Read Panasonic KX-TCD305UA / KX-TCD307UA / KX-TCA130UA Service Manual online
2005 Panasonic Communications
KX-TCD305UA
KX-TCD307UA
KX-TCA130UA
Digital Cordless Phone
UAF-Blue Metic Version
UAS-Silver Version
UAT-Titanium Black Version
UAS-Silver Version
UAT-Titanium Black Version
(for Ukraine)
Telephone Equipment
ORDER NO. KM40501590CE
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
4
1.1.
Suggested PbF Solder
4
1.2.
How to Recognize that Pb Free Solder is Used
5
2 FOR SERVICE TECHNICIANS
6
3 CAUTION
6
4 BATTERY
7
4.1.
Battery Installation
7
4.2.
Battery Charge
7
4.3.
Battery Life
7
4.4.
Battery Replacement
8
5 LOCATION OF CONTROLS
9
5.1.
Base Unit
9
5.2.
Handset
9
6 SETTINGS
11
6.1.
Connections
12
6.2.
Guide to Settings
13
6.3.
Ringer Volume
14
6.4.
Night Mode
15
6.5.
PIN Code
16
6.6.
Reset
17
6.7.
Key Lock
19
6.8.
R Button to Use the Recall Feature
19
6.9.
Pause Button for PBX/Long Distance Service Users 19
6.10. Setting Call Restriction
19
6.11. Turning Call BAR On/Off
20
6.12. Changing the Display Language
20
6.13. Changing the Recall Time
20
6.14. Setting Dialling Mode (tone/pulse)
21
6.15. ARS (Automatic Route Selection)
22
7 DISPLAY
24
7.1.
Display Icons
24
7.2.
Menu Icons
24
7.3.
AOH and Caller ID Display
24
7.4.
Screen Saver Mode
25
8 OPERATIONS
26
8.1.
Turning the Power On/Off
26
8.2.
Setting the Date and Time
26
8.3.
Redialling
26
8.4.
Phonebook
27
8.5.
Registering a Handset to a Base Unit
31
8.6.
Selecting a Base Unit
32
9 TROUBLESHOOTING
33
10 DISASSEMBLY INSTRUCTIONS
35
10.1. Base Unit
35
10.2. Handset
36
10.3. Charger Unit
37
11 ASSEMBLY INSTRUCTIONS
38
11.1. Fix the LCD to the Main P.C.Board (Handset)
38
12 TROUBLESHOOTING FLOWCHART
39
12.1. Check Power
40
12.2. Check Battery Charge
41
12.3. Check Link
42
12.4. Check Handset Transmission
46
12.5. Check Handset Reception
46
12.6. Check Caller ID
46
12.7. Bell Reception
47
13 TROUBLESHOOTING BY SYMPTOM (BASE UNIT AND
CHARGER UNIT)
48
13.1. Check Point (Base Unit)
48
13.2. The Setting Method of JIG (Base Unit)
52
13.3. Adjustment Standard (Base Unit)
53
13.4. Check Point (Charger Unit)
54
13.5. Adjustment Standard (Charger Unit)
54
14 TROUBLESHOOTING BY SYMPTOM (HANDSET)
55
14.1. Check Point (Handset)
55
14.2. Troubleshooting for Speakerphone
58
14.3. The Setting Method of JIG (Handset)
59
14.4. Adjustment Standard (Handset)
60
15 THINGS TO DO AFTER REPLACING IC
61
15.1. Base Unit
61
15.2. Handset
61
16 RF SPECIFICATION
62
16.1. Base Unit
62
16.2. Handset
62
Note:
Because CONTENTS 4 to 10 are the extracts from the Operating Instructions of this model, they are subject to change without
notice. Please refer to the original Operating Instructions for further information.
notice. Please refer to the original Operating Instructions for further information.
