Read Panasonic KX-TCD325RU / KX-TCA132RU / KX-TCA130RU Service Manual online
2005 Panasonic Communications
KX-TCD325RU
KX-TCA132RU
KX-TCA130RU
Digital Cordless Answering System
RUF-Blue Metic Version
RUS-Silver Version
RUT-Titanium Black Version
RUS-Silver Version
RUT-Titanium Black Version
(for Russia)
Telephone Equipment
ORDER NO. KM40503646CE
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
4
1.1.
Suggested PbF Solder
4
1.2.
How to recognize that Pb Free solder is used
5
2 FOR SERVICE TECHNICIANS
6
3 CAUTION
6
4 BATTERY
7
4.1.
Battery Installation
7
4.2.
Battery Charge
7
4.3.
Battery Life
8
4.4.
Battery Replacement
8
5 LOCATION OF CONTROLS
9
5.1.
Base Unit
9
5.2.
Handset
9
6 SETTINGS
11
6.1.
Connections
12
6.2.
Guide to Settings
13
6.3.
Ringer Volume
15
6.4.
Night Mode
15
6.5.
PIN Code
16
6.6.
Reset
17
6.7.
Key Lock
18
6.8.
R Button to Use the Recall Feature
18
6.9.
Pause Button for PBX/Long Distance Service Users 18
6.10. Setting Call Restriction
18
6.11. Turning Call BAR On/Off (Call Prohibition)
19
6.12. Changing the Display Language
19
6.13. Setting Dialling Mode (tone/pulse)
19
6.14. Changing the Recall Time
20
6.15. ARS (Automatic Route Selection)
20
7 DISPLAY
22
7.1.
Display Icons
22
7.2.
Menu Icons
22
7.3.
AOH and Caller ID Display
23
7.4.
Screen Saver Mode
23
8 OPERATIONS
24
8.1.
Turning the Power On/Off
24
8.2.
Setting the Date and Time
24
8.3.
Redialling
24
8.4.
Calling Code
25
8.5.
Voice AOH
26
8.6.
Phonebook
26
8.7.
Registering a Handset to a Base Unit
31
8.8.
Selecting a Base Unit
32
9 ANSWERING SYSTEM
33
9.1.
Turning the Answering System On/Off
33
9.2.
Greeting Message
33
9.3.
Listening to Messages
33
9.4.
Using Direct Commands
34
9.5.
Remote Operation
35
10 TROUBLESHOOTING
36
11 DISASSEMBLY INSTRUCTIONS
39
11.1. Base Unit
39
11.2. Handset
40
11.3. Charger Unit
41
12 ASSEMBLY INSTRUCTIONS
42
12.1. Fix the LCD to the Main P.C.Board (Handset)
42
13 TROUBLESHOOTING FLOWCHART
43
13.1. Check Power
44
13.2. Check Battery Charge
45
13.3. Check Link
46
13.4. Check Handset Transmission
50
13.5. Check Handset Reception
50
13.6. Check Caller ID
50
13.7. Bell Reception
51
13.8. Check TAM Operation
51
14 TROUBLESHOOTING BY SYMPTOM (BASE UNIT AND
CHARGER UNIT)
52
14.1. Check Point (Base Unit)
52
14.2. The Setting Method of JIG (Base Unit)
56
14.3. Adjustment Standard (Base Unit)
57
14.4. Check Point (Charger Unit)
58
14.5. Adjustment Standard (Charger Unit)
58
15 TROUBLESHOOTING BY SYMPTOM (HANDSET)
59
15.1. Check Point (Handset)
59
15.2. Troubleshooting for Speakerphone
62
15.3. The Setting Method of JIG (Handset)
63
Note:
Because CONTENTS 4 to 11 are the extracts from the Operating Instructions of this model, they are subject to change without
notice. Please refer to the original Operating Instructions for further information.
notice. Please refer to the original Operating Instructions for further information.
