Read Sony BDV-EF200 / HBD-EF200 Service Manual online
SERVICE MANUAL
Sony Corporation
Published by Sony Techno Create Corporation
HBD-EF200
SPECIFICATIONS
BLU-RAY DISC/DVD RECEIVER
9-893-192-02
2011I33-1
©
2011.09
AEP Model
UK Model
Ver. 1.1 2011.09
• HBD-EF200 is the Amplifi er, Video, HDMI,
BD/DVD/Super Audio CD/CD System, USB,
LAN and FM Tuner section in BDV-EF200.
LAN and FM Tuner section in BDV-EF200.
Model Name Using Similar Mechanism
HBD-E280
Mechanism Type
BPX-6
Optical Pick-up Block Name
KEM-470AAA
Amplifier Section
POWER OUTPUT (rated)
Front L/Front R:
Front L/Front R:
80 W + 80 W (at 3 ohms,
1 kHz, 1% THD)
1 kHz, 1% THD)
POWER OUTPUT (reference)
Front L/Front R:
Front L/Front R:
115 W (per channel at 3
ohms, 1 kHz)
ohms, 1 kHz)
Subwoofer:
120 W (at 3 ohms, 80 Hz)
Inputs (Analog)
AUDIO (AUDIO IN)
AUDIO (AUDIO IN)
Sensitivity: 450/250 mV
Inputs (Digital)
TV (Audio Return Channel/OPTICAL)
TV (Audio Return Channel/OPTICAL)
Supported formats: LPCM
2CH (up to 48 kHz), Dolby
Digital, DTS
2CH (up to 48 kHz), Dolby
Digital, DTS
HDMI (IN 1)/HDMI (IN 2)
Supported formats: LPCM
2CH (up to 96 kHz), Dolby
Digital, DTS
2CH (up to 96 kHz), Dolby
Digital, DTS
Video Section
Outputs
VIDEO: 1 Vp-p 75 ohms
HDMI Section
Connector
Type A (19pin)
BD/DVD/Super Audio CD/CD System
Signal format system
NTSC/PAL
USB Section
(USB) port:
Type A (For connecting
USB memory, memory
card reader, digital still
camera, and digital video
camera)
USB memory, memory
card reader, digital still
camera, and digital video
camera)
LAN Section
LAN (100) terminal
100BASE-TX Terminal
FM Tuner Section
System
PLL quartz-locked digital
synthesizer
synthesizer
Tuning range
87.5 MHz - 108.0 MHz (50
kHz step)
kHz step)
Antenna (aerial)
FM wire antenna (aerial)
Antenna (aerial) terminals 75 ohms, unbalanced
General
Power requirements
220 V - 240 V AC,
50/60 Hz
50/60 Hz
Power consumption
On: 95 W
Standby: 0.3 W (at the
Power Saving mode)
Standby: 0.3 W (at the
Power Saving mode)
Dimensions (approx.)
400 mm × 65 mm × 315
mm (w/h/d) incl.
projecting parts
mm (w/h/d) incl.
projecting parts
Mass (approx.)
3.2 kg
Design and specifications are subject to change
without notice.
without notice.
s Standby power consumption 0.3W.
s Over 85% power efficiency of amplifier block is
s Over 85% power efficiency of amplifier block is
achieved with the full digital amplifier, S-Master.
HBD-EF200
2
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK
0 OR DOTTED LINE
WITH MARK
0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
• This system incorporates with Dolby* Digital and the DTS** Digital Surround System.
* Manufactured under license from Dolby Laboratories.
Dolby and the double-D symbol are trademarks of Dolby Laboratories.
** Manufactured under license under U.S. Patent #’s:
5,451,942; 5,956,674; 5,974,380; 5,978,762; 6,226,616; 6,487,535; 7,212,872; 7,333,929;
5,451,942; 5,956,674; 5,974,380; 5,978,762; 6,226,616; 6,487,535; 7,212,872; 7,333,929;
7,392,195; 7,272,567 & other U.S. and worldwide patents issued & pending.
DTS, DTS-HD and the Symbol are registered trademarks, & DTS-HD Master Audio, and
the DTS logos are trademarks of DTS, Inc. Product includes software. © DTS, Inc. All
Rights Reserved.
Rights Reserved.
• This system incorporates High-Defi nition Multimedia Interface (HDMI™) technology.
HDMI, the HDMI logo and High-Defi nition Multimedia Interface are trademarks or registered
trademarks of HDMI Licensing LLC in the United States and other countries.
trademarks of HDMI Licensing LLC in the United States and other countries.
• Java is a trademark of Oracle and/or its affi liates.
• “BD-LIVE” and “BONUSVIEW” are trademarks of Blu-ray Disc Association.
• “Blu-ray Disc” is a trademark.
