Read Panasonic KX-TCD325UA / KX-TCA132UA / KX-TCA130UA Service Manual online
2005 Panasonic Communications
KX-TCD325UA
KX-TCA132UA
KX-TCA130UA
Digital Cordless Answering System
UAF-Blue Metic Version
UAS-Silver Version
UAT-Titanium Black Version
UAS-Silver Version
UAT-Titanium Black Version
(for Ukraine)
Telephone Equipment
ORDER NO. KM40503647CE
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
4
1.1.
Suggested PbF Solder
4
1.2.
How to recognize that Pb Free solder is used
5
2 FOR SERVICE TECHNICIANS
6
3 CAUTION
6
4 BATTERY
7
4.1.
Battery Installation
7
4.2.
Battery Charge
7
4.3.
Battery Life
8
4.4.
Battery Replacement
8
5 LOCATION OF CONTROLS
9
5.1.
Base Unit
9
5.2.
Handset
9
6 SETTINGS
11
6.1.
Connections
12
6.2.
Guide to Settings
13
6.3.
Ringer Volume
15
6.4.
Night Mode
15
6.5.
PIN Code
16
6.6.
Reset
17
6.7.
Key Lock
18
6.8.
R Button to Use the Recall Feature
18
6.9.
Pause Button for PBX/Long Distance Service Users 18
6.10. Setting Call Restriction
18
6.11. Turning Call BAR On/Off (Call Prohibition)
19
6.12. Changing the Display Language
19
6.13. Changing the Recall Time
19
6.14. ARS (Automatic Route Selection)
19
7 DISPLAY
21
7.1.
Display Icons
21
7.2.
Menu Icons
21
7.3.
AOH and Caller ID Display
22
7.4.
Screen Saver Mode
22
8 OPERATIONS
23
8.1.
Turning the Power On/Off
23
8.2.
Setting the Date and Time
23
8.3.
Redialling
23
8.4.
Phonebook
24
8.5.
Registering a Handset to a Base Unit
28
8.6.
Selecting a Base Unit
29
9 ANSWERING SYSTEM
30
9.1.
Turning the Answering System On/Off
30
9.2.
Greeting Message
30
9.3.
Listening to Messages
30
9.4.
Using Direct Commands
31
9.5.
Remote Operation
32
10 TROUBLESHOOTING
33
11 DISASSEMBLY INSTRUCTIONS
36
11.1. Base Unit
36
11.2. Handset
37
11.3. Charger Unit
38
12 ASSEMBLY INSTRUCTIONS
39
12.1. Fix the LCD to the Main P.C.Board (Handset)
39
13 TROUBLESHOOTING FLOWCHART
40
13.1. Check Power
41
13.2. Check Battery Charge
42
13.3. Check Link
43
13.4. Check Handset Transmission
47
13.5. Check Handset Reception
47
13.6. Check Caller ID
47
13.7. Bell Reception
48
13.8. Check TAM Operation
48
14 TROUBLESHOOTING BY SYMPTOM (BASE UNIT AND
CHARGER UNIT)
49
14.1. Check Point (Base Unit)
49
14.2. The Setting Method of JIG (Base Unit)
53
14.3. Adjustment Standard (Base Unit)
54
14.4. Check Point (Charger Unit)
55
14.5. Adjustment Standard (Charger Unit)
55
15 TROUBLESHOOTING BY SYMPTOM (HANDSET)
56
15.1. Check Point (Handset)
56
15.2. Troubleshooting for Speakerphone
59
15.3. The Setting Method of JIG (Handset)
60
15.4. Adjustment Standard (Handset)
61
16 THINGS TO DO AFTER REPLACING IC
62
16.1. Base Unit
62
Note:
Because CONTENTS 4 to 11 are the extracts from the Operating Instructions of this model, they are subject to change without
notice. Please refer to the original Operating Instructions for further information.
notice. Please refer to the original Operating Instructions for further information.
