CDP-XE900, CDP-XE900E - Sony Audio Service Manual (repair manual)

cdp-xe900, cdp-xe900e service manual
Model
CDP-XE900 CDP-XE900E
Pages
23
Size
436.04 KB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
cdp-xe900-cdp-xe900e.pdf
Date

Read Sony CDP-XE900 / CDP-XE900E Service Manual online

— 1 —
Model Name Using Similar Mechanism
NEW
CD Mechanism Type
CDM36-14
Base Unit Type
BU-14
Optical Pick-up Type
KSS-213B/S-N
SPECIFICATIONS
MICROFILM
COMPACT DISC PLAYER
AEP Model
CDP-XE900
UK Model
Chinese Model
CDP-XE900E
Compact disc player
Laser
Semiconductor laser (
λ
 = 780 nm)
Emission duration: continuous
Laser output
Max 44.6 µW*
* This output is the value measured at
a distance of 200 mm from the
objective lens surface on the Optical Pick-
up block with 7 mm aperture.
Frequency response
2 Hz to 20 kHz ± 0.5 dB
Signal-to-noise ratio
More than 113 dB
Dynamic range
More the 99 dB
Harmonic distortion
Less than 0.0025%
Channel separation
More than 105 dB
General
Power requirements
Except Chinese model :
220 V – 230 V AC, 50/60 Hz
Chinese model : 220V AC50/60Hz
Power consumption
14W
Dimensions (approx.)
430 
×
 1107 
×
 295 mm
(w/h/d)
(17 
×
 4 1/4 
×
 11 5/8 in.) incl. projecting
parts
Mass (approx.)
5.2 kg (8 lbs 13 oz)
Supplied accessories
Audio cord (2 phono plugs–2 phono plugs) (1)
Remote commander (RM-D820) (1)
Sony SUM-3 (NS) batteries (2)
Design and specifications are subject to change without notice.
PHOTO : CDP-XE900
CDP-XE900/XE900E
SERVICE MANUAL
Outputs
                       
Jack
Maximum
Load
                         type
output
impedance
                                            level
LINE OUT        Phono
2 V
Over 50 kilohms
                         jacks
(at 50 kilohms)
DIGITAL           Optical
–18 dBm
Wave length : 660 nm
OUT                 output
(OPTICAL)       connector
PHONES          Stereo
10 mW
32 ohms
(CDP-XE900)  phone
                         jack
— 2 —
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
TABLE OF CONTENTS
1. SERVICING NOTE
........................................................... 3
2. GENERAL
....................................................................
4
3. DISASSEMBLY
3-1.
Front Panel Assembly ......................................................... 5
4. TEST  MODE
.................................................................
6
5. ELECTRICAL BLOCK CHECKING
.........................
8
6. DIAGRAMS
6-1.
Circuit Boards Location ................................................... 10
6-2.
Schematic Diagram — Main Section — .......................... 11
6-3.
Printed Wiring Board — Main Section — ....................... 15
6-4.
Schematic Diagram — BD Section — ............................. 20
6-5.
Printed Wiring Board — BD Section — .......................... 23
6-2.
IC Pin Function
• IC801 System Control,
Fluorescent Indicator Tube Drive (CXP82316-069Q) .. 26
7. EXPLODED VIEWS
7-1.
Case Section ..................................................................... 27
7-2.
Chassis Section ................................................................. 28
7-3.
CD Mechanism Section (CDM36-14) .............................. 29
7-4.
Base Unit Section (BU-14) ............................................... 30
8. ELECTRICAL PARTS LIST
........................................ 31
The laser component in this product
is capable of emitting radiation
exceeding the limit for Class 1.
MODEL IDENTIFICATION
— BACK PANEL —
4-983-973-1
π: XE900 (AEP, German) model
4-983-973-2
π: XE900E (UK) model
4-983-973-3
π: XE900E (Chinese) model
(XE900E)
SAFETY-RELATED COMPONENT WARNING !!
COMPONENTS IDENTIFIED BY MARK 
!
 OR DOT-
TED LINE WITH MARK 
!
 ON THE SCHEMATIC
DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL
TO SAFE OPERATION. REPLACE THESE COMPO-
NENTS WITH SONY PARTS WHOSE PART NUM-
BERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
ADVARSEL
    : USYNLIG  LASERSTRÅLING  VED  ÅBNING  NÅR 
SIKKERHEDSAFBRYDERE ER UDE AF FUNKTION. UNDGÅ UDSAETTELSE 
FOR STRÅLING.
CAUTION
    : INVISIBLE  LASER  RADIATION  WHEN  OPEN  AND 
INTERLOCKS DEFEATED. AVOID EXPOSURE TO BEAM.
VARO!
    : AVATTAESSA JA SUOJALUKITUS OHITETTAESSA OLET ALT-
TIINA NÄKYMÄTTÖMÄLLE LASERSÄTEILYLLE. ÄLÄ KATSO SÄTEESEEN.
VARNING
    : OSYNLIG LASERSTRÅLING NÄR DENNA DEL ÄR ÖPP-
NAD OCH SPÄRREN ÄR URKOPPLAD. BETRAKTA EJ STRÅLEN.
VORSICHT
    : UNSICHTBARE LASERSTRAHLUNG, WENN 
ABDECKUNG GEÖFFNET UND SICHEREITSVERRIEGELUNG 
ÜBERBRÜCKT. NICHT DEM STRAHL AUSSETZEN.
ADVARSEL
    : USYNLIG LASERSTRÅLING NÅR DEKSEL ÅPNES OG 
SIKKERHEDSLÅS BRYTES. UNNGÅ EKSPONERING FOR STRÅLEN.
(XE900)
This caution
label is located
inside the unit.
This caution
label is located
inside the unit.
— 3 —
SECTION  1
SERVICING NOTE
HOW TO OPEN THE DISC TRAY WHEN POWER SWITCH
TURNS OFF
Insert a screwdriver into the aperture of the unit bottom, and
move it in the direction of arrow.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-up
block. Therefore, when checking the laser diode emission, observe
from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION CHECK
Carry out the “S curve check” in “CD section adjustment” and check
that the S curve waveform is output two times.
— 4 —
SECTION  2
GENERAL
LOCATION OF PARTS AND CONTROLS
Front Panel
1
2 3 4 5
6
7
8 90 !¡!™
!∞
@º !ª
1 POWER switch
2 PLAY MODE button
3 REPEAT button
4 FADER button
5 TIME button
6 Disc tray
7 Remote sensor
8 0/) buttons
9 Display window
0 CHECK button
!¡ CLEAR button
!™ ENTER button
!£ ≠ AMS* ± knob
!¢ p (stop) button
!∞ P (pause) button
!§ · (play) button
!¶ § OPEN/CLOSE button
!• MUSIC SCAN button
!ª AUTO SPACE button
@º PEAK SEARCH button
@¡ EDIT/TIME FADE button
@™ PHONES LEVEL control (CDP-XE900)
@£ PHONES jack (CDP-XE900)
* AMS is the abbreviation for Automatic Music Sensor.
!•
@™
Page of 23
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Download Sony CDP-XE900 / CDP-XE900E Service Manual (Repair Manual)

Here you can read online and download Sony CDP-XE900 / CDP-XE900E Service Manual in PDF. CDP-XE900 / CDP-XE900E service manual will guide through the process and help you recover, restore, fix, disassemble and repair Sony CDP-XE900 / CDP-XE900E Audio. Information contained in service manuals typically includes schematics / circuit diagrams, wiring diagrams, block diagrams, printed wiring boards, exploded views, parts list, disassembly / assembly, pcb.