• “Blu-ray Disc,” “DVD+RW,” “DVD-RW,” “DVD+R,” “DVD-R,” “DVD VIDEO,” and “CD”
• “BD-LIVE” and “BONUSVIEW” are trademarks of Blu-ray Disc Association.
• “Blu-ray Disc” is a trademark.
• “Blu-ray Disc,” “DVD+RW,” “DVD-RW,” “DVD+R,” “DVD-R,” “DVD VIDEO,” and “CD”
logos are trademarks.
• “Blu-ray 3D” and “Blu-ray 3D” logo are trademarks of Blu-ray Disc Association.
• “BRAVIA” is a trademark of Sony Corporation.
• “AVCHD” and the “AVCHD” logo are trademarks of Panasonic Corporation and Sony Corpora-
• “BRAVIA” is a trademark of Sony Corporation.
• “AVCHD” and the “AVCHD” logo are trademarks of Panasonic Corporation and Sony Corpora-
tion.
•
, “XMB,” and “xross media bar” are trademarks of Sony Corporation and Sony Computer
Entertainment Inc.
• “PLAYSTATION” is a trademark of Sony Computer Entertainment Inc.
• The Wi-Fi CERTIFIED™ Logo is a certifi cation mark of the Wi-Fi Alliance.
• The Wi-Fi Protected Setup™ Mark is a mark of the Wi-Fi Alliance.
• “Wi-Fi CERTIFIED™” and “Wi-Fi Protected Setup™” are trademarks of the Wi-Fi Alliance.
• “PhotoTV HD” and the “PhotoTV HD” logo are trademarks of Sony Corporation.
• MPEG Layer-3 audio coding technology and patents licensed from Fraunhofer IIS and Thom-
• The Wi-Fi CERTIFIED™ Logo is a certifi cation mark of the Wi-Fi Alliance.
• The Wi-Fi Protected Setup™ Mark is a mark of the Wi-Fi Alliance.
• “Wi-Fi CERTIFIED™” and “Wi-Fi Protected Setup™” are trademarks of the Wi-Fi Alliance.
• “PhotoTV HD” and the “PhotoTV HD” logo are trademarks of Sony Corporation.
• MPEG Layer-3 audio coding technology and patents licensed from Fraunhofer IIS and Thom-
son.
• iPhone, iPod, iPod classic, iPod nano, and iPod touch are trademarks of Apple Inc., registered in
the U.S. and other countries.
• “Made for iPod,” and “Made for iPhone” mean that an electronic accessory has been designed
to connect specifi cally to iPod or iPhone, respectively, and has been certifi ed by the developer
to meet Apple performance standards. Apple is not responsible for the operation of this device
or its compliance with safety and regulatory standards. Please note that the use of this accessory
with iPod or iPhone may affect wireless performance.
to meet Apple performance standards. Apple is not responsible for the operation of this device
or its compliance with safety and regulatory standards. Please note that the use of this accessory
with iPod or iPhone may affect wireless performance.
• Windows Media is either a registered trademark or trademark of Microsoft Corporation in the
United States and/or other countries.
This product contains technology subject to certain intellectual property rights of Microsoft.
Use or distribution of this technology outside of this product is prohibited without the appro-
priate license(s) from Microsoft. Content owners use Microsoft PlayReady™ content access
technology to protect their intellectual property, including copyrighted content. This device
uses PlayReady technology to access PlayReady-protected content and/or WMDRMprotected
content. If the device fails to properly enforce restrictions on content usage, content owners
may require Microsoft to revoke the device’s ability to consume PlayReady-protected content.
Revocation should not affect unprotected content or content protected by other content access
technologies. Content owners may require you to upgrade PlayReady to access their content. If
you decline an upgrade, you will not be able to access content that requires the upgrade.
Use or distribution of this technology outside of this product is prohibited without the appro-
priate license(s) from Microsoft. Content owners use Microsoft PlayReady™ content access
technology to protect their intellectual property, including copyrighted content. This device
uses PlayReady technology to access PlayReady-protected content and/or WMDRMprotected
content. If the device fails to properly enforce restrictions on content usage, content owners
may require Microsoft to revoke the device’s ability to consume PlayReady-protected content.
Revocation should not affect unprotected content or content protected by other content access
technologies. Content owners may require you to upgrade PlayReady to access their content. If
you decline an upgrade, you will not be able to access content that requires the upgrade.
• All other trademarks are trademarks of their respective owners.
• Other system and product names are generally trademarks or registered trademarks of the manu-
• Other system and product names are generally trademarks or registered trademarks of the manu-
facturers. ™ and ® marks are not indicated in this document.
NOTES ON CHIP COMPONENT REPLACEMENT
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
•
•
Keep the temperature of soldering iron around 270 °C during
repairing.
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
or unsoldering.
This appliance is classified as a
CLASS 3R LASER product.