CONTENTS
Page
Page
2
KX-TCD325UA / KX-TCA132UA / KX-TCA130UA
16.2. Handset
62
17 RF SPECIFICATION
63
17.1. Base Unit
63
17.2. Handset
63
18 HOW TO CHECK THE HANDSET SPEAKER OR RECEIVER 64
19 FREQUENCY TABLE (MHz)
64
20 BLOCK DIAGRAM (BASE UNIT)
65
21 CIRCUIT OPERATION (BASE UNIT)
66
21.1. Outline
66
21.2. Power Supply Circuit
67
21.3. Telephone Line Interface
68
21.4. Transmitter/Receiver
68
21.5. Pulse Dialling
68
22 BLOCK DIAGRAM (HANDSET)
69
23 CIRCUIT OPERATION (HANDSET)
70
23.1. Outline
70
23.2. Power Supply Circuit/Reset Circuit
70
23.3. Charge Circuit
70
23.4. Battery Low/Power Down Detector
70
23.5. Speakerphone
70
24 CIRCUIT OPERATION (CHARGER UNIT)
71
24.1. Power Supply Circuit
71
25 SIGNAL ROUTE
72
26 CPU DATA (BASE UNIT)
74
26.1. IC8 (BBIC)
74
27 CPU DATA (HANDSET)
76
27.1. IC1 (BBIC)
76
28 ENGINEERING MODE
78
28.1. Base Unit
78
28.2. Handset
81
29 EEPROM LAYOUT (BASE UNIT)
83
29.1. Scope
83
29.2. Introduction
83
29.3. EEPROM Layout
83
30 EEPROM LAYOUT (HANDSET)
88
30.1. Scope
88
30.2. Introduction
88
30.3. EEPROM contents
88
31 HOW TO REPLACE THE FLAT PACKAGE IC
91
31.1. PREPARATION
91
31.2. FLAT PACKAGE IC REMOVAL PROCEDURE
91
31.3. FLAT PACKAGE IC INSTALLATION PROCEDURE
92
31.4. BRIDGE MODIFICATION PROCEDURE
92
32 CABINET AND ELECTRICAL PARTS (BASE UNIT)
93
33 CABINET AND ELECTRICAL PARTS (HANDSET)
94
34 CABINET AND ELECTRICAL PARTS (CHARGER UNIT)
95
35 ACCESSORIES AND PACKING MATERIALS
96
35.1. KX-TCD325UAF/UAS/UAT
96
35.2. KX-TCA130UAF/UAS/UAT
97
36 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES
98
36.1. Base Unit
98
36.2. Handset
98
36.3. Charger Unit
98
37 REPLACEMENT PARTS LIST
99
37.1. Base Unit
99
37.2. Handset
101
37.3. Charger Unit
102
37.4. Accessories and Packing Materials
103
37.5. Fixtures and Tools
103
38 FOR SCHEMATIC DIAGRAM
104
38.1. Base Unit (SCHEMATIC DIAGRAM (BASE UNIT))
104
38.2. Handset (SCHEMATIC DIAGRAM (HANDSET))
104
38.3. Charger Unit (SCHEMATIC DIAGRAM (CHARGER UNIT))
104
38.4. Memo
105
39 SCHEMATIC DIAGRAM (BASE UNIT)
106
40 SCHEMATIC DIAGRAM (HANDSET)
108
41 SCHEMATIC DIAGRAM (CHARGER UNIT)
110
42 CIRCUIT BOARD (BASE UNIT)
111
42.1. Component View
111
42.2. Flow Solder Side View
112
43 CIRCUIT BOARD (HANDSET)
113
43.1. Component View
113
43.2. Flow Solder Side View
114
44 CIRCUIT BOARD (CHARGER UNIT)
115
44.1. Component View
115
44.2. Flow Solder Side View
115
3
KX-TCD325UA / KX-TCA132UA / KX-TCA130UA
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
· PbF solder has a melting point that is 50°F ~ 70°F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
be careful not to heat too long.
· PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F (600°C).
· If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
· If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
and be sure that any remaining is melted prior to applying the Pb solder.
· When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
1.1. Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
4
KX-TCD325UA / KX-TCA132UA / KX-TCA130UA
