CHC-CV40, HCD-CV40 - Sony Audio Service Manual (repair manual). Page 2

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3-1. Side Panel ····································································· 8
3-2. Top Panel ······································································ 8
3-3. Cassette Mechanism Deck, TC Board ·························· 9
3-4. Front Panel ···································································· 9
3-5. FRONT INPUT Board, CD Lid ·································· 10
3-6. MIC Board, PANEL Board ········································· 10
3-7. DISPLAY Board ························································· 11
3-8. VOL Board ································································· 11
3-9. VOL SEL Board, Back Panel ····································· 12
3-10. MAIN Board, VIDEO Board ······································ 12
3-11. SUB POWER Board, Power Transformer (T901) ······ 13
3-12. THERMAL Board, AMP Board ································· 13
3-13. CD Mechanism Deck (CDM63E) ······························ 14
3-14. CD Base Unit (BU-30BD62) ······································ 15
3-15. DRIVER Board ··························································· 16
3-16. Fitting Base (Stabilizer) Assy, Tray Assy ··················· 16
3-17. TRAY SENSOR Board ··············································· 17
3-18. Slider (Loading), Gear (Slider) ··································· 17
3-19. Stocker Assy ······························································· 18
3-20. DISC SENSOR Board ················································ 18
3-21. IN OUT SW Board ····················································· 19
3-22. Motor Assy (M721), MOTOR Board ························· 20

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Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)

Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40

°

C higher than

ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350

°

C.

Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.

7-1. Circuit Boards Location ·············································· 28
7-2. Block Diagrams ·························································· 29
7-3. Printed Wiring Board  – BD Board – ·························· 31
7-4. Schematic Diagram  – BD Board – ···························· 32
7-5. Printed Wiring Board  – VIDEO Board (Side A) – ···· 33
7-6. Printed Wiring Board  – VIDEO Board (Side B) – ···· 34
7-7. Schematic Diagram  – VIDEO Board (1/2) – ············· 35
7-8. Schematic Diagram  – VIDEO Board (2/2) – ············· 36
7-9. Printed Wiring Board  – MAIN Board – ···················· 37
7-10. Schematic Diagram  – MAIN Board (1/3) – ·············· 38
7-11. Schematic Diagram  – MAIN Board (2/3) – ·············· 39
7-12. Schematic Diagram  – MAIN Board (3/3) – ·············· 40
7-13. Printed Wiring Boards  – Driver Section – ················· 41
7-14. Schematic Diagram  – Driver Section – ····················· 42
7-15. Printed Wiring Board  – TC Board – ·························· 43
7-16. Schematic Diagram  – TC Board – ····························· 44
7-17. Printed Wiring Boards  – AMP Section – ··················· 45
7-18. Schematic Diagram  – AMP Section – ······················· 46
7-19. Printed Wiring Boards  – Panel Section – ··················· 47
7-20. Schematic Diagram  – Panel Section – ······················· 48
7-21. Printed Wiring Boards  – Power Section – ················· 49
7-22. Schematic Diagram  – Power Section – ······················ 50
7-23. Printed Wiring Board  – MIC Board – ························ 51
7-24. Schematic Diagram  – MIC Board – ·························· 51
7-25. IC Pin Function Description ······································· 56

8-1. Side Panel, Back Panel Section ·································· 58
8-2. Front Panel Section ····················································· 59
8-3. Chassis Section ··························································· 60
8-4. CD Mechanism Deck Section -1 ································ 61
8-5. CD Mechanism Deck Section -2 ································ 62
8-6. Base Unit Section (BU-30BD62) ······························· 63

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