Visible and invisible laser radiation
is emitted when the laser protective
housing is opened, so be sure to
avoid direct eye exposure.
CLASS 3R LASER product.
Visible and invisible laser radiation
is emitted when the laser protective
housing is opened, so be sure to
avoid direct eye exposure.
This marking is located on the laser
protective housing inside the
enclosure.
protective housing inside the
enclosure.
This appliance is classified as a
CLASS 1 LASER product. This
marking is located on the rear
exterior.
CLASS 1 LASER product. This
marking is located on the rear
exterior.
HBD-EF200
3
1.
SERVICING NOTES
............................................. 4
2. DISASSEMBLY
2-1. Disassembly
Flow
........................................................... 11
2-2. How To Bend Flexible Flat Cable .................................. 11
2-3. Case
2-3. Case
(E0)
......................................................................... 12
2-4. Loading
Panel
................................................................. 12
2-5. Front
Panel
Assy
............................................................. 13
2-6. BD Drive (BPX-6) .......................................................... 13
2-7. MB-141
2-7. MB-141
Board
................................................................ 14
2-8. AMP
Board
..................................................................... 15
2-9. Switching Regulator (SWR1) ......................................... 16
2-10. Optical Pick-up Block (KEM-470AAA),
2-10. Optical Pick-up Block (KEM-470AAA),
Wire (Flat Type) .............................................................. 17
3.
TEST MODE
............................................................ 18
4.
ELECTRICAL CHECK
......................................... 26
5. DIAGRAMS
5-1. Block Diagram - SERVO Section - ................................ 27
5-2. Block Diagram - MEMORY Section - ............................ 28
5-3. Block Diagram - HDMI Section - ................................... 29
5-4. Block Diagram - MAIN Section - ................................... 30
5-5. Block Diagram - AMP Section - ..................................... 31
5-6. Block Diagram - POWER SUPPLY Section - ................ 32
5-7. Printed Wiring Board - MB-141 Board (Side A) - .......... 34
5-8. Printed Wiring Board - MB-141 Board (Side B) - .......... 35
5-9. Schematic Diagram - MB-141 Board (1/12) - ................ 36
5-2. Block Diagram - MEMORY Section - ............................ 28
5-3. Block Diagram - HDMI Section - ................................... 29
5-4. Block Diagram - MAIN Section - ................................... 30
5-5. Block Diagram - AMP Section - ..................................... 31
5-6. Block Diagram - POWER SUPPLY Section - ................ 32
5-7. Printed Wiring Board - MB-141 Board (Side A) - .......... 34
5-8. Printed Wiring Board - MB-141 Board (Side B) - .......... 35
5-9. Schematic Diagram - MB-141 Board (1/12) - ................ 36
TABLE OF CONTENTS
5-10. Schematic Diagram - MB-141 Board (2/12) - ................ 37
5-11. Schematic Diagram - MB-141 Board (3/12) - ................ 38
5-12. Schematic Diagram - MB-141 Board (4/12) - ................ 39
5-13. Schematic Diagram - MB-141 Board (5/12) - ................ 40
5-14. Schematic Diagram - MB-141 Board (6/12) - ................ 41
5-15. Schematic Diagram - MB-141 Board (7/12) - ................ 42
5-16. Schematic Diagram - MB-141 Board (8/12) - ................ 43
5-17. Schematic Diagram - MB-141 Board (9/12) - ................ 44
5-18. Schematic Diagram - MB-141 Board (10/12) - .............. 45
5-19. Schematic Diagram - MB-141 Board (11/12) - .............. 46
5-20. Schematic Diagram - MB-141 Board (12/12) - .............. 47
5-21. Printed Wiring Board
5-11. Schematic Diagram - MB-141 Board (3/12) - ................ 38
5-12. Schematic Diagram - MB-141 Board (4/12) - ................ 39
5-13. Schematic Diagram - MB-141 Board (5/12) - ................ 40
5-14. Schematic Diagram - MB-141 Board (6/12) - ................ 41
5-15. Schematic Diagram - MB-141 Board (7/12) - ................ 42
5-16. Schematic Diagram - MB-141 Board (8/12) - ................ 43
5-17. Schematic Diagram - MB-141 Board (9/12) - ................ 44
5-18. Schematic Diagram - MB-141 Board (10/12) - .............. 45
5-19. Schematic Diagram - MB-141 Board (11/12) - .............. 46
5-20. Schematic Diagram - MB-141 Board (12/12) - .............. 47
5-21. Printed Wiring Board
- AMP Board (Component Side) - .................................. 48
5-22. Printed Wiring Board
- AMP Board (Conductor Side) - .................................... 49
5-23. Schematic Diagram - AMP Board (1/2) - ....................... 50
5-24. Schematic Diagram - AMP Board (2/2) - ....................... 51
5-25. Schematic Diagram - INPUT/OUTPUT Section - .......... 52
5-26. Schematic Diagram - DISPLAY Board - ........................ 53
5-27. Printed Wiring Boards
5-24. Schematic Diagram - AMP Board (2/2) - ....................... 51
5-25. Schematic Diagram - INPUT/OUTPUT Section - .......... 52
5-26. Schematic Diagram - DISPLAY Board - ........................ 53
5-27. Printed Wiring Boards
- PANEL, INPUT/OUTPUT Section - ............................ 54
6.