CONTENTS
Page
Page
2
KX-TCD325RU / KX-TCA132RU / KX-TCA130RU
15.4. Adjustment Standard (Handset)
64
16 THINGS TO DO AFTER REPLACING IC
65
16.1. Base Unit
65
16.2. Handset
65
17 RF SPECIFICATION
66
17.1. Base Unit
66
17.2. Handset
66
18 HOW TO CHECK THE HANDSET SPEAKER OR RECEIVER 67
19 FREQUENCY TABLE (MHz)
67
20 BLOCK DIAGRAM (BASE UNIT)
68
21 CIRCUIT OPERATION (BASE UNIT)
69
21.1. Outline
69
21.2. Power Supply Circuit
70
21.3. Telephone Line Interface
71
21.4. Transmitter/Receiver
71
21.5. Pulse Dialling
71
22 BLOCK DIAGRAM (HANDSET)
72
23 CIRCUIT OPERATION (HANDSET)
73
23.1. Outline
73
23.2. Power Supply Circuit/Reset Circuit
73
23.3. Charge Circuit
73
23.4. Battery Low/Power Down Detector
73
23.5. Speakerphone
73
24 CIRCUIT OPERATION (CHARGER UNIT)
74
24.1. Power Supply Circuit
74
25 SIGNAL ROUTE
75
26 CPU DATA (BASE UNIT)
77
26.1. IC8 (BBIC)
77
27 CPU DATA (HANDSET)
79
27.1. IC1 (BBIC)
79
28 ENGINEERING MODE
81
28.1. Base Unit
81
28.2. Handset
84
29 EEPROM LAYOUT (BASE UNIT)
86
29.1. Scope
86
29.2. Introduction
86
29.3. EEPROM Layout
86
30 EEPROM LAYOUT (HANDSET)
91
30.1. Scope
91
30.2. Introduction
91
30.3. EEPROM contents
91
31 HOW TO REPLACE THE FLAT PACKAGE IC
94
31.1. PREPARATION
94
31.2. FLAT PACKAGE IC REMOVAL PROCEDURE
94
31.3. FLAT PACKAGE IC INSTALLATION PROCEDURE
95
31.4. BRIDGE MODIFICATION PROCEDURE
95
32 CABINET AND ELECTRICAL PARTS (BASE UNIT)
96
33 CABINET AND ELECTRICAL PARTS (HANDSET)
97
34 CABINET AND ELECTRICAL PARTS (CHARGER UNIT)
98
35 ACCESSORIES AND PACKING MATERIALS
99
35.1. KX-TCD325RUF/RUS/RUT
99
35.2. KX-TCA130RUF/RUS/RUT
100
36 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES
101
36.1. Base Unit
101
36.2. Handset
101
36.3. Charger Unit
101
37 REPLACEMENT PARTS LIST
102
37.1. Base Unit
102
37.2. Handset
104
37.3. Charger Unit
105
37.4. Accessories and Packing Materials
106
37.5. Fixtures and Tools
106
38 FOR SCHEMATIC DIAGRAM
107
38.1. Base Unit (SCHEMATIC DIAGRAM (BASE UNIT))
107
38.2. Handset (SCHEMATIC DIAGRAM (HANDSET))
107
38.3. Charger Unit (SCHEMATIC DIAGRAM (CHARGER UNIT))
107
39 SCHEMATIC DIAGRAM (BASE UNIT)
108
40 SCHEMATIC DIAGRAM (HANDSET)
110
41 SCHEMATIC DIAGRAM (CHARGER UNIT)
112
42 CIRCUIT BOARD (BASE UNIT)
113
42.1. Component View
113
42.2. Flow Solder Side View
114
43 CIRCUIT BOARD (HANDSET)
115
43.1. Component View
115
43.2. Flow Solder Side View
116
44 CIRCUIT BOARD (CHARGER UNIT)
117
44.1. Component View
117
44.2. Flow Solder Side View
117
3
KX-TCD325RU / KX-TCA132RU / KX-TCA130RU
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
· PbF solder has a melting point that is 50°F ~ 70°F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
be careful not to heat too long.
· PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F (600°C).
· If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
· If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
and be sure that any remaining is melted prior to applying the Pb solder.
· When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
1.1. Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
4
KX-TCD325RU / KX-TCA132RU / KX-TCA130RU