CONTENTS
Page
Page
2
KX-TCD305UA / KX-TCD307UA / KX-TCA130UA /
17 HOW TO CHECK THE HANDSET SPEAKER OR RECEIVER 63
18 FREQUENCY TABLE (MHz)
63
19 BLOCK DIAGRAM (BASE UNIT)
64
20 CIRCUIT OPERATION (BASE UNIT)
65
20.1. Outline
65
20.2. Power Supply Circuit
66
20.3. Telephone Line Interface
67
20.4. Transmitter/Receiver
67
20.5. Pulse Dialling
67
21 BLOCK DIAGRAM (HANDSET)
68
22 CIRCUIT OPERATION (HANDSET)
69
22.1. Outline
69
22.2. Power Supply Circuit/Reset Circuit
69
22.3. Charge Circuit
69
22.4. Battery Low/Power Down Detector
69
22.5. Speakerphone
69
23 CIRCUIT OPERATION (CHARGER UNIT)
70
23.1. Power Supply Circuit
70
24 SIGNAL ROUTE
71
25 CPU DATA (BASE UNIT)
72
25.1. IC8 (BBIC)
72
26 CPU DATA (HANDSET)
74
26.1. IC1 (BBIC)
74
27 ENGINEERING MODE
76
27.1. Base Unit
76
27.2. Handset
79
28 EEPROM LAYOUT (BASE UNIT)
81
28.1. Scope
81
28.2. Introduction
81
28.3. EEPROM Layout
81
29 EEPROM LAYOUT (HANDSET)
88
29.1. Scope
88
29.2. Introduction
88
29.3. EEPROM contents
88
30 HOW TO REPLACE FLAT PACKAGE IC
91
30.1. PREPARATION
91
30.2. FLAT PACKAGE IC REMOVALPROCEDURE
91
30.3. FLAT PACKAGE IC INSTALLATION PROCEDURE
92
30.4. BRIDGE MODIFICATION PROCEDURE
92
31 CABINET AND ELECTRICAL PARTS LOCATION (BASE UNIT)
93
32 CABINET AND ELECTRICAL PARTS LOCATION (HANDSET) 94
33 CABINET AND ELECTRICAL PARTS LOCATION (CHARGER
UNIT)
95
34 ACCESSORIES AND PACKING MATERIALS
96
34.1. KX-TCD305UAF/UAS/UAT
96
34.2. KX-TCD307UAS/UAT
97
34.3. KX-TCA130UAF/UAS/UAT
98
35 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES
99
35.1. Base Unit
99
35.2. Handset
99
35.3. Charger Unit
99
36 REPLACEMENT PARTS LIST
100
36.1. Base Unit
100
36.2. Handset
102
36.3. Charger Unit
103
36.4. Accessories and Packing Materials
104
36.5. Fixtures and Tools
104
37 FOR SCHEMATIC DIAGRAM
105
37.1. Base Unit (SCHEMATIC DIAGRAM (BASE UNIT))
105
37.2. Handset (SCHEMATIC DIAGRAM (HANDSET))
105
37.3. Charger Unit (SCHEMATIC DIAGRAM (CHARGER UNIT))
105
38 SCHEMATIC DIAGRAM (BASE UNIT)
106
39 SCHEMATIC DIAGRAM (HANDSET)
108
40 SCHEMATIC DIAGRAM (CHARGER UNIT)
110
41 CIRCUIT BOARD (BASE UNIT)
111
41.1. Component View
111
41.2. Flow Solder Side View
112
42 CIRCUIT BOARD (HANDSET)
113
42.1. Component View
113
42.2. Flow Solder Side View
114
43 CIRCUIT BOARD (CHARGER UNIT)
115
43.1. Component View
115
43.2. Flow Solder Side View
115
3
KX-TCD305UA / KX-TCD307UA / KX-TCA130UA /
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
· PbF solder has a melting point that is 50°F ~ 70°F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
be careful not to heat too long.
· PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F (600°C).
· If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
· If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
and be sure that any remaining is melted prior to applying the Pb solder.
· When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
1.1. Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.
4
KX-TCD305UA / KX-TCD307UA / KX-TCA130UA /