EXPLODED VIEWS
6-1. Case, Front Panel Section ............................................... 76
6-2. Power Block Section ....................................................... 77
6-3. Chassis
6-2. Power Block Section ....................................................... 77
6-3. Chassis
Section
............................................................... 78
6-4. BD Drive Section (BPX-6) ............................................. 79
7.
ELECTRICAL PARTS LIST
.............................. 80
HBD-EF200
4
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
Part No.
Description
Layer
J-6090-199-A
BLX-104
Single Layer
J-6090-200-A
BLX-204
Dual Layer
J-2501-307-A
CD (HLX-A1)
J-2501-305-A
HLX-513
Single Layer (NTSC)
J-2501-306-A
HLX-514
Dual Layer (NTSC)
J-6090-077-A
HLX-506
Single Layer (PAL)
J-6090-078-A
HLX-507
Dual Layer (PAL)
TEST DISC
Note: Refer to the service manual of BDP-BX1/S350 (Part No. 9-883-
989-1[]) (page 1-3 to 1-14E) for the use of BLX-104/204.
Operation and Display:
1. BLX-104
Procedure:
1. Select
Procedure:
1. Select
23.976Hz/1080p.
2. Play “4.Motion picture”.
3. Check whether player can play back or not.
4. Check each outputs.
Video:
Composite/S
3. Check whether player can play back or not.
4. Check each outputs.
Video:
Composite/S
Video/component/HDMI.
Audio:
Speaker
Speaker
out.
* When 1080/24p monitor is nothing, 1080i (59.94Hz or 50Hz)
can use instead of 1080/24p.
However this is temporary correspondence.
2. BLX-204
Procedure:
1. Select 1080i (59.94Hz or 50Hz).
2. Play “4.Motion picture”.
3. Check whether player can play back or not (Check the picture
Procedure:
1. Select 1080i (59.94Hz or 50Hz).
2. Play “4.Motion picture”.
3. Check whether player can play back or not (Check the picture
and sound output).
3. CD
(HLX-A1)
Procedure:
Check whether player can play back or not (Check the sound out-
put).
Check whether player can play back or not (Check the sound out-
put).
4. HLX-513/514 (NTSC), HLX-506/507 (PAL)
Procedure:
1. After displayed Main Menu, select “1.Video Signal”.
2. Play “1.Color bar 100%” (Check the picture and sound out-
Procedure:
1. After displayed Main Menu, select “1.Video Signal”.
2. Play “1.Color bar 100%” (Check the picture and sound out-
put).
3. Return to Menu.
4. Play “Demonstration 4:3” or “Demonstration 16:9” (Check the
4. Play “Demonstration 4:3” or “Demonstration 16:9” (Check the
picture and sound output).
NOTE OF REPLACING THE IC101, IC304, IC307,
IC501 AND IC702 ON THE MB-141 BOARD
IC101, IC304, IC307, IC501 and IC702 on the MB-141 board
cannot exchange with single. When these parts are damaged, ex-
change the complete mounted board.
IC101, IC304, IC307, IC501 and IC702 on the MB-141 board
cannot exchange with single. When these parts are damaged, ex-
change the complete mounted board.
NOTE OF REPLACING THE IC106, IC107, IC206 AND
IC207 ON THE MB-141 BOARD
Replacement of IC106, IC107, IC206 and IC207 on the MB-141
board used in this unit requires a special tool.
IC207 ON THE MB-141 BOARD
Replacement of IC106, IC107, IC206 and IC207 on the MB-141
board used in this unit requires a special tool.
RELEASING THE DISC TRAY LOCK
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
Releasing Procedure:
1. Press the [
1. Press the [
?/1
] button to turn on the system.
2. Press the [FUNCTION] button to select “BD/DVD”.
3. Press the [
3. Press the [
x
] and [
Z
] buttons simultaneously and hold down
unit “DEMO OFF” displayed on the fluorescent indicator tube
(around 5 seconds).
(around 5 seconds).
Note: When “DEMO LOCK” is displayed, the disc tray lock is not re-
leased by turning power on/off with the [?/1] button.
ABOUT THE LENS CLEANING
Do not do the lens cleaning with the cotton bud etc. It causes the
trouble.
Do not do the lens cleaning with the cotton bud etc. It causes the
trouble.
Ver. 1.1