DMB03 Section(8/9) – ................ 74
6-17. Schematic Diagram – DMB03 Section(9/9) – ................ 75
6-18. Printed Wiring Board – MD DIGITAL Section – ........... 76
6-19. Schematic Diagram – MD DIGITAL Section – .............. 77
6-20. Printed Wiring Board
– MAIN/MS-128/SUB Section – .................................... 78
6-21. Schematic Diagram
– MAIN(1/2)/SUB Section – ........................................... 79
6-22. Schematic Diagram
– MAIN(2/2)/MS-128 Section – ..................................... 80
6-23. Printed Wiring Board
– PANEL/PANEL TOP/H/P/DOOR-SW Section – ........ 81
6-24. Schematic Diagram
– PANEL/PANEL TOP/H/P/DOOR-SW Section – ........ 82
6-25. Printed Wiring Board
– I/O/SUB REG Section – ............................................... 83
6-26. Schematic Diagram
– I/O/SUB REG Section – ............................................... 84
6-27. Printed Wiring Board
– AMP Section – .............................................................. 85
6-28. Schematic Diagram
– AMP Section – .............................................................. 86
6-29. Printed Wiring Board
– REG/POWER/TRANS Section – ................................. 87
6-30. Schematic Diagram
– REG/POWER/TRANS Section – ................................. 88
7.
EXPLODED VIEWS
7-1.
Cover Section ................................................................ 125
7-2.
FRONT PANEL Section ................................................ 126
7-3.
Chassis Section-1 ........................................................... 127
7-4.
Chassis Section-2 ........................................................... 128
7-5.
Chassis Section-3 ........................................................... 129
7-6.
Chassis Section-4 ........................................................... 130
7-7.
MD Mechanism Deck Section-1 (MDM-7S2D) ............ 131
7-8.
MD Mechanism Deck Section-2 (MDM-7S2D) ............ 132
7-9.
CD Mechanism Deck Section (CDM77A-DVBU20E) .. 133
8.
ELECTRICAL PARTS LIST
................................. 134
4
HCD-SE7
This system has a Self-diagnosis display
function to let you know if there is a system
malfunction. The display shows a code made up
of three or five letters and a message alternately
to show you the problem. To solve the problem
refer to the following list. If a message appears
in the display, be sure to open the lid of the unit
and confirm the displayed message.
If any problem persists, consult your nearest
Sony dealer.
function to let you know if there is a system
malfunction. The display shows a code made up
of three or five letters and a message alternately
to show you the problem. To solve the problem
refer to the following list. If a message appears
in the display, be sure to open the lid of the unit
and confirm the displayed message.
If any problem persists, consult your nearest
Sony dealer.
C11/Protected
The MD is protected against erasure.
cRemove the MD and slide the tab to close the slot
(page 38).
C12/Cannot Copy
The sound you are trying to record is encoded in a
format that this unit cannot record.
format that this unit cannot record.
cRecord sound output in a format that this unit can
record.
C13/REC Error
Recording could not be performed properly.
cMove the system to a stable place, and start
recording over from the beginning.
The MD is dirty or scratched, or the MD does not
meet the standards.
meet the standards.
cReplace the MD and start recording over from the
beginning.
C13/Read Error
The MD deck cannot read the disc information
properly.
properly.
cRemove the MD once, then insert it again.
C14/TOC Error
The MD deck cannot read the disc information
properly.
properly.
cReplace the MD.
cErase all the recorded contents of the MD using
the All Erase Function (page 55).
C41/Cannot Copy
The sound source is a copy of a commercially
available music software.
available music software.
cThe Serial Copy Management System prevents
making a digital copy (page 95).
The sound you are trying to digitally record is
encoded in a format that this unit is not compatible
with.
encoded in a format that this unit is not compatible
with.
cRecord sounds encoded in a format that this unit
can digitally record (see “Before you start
recording” (page 37) and “Recording between this
system and optional components” (page 81)).
recording” (page 37) and “Recording between this
system and optional components” (page 81)).
C71/Check OPT-IN
If the message disappears shortly after it is
displayed, the interruption was caused by digital
broadcasting signals, and the content of recording is
not affected.
displayed, the interruption was caused by digital
broadcasting signals, and the content of recording is
not affected.
The digital optical cable is disconnected, or the
power of the connected component is turned off
while recording the digital audio from an optional
component connected to the DIGITAL OPTICAL
IN jack.
power of the connected component is turned off
while recording the digital audio from an optional
component connected to the DIGITAL OPTICAL
IN jack.
cConnect the digital optical cable, or turn on the
power of the connected component.
E0001/MEMORY NG
The component has internal problem.
cConsult your nearest Sony dealer.
E0101/LASER NG
There is a problem with the laser pickup.
cThe laser pickup may be damaged. Consult your
nearest Sony dealer.
E0201/LOADING NG
There is a problem with loading.
cConsult your nearest Sony dealer.
Self-diagnosis display