Read Sony BDV-EF200 / HBD-EF200 Service Manual online
HBD-EF200
HBD-EF200
33
33
For Schematic Diagrams.
Note:
• All capacitors are in μF unless otherwise noted. (p: pF) 50
• All capacitors are in μF unless otherwise noted. (p: pF) 50
WV or less are not indicated except for electrolytics and
tantalums.
tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise
specifi ed.
• f : internal component.
• C : panel designation.
• C : panel designation.
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
(In addition to this, the necessary note is printed in each block.)
• A : B+ Line.
• B : B– Line.
• Voltages and waveforms are dc with respect to ground
• B : B– Line.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : TUNER
*
: Impossible to measure
• Voltages are taken with VOM (Input impedance 10 M
).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F :
F :
AUDIO
E :
VIDEO
J
: DISC PLAY
L :
USB
d :
LAN
f :
TUNER
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
from that of conventional IC.
from that of conventional IC.
For Printed Wiring Boards.
Note:
• X : Parts extracted from the component side.
• Y : Parts extracted from the conductor side.
• f : Internal component.
•
• X : Parts extracted from the component side.
• Y : Parts extracted from the conductor side.
• f : Internal component.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
• Indication of transistor.
C
B
These are omitted.
E
Q
B
These are omitted.
C E
Q
• Lead layouts
surface
CSP (Chip Size Package)
Lead layout of conventional IC
Caution:
Pattern face side:
(Conductor Side)
Parts face side:
(Component Side)
Pattern face side:
(Conductor Side)
Parts face side:
(Component Side)
Parts on the pattern face side seen
from the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
from the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
• MB-141 board is multi-layer printed board. However, the
patterns of intermediate-layers have not been included in
this diagrams.
this diagrams.
• Circuit Boards Location
Caution:
Pattern face side:
(SIDE B)
Parts face side:
(SIDE A)
Pattern face side:
(SIDE B)
Parts face side:
(SIDE A)
Parts on the pattern face side seen
from the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
from the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
* Replacement of IC106, IC107, IC206, IC207 on the MB-141 board
used in this unit requires a special tool.
Note: When the AMP board is replaced, spread the compound referring
to “NOTE OF REPLACING THE IC3100 AND IC3200 ON
THE AMP BOARD AND THE COMPLETE AMP BOARD”
on servicing notes (page 8).
THE AMP BOARD AND THE COMPLETE AMP BOARD”
on servicing notes (page 8).
Note: When the AMP board is replaced, spread the compound referring
to “NOTE OF REPLACING THE IC3100 AND IC3200 ON
THE AMP BOARD AND THE COMPLETE AMP BOARD”
on servicing notes (page 8).
THE AMP BOARD AND THE COMPLETE AMP BOARD”
on servicing notes (page 8).
* Replacement of IC106, IC107, IC206, IC207 on the MB-141 board
used in this unit requires a special tool.
POWER KEY board
TUNER board
DISPLAY board
FRONT USB board
SPEAKER board
AMP board
MB-141 board
switching regulator
(SWR1)
(SWR1)
Note: The components identifi ed by mark 0 or dotted
line with mark 0 are critical for safety.
Replace only with part number specifi ed.
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