Read Sony BDV-B1 / SA-WSB1 Service Manual online
SA-WSB1
2
NOTES ON CHIP COMPONENT REPLACEMENT
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK
0 OR DOTTED LINE
WITH MARK
0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
ADVANCE PREPARATION WHEN CONFIRMING OP-
ERATION
HBD-B1 is required to confi rming operation of SA-WSB1. Check
in advance that you have HBD-B1 and SA-WSB1.
ERATION
HBD-B1 is required to confi rming operation of SA-WSB1. Check
in advance that you have HBD-B1 and SA-WSB1.
NOTE THE PARTS ON THE EACH BOARDS REPAIR-
ING
The mount parts on each boards installed in this set cannot ex-
change with single excluding a part of parts.
Refer to ELECTRICAL PARTS LIST (page 12) for parts that can
be exchanged.
When the each mount parts that have not been described to ELEC-
TRICAL PARTS LIST are damaged, exchange the entire mounted
board.
Printed wiring board and schematic diagram have been described
to this service manual is for the reference.
ING
The mount parts on each boards installed in this set cannot ex-
change with single excluding a part of parts.
Refer to ELECTRICAL PARTS LIST (page 12) for parts that can
be exchanged.
When the each mount parts that have not been described to ELEC-
TRICAL PARTS LIST are damaged, exchange the entire mounted
board.
Printed wiring board and schematic diagram have been described
to this service manual is for the reference.
SECTION 1
SERVICING NOTES
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