Read Sony CDP-X3000 / CDP-X3000ES Service Manual online
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TABLE OF CONTENTS
1.
SERVICING NOTES
1-1.
Writing Focus/Tracking Auto Gain Data ......................... 3
1-2.
AF Mode .......................................................................... 3
1-3.
ADJ Mode ....................................................................... 4
1-4.
CLV-S Mode .................................................................... 4
2.
GENERAL
................................................................... 5
3.
DISASSEMBLY
.......................................................... 10
4.
ELECTRICAL ADJUSTMENTS
......................... 14
5.
DIAGRAMS
5-1.
IC Pin Function Description ............................................ 16
5-2.
Printed Wiring Boards
– Servo Section – ............................................................. 22
– Servo Section – ............................................................. 22
5-3.
Schematic Diagram
– Servo Section – ............................................................. 25
– Servo Section – ............................................................. 25
5-4.
Schematic Diagram
– Audio Section – ............................................................ 29
– Audio Section – ............................................................ 29
5-5.
Printed Wiring Boards
– Audio Section – ............................................................ 34
– Audio Section – ............................................................ 34
5-6.
Printed Wiring Boards
– Power Section – ............................................................ 39
– Power Section – ............................................................ 39
5-7.
Schematic Diagram
– Power Section – ............................................................ 41
– Power Section – ............................................................ 41
5-8.
Schematic Diagram
– Control Section – .......................................................... 43
– Control Section – .......................................................... 43
5-9.
Printed Wiring Boards
– Control Section – .......................................................... 45
– Control Section – .......................................................... 45
6.
EXPLODED VIEWS
................................................ 52
7.
ELECTRICAL PARTS LIST
................................ 56
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
CHECK
Carry out the “S curve check” in “CD section adjustment” and
check that the S curve waveforms is output three times.
check that the S curve waveforms is output three times.
Notes on chip component replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
Flexible Circuit Board Repairing
•
Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
ing repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
or unsoldering.
This appliance is classified as a CLASS 1 LASER product.
The CLASS 1 LASER PRODUCT MARKING is located on
the rear exterior.
The CLASS 1 LASER PRODUCT MARKING is located on
the rear exterior.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
exceeding the limit for Class 1.
The following caution label is located inside the unit.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
!
OR DOTTED LINE
WITH MARK
!
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL
OR IN SUPPLEMENTS PUBLISHED BY SONY.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL
OR IN SUPPLEMENTS PUBLISHED BY SONY.
CAUTION
Use of controls or adjustments or performance of
procedures other than those specified herein may
result in hazardous radiation exposure.
procedures other than those specified herein may
result in hazardous radiation exposure.
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